With the surge in demand for generative AI training over the past few quarters, Nvidia's performance has shown a significant leap, benefiting various supply chain players and emerging as the world's largest semiconductor company by revenue. The industry's critical turning point has arrived!
Nvidia Corp. surged in late trading after delivering another eye-popping sales forecast, adding fresh momentum to a stock rally that already made it the world's most valuable chipmaker.
Following a significant drop in sales of BT substrates and midrange ABF substrates in 2023 amid sluggish post-pandemic consumer electronics demand, Taiwan's Unimicron Technology is expected to recover growth momentum in 2024 from the surging demand for high-end ABF substrates used in AI chips packaging.
The EU Batteries Regulation, which came into force on February 18, 2024, mandates that new batteries must incorporate a specified proportion of recycled materials beginning in 2031. Originally projected to be below 4GWh by 2025, this legislation is poised to escalate Europe's battery recycling capacity to 200GWh by 2040, catalyzing scrutiny of the battery resource utilization market within the continent and prompting keen interest from stakeholders in South Korea.
In 2023, AI took the global tech scene by storm, not just lighting up the tech industry's dim outlook but also emerging as a linchpin for supply chain players eyeing a market resurgence.
Taiwan's machinery and electronics manufacturing sectors are rapidly integrating into a "mechatronics supply chain," with a dedicated "precision machinery zone" to be launched at SEMICON Taiwan 2024 and slated for early September. The initiative aims to facilitate Taiwanese machinery manufacturers' entry into the semiconductor industry, initially focusing on supplying semiconductor backend process machines and inspection and measurement equipment, with the long-term goal of achieving import substitution, according to the Taiwan Association of Machinery Industry (TAMI).
As the world moves towards carbon neutrality, hydrogen emerges as a focal point for future energy development. Electrolysis, the process behind green hydrogen production, stands as a crucial avenue in this endeavor, with related equipment presenting a prime opportunity for market entry. Notably, China, Germany, and Japan are aggressively positioning themselves at the forefront of the upstream hydrogen equipment market.
Recent reports speculated that Apple might introduce its latest budget model, the iPhone SE 4, in 2025. It'll be equipped with the iPhone 14 OLED panel. Because the iPhone 14 OLED is considered a more mature product, Chinese manufacturers like BOE are expected to actively compete with Samsung Display (SDC) for the supply opportunity.
On February 24, TSMC will hold an opening ceremony for its first fabrication facility in Japan, located in Kumamoto. The fab is scheduled to go online at the end of 2024.
Following an agreement for an integrated facility in Tamil Nadu, Vietnam-based VinFast said it would begin constructing the EV facility, a big step for the company on its way to the global foray.
Microsoft recently unveiled its predictions for AI trends, emphasizing three key areas: small language models, multimodal AI, and scientific applications.
Leading in the high-bandwidth memory (HBM) market, SK Hynix aims to maintain its technological competitiveness by unveiling its industry-leading HBM3E technology, which stacks 16 layers of DRAM.
South Korean industry sources suggest that Samsung Electronics is divesting all of its remaining ASML shares, expecting to realize profits eight times the initial investment amount. The funds obtained from this divestment are likely to be reinvested in the emerging semiconductor sector.
IC design house Fitipower Integrated Technology anticipates that demand for peripheral ICs including display driver ICs and power management chips will be driven by AI and HPC device applications in 2024.
AUO is accelerating its efforts in MicroLED technology to secure a leading position in the next-generation display market. The company anticipates its automotive products to enter mass production between 2026 -2027. Industry sources reveal that AUO's clients in the automotive industry include major automotive manufacturers such as BMW, Audi, and Mercedes-Benz.
Inventory concerns that previously plagued Taiwanese MCU makers have gradually subsided over the last two quarters, but industry sources say the key question now is whether demand will resume.
At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more advanced processes between 2025 and 2027, including its first high-NA EUV process, 14A.
Holtek Semiconductor, a Taiwan-based MCU specialist, anticipates a 50% increase in revenue from the Indian market in 2024 and plans to expand its operations in the country.
At a forum held during the Taipei International Book Exhibition 2024, DIGITIMES President Colley Hwang, a senior semiconductor industry expert, imparted a million-dollar information that competitors of the Taiwan Semiconductor Manufacturing Company (TSMC) would strive to get.
According to sources at IC design houses, mobile phone manufacturers, such as Samsung Electronics, are reportedly increasing their SoC procurements to build up inventory as the AI smartphone trend grows.
Despite delays in grants offered by the US government and weak demands for end products that hurt global semiconductor firms, US states are likely to benefit from the onshoring chip ecosystem, and the US may witness surging investments in semiconductors as a share of the manufacturing industry.
Major cloud service providers (CSPs) are constantly updating their generative AI technology services and investing in corporate applications scenarios. In addition to large language models (LLMs), CSPs emphasize a stack service that covers everything from underlying infrastructure and development platforms to end-user applications. While CSPs share some strategies, they also each face different challenges.
Demand for foldable smartphones continues to surge as companies like Samsung Electronics, Huawei, and Oppo release new products, significantly boosting market sales and leading to exponential growth in the demand for ultra-thin glass (UTG).
Leading server baseboard management controller (BMC) supplier Aspeed predicts a single-digit slide in server shipments for 2024, in contrast with forecasts from numerous server ODMs anticipating a rebound in shipment numbers. In particular, according to most forecasts, shipments of general-purpose servers will see single-digit growth, while AI server shipments will double.
The government of Vietnam decided to ramp up support for the semiconductor industry and announced plans to roll out a series of tax incentives and set up investment funds by mid-2024 to bolster the industry.
According to Young Liu, chairman of Hon Hai Technology (Foxconn), the Taiwan-based contract electronics vendor collaboration with Apple will be more extensive.
As smartphone makers continue to commit to foldable phones, all eyes are on Apple's expected efforts in this space. However, recent signals have been mixed as some sources believe Apple has halted development due to quality issues, while others point to a 2026 launch for Apple's foldables. According to Taiwan-based supply chain sources, Apple has been developing foldables for the past five years, and its first foldable product will not be a smartphone. It will instead be a larger device.
GenAI technology has presented both the United States and Japan with challenges and opportunities, leading the two nations to join hands in developing new advancements in the field.
MediaTek will showcase chip products focusing on satellite communications, 6G, and generative AI (GenAI) at the upcoming Mobile World Congress (MWC) in Barcelona, Spain.
Nvidia, an indicator and beneficiary of the generative AI trend, achieved remarkable performance with a surge in sales and profits, boasting over 200-800% growth rates. Nvidia has become the second-largest semiconductor firm in revenue over the past four quarters.
Huawei is building a new R&D center in Shanghai, with completion scheduled for June and an opening in September. The overall investment in the facility is projected to be approximately CNY12 billion (NT$1.67 billion), according to industry sources in China.
Kaynes SemiCon, a subsidiary of the Indian EMS Kaynes Technology, has entered into a strategic partnership with Recynergy Technology, a Taiwan-based company specializing in semiconductor backend test engineering. This collaboration aims to transfer semiconductor manufacturing technology and supply chain knowledge from Taiwan to India, utilizing the skilled engineering workforce in India to meet local and global semiconductor needs.
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