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TSMC maintains steady pace in EU fab expansion as competitors slow projects

Many chipmakers have disclosed delays or suspensions in their new European fab projects; however, TSMC's are proceeding more efficiently than those of their competitors.

TSMC Chairman C. C. Wei welcomes German Chancellor Olaf Scholz at Dresden plant. Credit: DIGITIMES

China foundries prioritize mature nodes for capacity growth, limiting capacity for NOR flash

China-based foundries are rapidly expanding their capacity for mature logic IC processes, limiting local NOR production capability. As a result, global NOR flash supply and demand are close to equilibrium, with supply expected to be constrained in 2025, according to industry sources.

Credit: DIGITIMES

What's behind Nvidia's delay in launching Blackwell AI platform bulk shipments?

Since late July, there have been numerous speculations in the market that Nvidia's new generation Blackwell series roadmap has been adjusted. Reports suggest that the B100 models will be phased out, while the B200A will be launched as a degraded version. The B200 and GB200 releases will reportedly be postponed by one quarter.

Credit: DIGITIMES

Samsung HBM3E soon to be qualified with shipments kicking off as early as August

Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to industry sources.

Credit: DIGITIMES

Innolux, OSATs stepping up FOPLP deployment

In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics, and Intel in the advanced packaging field.

Credit: DIGITIMES

AMD CEO: AI will dominate and Taiwan will matter

On June 7, AMD chairperson and CEO Lisa Su engaged in a dialogue on Artificial Intelligence (AI), accompanied by Acer chairman and CEO Jason Chen. Su talked about the importance of AI and the role Taiwan's industry supply chains will play.

Credit: DIGITIMES

DRAM spot prices to rise alongside contract prices after August

DRAM spot prices will resume the same growth trend as contract prices after August, according to sources at Taiwan-based memory module manufacturers, who are optimistic about their operations in the second half of this year.

Credit: DIGITIMES

Adata remains bullish about DRAM prices in 2H24

Despite a short-term correction in spot market prices for DRAM memory, contract prices will continue to rise in the second half of the year, according to memory module manufacturer Adata Technology.

Credit: DIGITIMES

Nvidia CEO engages significant Taiwanese CEOs to promote local AI supply chain

Nvidia CEO Jensen Huang revealed two months ago, at a dinner party for Taiwanese partners in Silicon Valley, that he considers himself Taiwan's ambassador. Taiwan is positioned as a key player in the AI revolution, and all Taiwanese businesses must be prepared to effectively tell the "Taiwan story" to the rest of the world.

Credited: from reader

IC distributor Supreme upbeat about 2Q24

Supreme Electronics, which mostly sells memory chips, is optimistic about its operations in the second quarter of 2024, noting a seasonal increase in demand for handsets and PCs, as well as ongoing server demand strength.

Credit: Supreme Electronics

Macronix sees orders regain momentum

ROM and flash memory maker Macronix International stayed in the red in the first quarter of 2024 with net losses amounting to NT$1.08 billion (US$33.2 million). Nevertheless, the chipmaker has seen overall client orders regain strength, according to company chairman Miin Wu.

Credit: DIGITIMES

Intel Foundry completes assembly of ASML High-NA EUV tools

Intel recently announced that its foundry operations, Intel Foundry, achieved a significant milestone in advanced semiconductor manufacturing by completing the assembly of the industry's first commercial high-numerical aperture extreme ultraviolet (High-NA EUV) lithography equipment, which is located at the company's R&D campus in Hillsboro, Oregon.

Credit: ASML

Foxconn to still reap benefits despite Apple's shift away from EVs

Rumors persist that Apple is interested in investing in the development of the Apple Car. Recent speculations suggest that Project Titan, which has never been officially confirmed, might be terminated. According to industry sources, Apple's current main contract assembler, Hon Hai Technology Group (Foxconn), is not expected to be greatly affected despite its increasing emphasis on electric vehicles (EVs).

Credit: DIGITIMES

TSMC co-COOs could be a stepping stone to new leadership, say sources

With TSMC's announcement in December 2023 that chairman Mark Liu will step down after the shareholder meeting in June 2024, the pure-play foundry has begun a new round of organizational restructuring.

Credit: DIGITIMES

Fitipower expects AI to boost peripheral IC demand

IC design house Fitipower Integrated Technology anticipates that demand for peripheral ICs including display driver ICs and power management chips will be driven by AI and HPC device applications in 2024.

Credit: DIGITIMES

MCU suppliers see inventory pressure lessen; demand recovery remains essential

Inventory concerns that previously plagued Taiwanese MCU makers have gradually subsided over the last two quarters, but industry sources say the key question now is whether demand will resume.

Credit: DIGITIMES

Intel to adopt high-NA EUV in 14A process manufacturing

At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more advanced processes between 2025 and 2027, including its first high-NA EUV process, 14A.

Credit: Intel

ESMT sees DDR4, AI drive 2024 growth

Niche memory IC design house Elite Semiconductor Memory Technology (ESMT) has stated that it is working on new AI product projects that will be a new growth engine, and demand for DDR4 products will increase this year.

Credit: DIGITIMES

Chinese tier-1 SiC substrate suppliers launch price war

China considers the third generation of semiconductors as the dominant industry that can outperform its global competitors. The silicon carbide (SiC) industry achieved significant long-term purchase agreements with several international automotive IDMs in 2023, thanks to government support spanning a decade. China plans to commence a price competition in 2024, as reported by sources within the supply chain.

Credit: DIGITIMES
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