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China CIS firms gain domestic market share with local foundry, backend support

Support from local foundries and backend houses in China is helping CMOS image sensor (CIS) firms obtain more orders, reducing the country's reliance on Sony, according to industry sources.

Credit: Smartsens Technology

China's pursuit of self-sufficiency in chipmaking equipment hurts Taiwan exports

Taiwan's chipmaking tool exports, which prioritize the market in China, have been impacted by China's increased efforts to achieve self-sufficiency in semiconductor equipment.

Credit: DIGITIMES

AUO business transformation seeks to lower regular panel sales to 70% of overall revenue

AUO is transforming its business structure, aiming to lower regular display panel sales to below 70% of overall company revenue in 2025, according to company chairman Paul Peng.

Credit: DIGITIMES

ChipMOS raises capex for high-end DDI backend demand

Backend house ChipMOS Technologies has made upward revisions to its capex for the second half of 2024 in response to strong demand for high-end Display Driver ICs (DDI), according to the company.

Credit: DIGITIMES

Apple said to have signed pact with Samsung Display for foldable devices

Apple reportedly has struck an agreement with South Korean panel supplier Samsung Display (SDC) for the development of foldable devices, according to speculation from the supply chain, according to industry sources.

Credit: AFP

ChipMOS raises capex for high-end DDI backend demand

Backend house ChipMOS Technologies has made upward revisions to its capex for the second half of 2024 in response to strong demand for high-end Display Driver ICs (DDI), according to the company.

Credit: DIGITIMES

Apple said to have signed pact with Samsung Display for foldable devices

Apple reportedly has struck an agreement with South Korean panel supplier Samsung Display (SDC) for the development of foldable devices, according to speculation from the supply chain, according to industry sources.

Credit: AFP

Chinese foundry to set up production line for HBM memory

Wuhan Xinxin Semiconductor Manufacturing (XMC) reportedly has sent out an invitation to bid for a high-bandwidth memory (HBM) project. This suggests that the Chinese memory sector, led by Yangtze Memory Technology (YMTC), is placing HBM at the forefront of its future development strategies, according to industry sources in China.

Credit: AFP

TSMC ramping up CoWoS capacity

TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which in turn is boosting server and graphics card shipments from Taiwanese makers, according to industry sources.

Credit: DIGITIMES

Huawei to open CNY12 billion R&D center in Shanghai

Huawei is building a new R&D center in Shanghai, with completion scheduled for June and an opening in September. The overall investment in the facility is projected to be approximately CNY12 billion (NT$1.67 billion), according to industry sources in China.

Credit: Shanghai Qingpu Government

IC test interface provider CHPT conservative about 2024 chip market

Chunghwa Precision Test Tech (CHPT), an IC test interface solutions provider, expressed caution about the global semiconductor market this year, predicting that only the top players may perform well, and the rest may find 2024 as difficult as 2023.

Credit: DIGITIMES
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