Enermax, established in 1990, is a renowned Taiwanese company in the PC hardware industry, particularly recognized for its innovative power supply units (PSUs), cooling solutions, and PC cases. Over the years, Enermax has built a reputation for engineering reliable, high-performance PSUs that primarily target enthusiasts and professional users. Their commitment to quality and technological advancement has kept them at the forefront of the industry, constantly evolving to meet the demands of the ever-changing tech landscape.

In this review, we are looking at the latest addition to Enermax's impressive PSU lineup: the Revolution D.F. 12 750W PSU. This is the second ATX 3.1-compliant power supply to arrive in our labs, and, broadly speaking, illustrates how we're approaching the inflection point for PSU vendors to update their designs for Intel's revised PSU standard.

As for the Revolution D.F. 12 itself, Enermax's new PSU pursues a balanced design, meeting modern gaming PCs mid-way with good conversion efficiency and an overall robust power delivery system. With features like fully modular cables with per-wire sleeving, a dynamic hybrid fan control for optimal cooling, and advanced topologies, the Revolution D.F. 12 750W is primed to deliver on both reliability and performance. We will delve into its specifications, build quality, and performance metrics to see if the new unit lives up to Enermax's esteemed legacy.

For Computex week, Micron was at the show in force in order to talk about its latest products across the memory spectrum. The biggest news for the memory company was that it has kicked-off sampling of it's next-gen GDDR7 memory, which is expected to start showing up in finished products later this year and was being demoed on the show floor. Meanwhile, the company is also eyeing taking a much larger piece of the other pillar of the high-performance memory market – High Bandwidth Memory – with aims of capturing around 25% of the premium HBM market.

GDDR7 to Hit the Market Later This Year

Micron's first GDDR7 chip is a 16 Gb memory device with a 32 GT/sec (32Gbps/pin) transfer rate, which is significantly faster than contemporary GDDR6/GDDR6X. As outlined with JEDEC's announcement of GDDR7 earlier this year, the latest iteration of the high-performance memory technology is slated to improve on both memory bandwidth and capacity, with bandwidths starting at 32 GT/sec and potentially climbing another 50% higher to 48 GT/sec by the time the technology reaches its apex. And while the first chips are starting off at the same 2GByte (16Gbit) capacity as today's GDDR6(X) chips, the standard itself defines capacities as high as 64Gbit.

Of particular note, GDDR7 brings with it the switch to PAM3 (3-state) signal encoding, moving from the industry's long-held NRZ (2-state) signaling. As Micron was responsible for the bespoke GDDR6X technology, which was the first major DRAM spec to use PAM signaling (in its case, 4-state PAM4), Micron reckons they have a leg-up with GDDR7 development, as they're already familiar with working with PAM.

The GDDR7 transition also brings with it a change in how chips are organized, with the standard 32-bit wide chip now split up into four 8-bit sub-channels. And, like most other contemporary memory standards, GDDR7 is adding on-die ECC support to hold the line on chip reliability (though as always, we should note that on-die ECC isn't meant to be a replacement for full, multi-chip ECC). The standard also implements some other RAS features such as error checking and scrubbing, which although are not germane to gaming, will be a big deal for compute/AI use cases.

The added complexity of GDDR7 means that the pin count is once again increasing as well, with the new standard adding a further 86 pins to accommodate the data transfer and power delivery changes, bringing it to a total of 266 pins. With that said, the actual package size is remaining unchanged from GDDR5/GDDR6, maintaining that familiar 14mm x 12mm package. Memory manufacturers are instead using smaller diameter balls, as well as decreasing the pitch between the individual solder balls – going from GDDR6's 0.75mm x 0.75mm pitch to a slightly shorter 0.75mm x 0.73mm pitch. This allows the same package to fit in another 5 rows of contacts.

As for Micron's own production plans, the company is using its latest 1-beta (1β) fabrication process. While the major memory manufacturers don't readily publish the physical parameters of their processes these days, Micron believes that they have the edge on density with 1β, and consequently will be producing the densest GDDR7 at launch. And, while more nebulous, the company company believes that 1β will give them an edge in power efficiency as well.

Micron says that the first devices incorporating GDDR7 will be available this year. And while video card vendors remain a major consumer of GDDR memory, in 2024 the AI accelerator market should not be overlooked. With AI accelerators still bottlenecked by memory capacity and bandwidth, GDDR7 is expected to pair very well with inference accelerators, which need a more cost-effective option than HBM.

Micron Hopes to Get to Mid-20% HBM Market Share with HBM3E

Speaking of HBM, Micron was the first company to formally announce its HBM3E memory last year, and it was among the first to start its volume shipments earlier this year. For now, Micron commands a 'mid-single digit' share of this lucrative market, but the company has said that it plans to rapidly gain share. If all goes well, by the middle of its fiscal 2025 (i.e., the end of calendar Q1 2025) the company hopes to capture a mid-20% share of the HBM market.

"As we go into fiscal year 2025, we expect our share of HBM to be very similar to our overall share on general DRAM market," said Praveen Vaidyanathan, vice president and general manager of the Compute Products Group at Micron. "So, I would say mid-20%. […] We believe we have a very strong product as [we see] a lot of interest from various GPU and ASIC vendors, and continuing to engage with customers […] for the next, say 12 to 15 months."

When asked whether Micron can accelerate output of HBM3E at such a rapid pace in terms of manufacturing capacity, Vaidyanathan responded that the company has a roadmap for capacity expansion and that the company would meet the demand for its HBM3E products. 

During Computex 2024, ASRock held an event to unveil some of its upcoming X870E motherboards, designed for AMD's Zen 5-based Ryzen 9000 series processors. ASRock's announcement includes a pair of Taichi-branded boards, the X870E Taichi and the lighter X870E Taichi lite, which uses AMD's X870E (Promontory 21) chipset for AM5.

The current flagship model announced from ASRock's X870E line-up for Ryzen 9000 is the ASRock X870E Taichi. ASRock is advertising a large 27-phase power delivery through 110A SPS, suggesting this board is designed for overclockers and all-around power users. Two PCIe 5.0 x16 slots (operating in either x16/x0 or x8/x8) provide high-speed bandwidth for cutting-edge graphics cards and other devices. Meanwhile, ASRock has gone with 4 DIMM slots on this board, so system builders will be able to max out the board's memory capacity at the cost of bandwidth.

The storage offering is impressive; besides the obligatory PCIe Gen5 x4 M.2 slot (Blazing M.2), ASRock has outfit the board with another three PCIe Gen4 x4 (Hyper) M.2 slots. Also present are two USB4 Type-C ports for high-bandwidth external I/O, while networking support is a solid pairing of a discrete Wi-Fi 7 controller with a Realtek 5Gb Ethernet controller (and the first AM5 board we've come across with something faster than a 2.5GbE controller).

The audio setup includes a Realtek ALC4082 codec and ESS SABRE9218 DAC supporting high-fidelity sound. The BIOS flashback feature is also a nice touch, and we believe this should be a feature on all mid-range to high-end motherboards, which provides an easy way to update the firmware without installing a CPU. And, as no high-end board would be complete without it, ASRock has put RGB lighting on the X870E Taichi as well.

Ultimately, as ASRock's high-end X870E board, the X870E Taichi comes with pretty much every last cutting-edge technology that ASRock can fit on the board.

Comparatively, the ASRock X870E Taichi Lite is a more streamlined and functional version of the X870E Taichi. The Lite retaining all of the latter's key features, including the 27-phase power delivery with 110A smart power stages, dual PCIe 5.0 x16 slots operating at x16 or x8/x8, four DDR5 DIMM slots, and four M.2 slots (1x Gen5 + 3x Gen4). The only significant difference is aesthetics: the Taichi Lite features a simpler silver-themed design without the RGB lighting, while the standard Taichi has a more intricate gold-accented and fanciful aesthetics.

In terms of availability, ASRock is not disclosing a release date for the board at the show. And, checking around with other tech journalists, Andreas Schilling from HawrdwareLUXX has heard that X870E and X870 motherboards aren't expected to be available in time for the Ryzen 9000 series launch. We will investigate this and contact the motherboard vendors to confirm the situation. Though as X870E/X870 boards barely differ from the current crop of X670E/B650E boards to begin with, the Ryzen 9000 series won't be fazed by a lack of slightly newer motherboards.

With the rise of the handheld gaming PC market, we've seen PC vendors and their partners toy with a number of tricks and tweaks to improve improve framerates in games, with some of their latest efforts on display at this year's Computex trade show. Perhaps the most interesting find thus far comes from ADATA sub-brand XPG, who is demoing their prototype "Nia" handheld PC, which uses eye tracking and dynamic foveated rendering to further improve their rendering performance.

For those unfamiliar, dynamic foveated rendering is a graphics technique that is sometimes used to boost performance in virtual reality (VR) and augmented reality (AR) applications by taking advantage of how human vision works. Typically, humans can only perceive detailed imagery in the relatively small central area of our vision called the fovea, while our peripheral vision is much less detailed. Dynamic foveated rendering, in turn, exploits this by using real-time eye tracking to determine where the user is looking, and then rendering just that area in high/full resolution, while rendering the peripheral areas in lower resolution. The net result is that only a fraction of the screen is rendered at full detail, which cuts down on the total amount of rendering work required and boosting framerates on performance-limited devices.

As stated before, this technology is sometimes used in high-end AR/VR headsets, where high resolution displays are placed mere inches from one's face. This ends up being an ideal use case for the technique, since at those distances, only a small fraction of the screen is within the fovea.

Using dynamic foveated rendering for a handheld, on the other hand, is a more novel application. All of the same visual principles apply, but the resolutions at play are lower, and the screen is farther from the users' eyes. This makes a handheld device a less ideal use case, at least on paper, as a larger portion of the screen is going to be in the fovea, and thus will need to be rendered at full resolution. None the less, it will be interesting to see how XPG's efforts pan out, and if dynamic foveated rendering is beneficial enough for handheld PCs. As we sometimes see with trade show demos, not everything makes it out of the prototype stage.

According to a press release put out by ADATA ahead of the trade show, the eye tracking technology is being provided by AMD collaborator Eyeware. Notably, their software-based approach runs on top of standard webcams, rather than requiring IR cameras. So the camera hardware itself should be pretty straight-forward.

Foveated rendering aside, XPG is making sure that the Nia won't be a one-trick pony. The handheld's other major claim to fame is its hardware swappability. The prototype handheld not only features a removable M.2-2230 SSD, but the company is also taking advantage of the recently-introduced LPCAMM2 memory module standard to introduce removable DRAM. Via a hatch in the back of the handheld, device owners would be able to swap out LPCAMM2 LPDDR5X modules for higher capacity versions. This would give the handheld an additional degree of future-proofness over current handhelds, which use non-replaceable soldered-down memory.

Rounding out the package, the current prototype is based on an AMD's Zen 4 Phoenix APU, which is used across both of the company's current mobile lines (Ryzen Mobile 7000/8000 and Ryzen Z1). Meanwhile, the unit's display is adjustable, allowing it to be angled away from the body of the handheld.

Assuming all goes well with the prototype, XPG aims to release a finished product in 2025.

Ultra-high performance memory modules are a staple of of Computex, and it looks like this year G.Skill is showing off the highest performance dual-channel memory module kit to date. The company is demonstrating a DDR5 kit capable of 10,600 MT/s data transfer rate, which is a considerably higher speed compared to memory modules available today.

The dual-channel kit that G.Skill is demonstrating is a 32 GB Trident Z5 RGB kit that uses cherry-picked DDR5 memory devices and which can work in a DDR5-10600 mode with CL56 62-62-126 timings at voltages that are way higher than standard. The demoed DIMMs are running the whole day in a fairly warm room, though it does not really run demanding applications or stress tests.

Traditionally, memory module makers like G.Skill use Intel processors to demonstrate their highest-performing kits. But with the DDR5-10600 kit, the company uses AMD's Ryzen 5 8500G processor, which is a monolithic Zen 4-based APU with integrated graphics that's normally sold for budget systems. The motherboard is a high-end Asus ROG Crosshair X670E Gene and the APU is cooled down using a custom liquid cooling system The Asus ROG Crosshair X670E Gene motherboard has only two memory slots, which greatly helps to enable high data transfer rates, so it is a very good fit for the DDR5-10600 dual-channel kit.

Though I have sincere doubts that someone is going to use an ultra-expensive DDR5-10600 memory kit and related gate with this inexpensive processor, it is interesting (and unexpected) to see an AMD APU as a good fit to demonstrate performance potential of G.Skill's upcoming modules.

Speaking of availability of G.Skill's DDR5-10600 memory, it does not look like this kit is around the corner. The fastest DDR5 kit that G.Skill has today is its DDR5-8400 offering, so the DDR5-10600 will come to market a few speed bins later as G.Skill certainly needs to test the kit with various CPUs and ensure its stability. 

One other thing to keep in mind is that both AMD and Intel are about to release new desktop processors this year, with the Ryzen 9000-series and Arrow Lake processors respectively. So G.Skill will undoubtedly focus on tuning its DDR5-10600 and other high-end kits primarily with those new CPUs.

During the Intel keynote hosted by CEO Pat Gelsinger, he gave the world a glimpse into the Intel Client roadmap until 2026. Meteor Lake launched last year on that roadmap, and Lunar Lake, which we dived into yesterday as Intel disclosed technical details about the upcoming platform. Pat also presented a wafer on stage, Panther Lake, and he gave some additional information about Intel's forthcoming Panther Lake platform, which is expected in 2025.

We covered Intel's initial announcement about the Panther Lake platform last year. It is set to be Intel's first client platform using its Intel 18A node. Aside from once again affirming that things are on track for a 2026 launch, Pat Gelsinger, Intel's CEO, also confirmed that they will be powering on the first 18A wafer for Panther Lake as early as next week.

Intel CPU Architecture Generations
	Alder/Raptor Lake	Meteor Lake	Lunar Lake	Arrow Lake	Panther Lake
P-Core Architecture	Golden Cove/ Raptor Cove	Redwood Cove	Lion Cove	Lion Cove	Cougar Cove?
E-Core Architecture	Gracemont	Crestmont	Skymont	Crestmont?	Darkmont?
GPU Architecture	Xe-LP	Xe-LPG	Xe2	Xe2?	?
NPU Architecture	N/A	NPU 3720	NPU 4	?	?
Active Tiles	1 (Monolithic)	4	2	4?	?
Manufacturing Processes	Intel 7	Intel 4 + TSMC N6 + TSMC N5	TSMC N3B + TSMC N6	Intel 20A + More	Intel 18A + ?
Segment	Mobile + Desktop	Mobile	LP Mobile	HP Mobile + Desktop	Mobile?
Release Date (OEM)	Q4'2021	Q4'2023	Q3'2024	Q4'2024	2025

One element to consider from last year is that Lunar Lake is built using TSMC, with the Lunar Lake compute tile with Xe2-LPG graphics on TSMC N3B, and the I/O tile on TSMC N6. Pat confirmed on stage that Panther Lake will be on Intel 18A. Still, he didn't confirm whether the chip will be made purely at Intel, or a mix between Intel and external foundries (ala Meteor Lake). Intel has also yet to confirm the CPU cores to be used, but from what our sources tell us, it sounds like it will be the new Cougar Cove and Darkmont cores.

As we head into the second half of 2024 and after Lunar Lake launches, Intel may divulge more information, including the architectural advancements Panther Lake is expected to bring. Until then, we will have to wait and see.

In recent months, Frore Systems has been turning heads with their fanless solid-state air cooler technology. The AirJet, as it's come to be called, was previously shown off at CES this year; and for Computex, the company is back with a fresh round of demonstrations.

For the show, Frore has a number of demonstrations running in a fairly large showroom. The company is looking to address a wide range of products, from tablets to notebooks to small PCs, as well as embedded tablets. But there were two showcases in particular that caught my immediate attention: a Samsung Galaxy Book with and without Frore's AirJet, and an 8 TB Sabrent SSD in an external enclosure.

The Samsung Galaxy Book 2 Pro is an ultra-thin notebook that is normally cooled by a fan that, as argued by Flore, does not do its job properly. According to the company, the stock laptop only has enough cooling capacity to sustain 12W heat/power before it hits Tmax, whereas a retrofitted version with Frore's AirJet installed allows it to hold steady-state operation at 16W – and consequently delivering higher performance. In terms of Cinebench R23 multi-threaded results, we are talking about 5330 points for the modded notebook, versus 4255 for the off-the-shelf Galaxy Book 2 Pro.

The potential use cases for Frore Systems's AirJet solid-state cooling technology do not end with CPUs, either. As mentioned previously, the company is also demonstrating the AirJet Mini on Sabrent 8TB SSDs in Orico external enclosures, showcasing the advantage of the silent active cooler over passive cooling. The passively-cooled drive reached 62°C and leveled out at 1,320 MB/s due to thermal throttling. In contrast, the AirJet-cooled drive maintained a temperature of 42°C and achieved a considerably higher performance of 3,016 MB/s.

According to Frore, this significant improvement in both temperature and performance has already led to one major external SSD vendor adopting AirJet technology to improve the performance of their drives. Unfortunately, Frore isn't naming any names, only stating that it's a "big name."

Now, Frore's AirJet Mini and Mini Slim coolers can dissipate up to 5W of power each, and can be combined in to larger blocks of up to 5 coolers (we are talking about announced solutions, technologically scaling could he higher, but this is an entirely different conversation). So the technology does have some scalability limitations that makes it best-suited for lower-power devices. None the less, removing 25W of thermal energy from a modern laptop without a fan can make a huge difference in the performance of these normally passively-cooled devices.

Of course, the main goal for these Computex demos is far more than just showing off AirJets to the public; what Frore would really like to do is to land a deal for its solid-state cooling solution with a major PC vendor (e.g., Apple, Samsung, etc.). Though to do that, Frore has to pass qualification tests and ensure availability of its products, which is something the company says it's currently working on. Meanwhile, from performance point of view, especially given their dimensions, AirJets look very impressive.

Intel this morning is lifting the lid on some of the finer architectural and technical details about its upcoming Lunar Lake SoC – the chip that will be the next generation of Core Ultra mobile processors. Once again holding one of their increasingly regular Tech Tour events for media and analysts, Intel this time set up shop in Taipei just before the beginning of Computex 2024. During the Tech Tour, Intel disclosed numerous facets of Lunar Lake, including their new P-Core design codenamed Lion Cove and a new wave of E-cores that are a bit more like Meteor Lake's pioneering Low Power Island E-Cores. Also disclosed was the Intel NPU 4, which Intel claims delivers up to 48 TOPS, surpassing Microsoft's Copilot+ requirements for the new age of AI PCs.

Intel's Lunar Lake represents a strategic evolution in their mobile SoC lineup, building on their Meteor Lake launch last year, focusing on enhancing power efficiency and optimizing performance across the board. Lunar Lake dynamically allocates tasks to efficient cores (E-cores) or performance cores (P-cores) based on workload demands by leveraging advanced scheduling mechanisms, which are assigned to ensure optimal power usage and performance. Still, once again, Intel Thread Director, along with Windows 11, plays a pivotal role in this process, guiding the OS scheduler to make real-time adjustments that balance efficiency with computational power depending on the intensity of the workload.

Closing out the last of the major PC-focused keynotes at Computex 2024 this evening, we have Intel. The long-reigning leader of the PC CPU market, Intel is in the middle of executing its plans to get back on track on both the manufacturing and chip design aspects of the business. Tonight’s keynote, being helmed by the highly-animated Pat Gelsinger, is titled “Bringing AI Everywhere.” And, like so many other Computex presentations and announcements this week, AI hardware is going to play a big part, as Intel outlines a full stack of products for client and server computing.

Of the four great PC chip vendors at the show, Intel has been the most up-front about what to expect from their hour-long presentation. The company’s Computex 2024 page already outlines their four major topics: AI PCs, Xeon 6 Processors, Gaudi AI accelerators, and Intel’s OpenVINO software ecosystem.

On the consumer hardware front, the company set the table with a significant teaser earlier this month about their forthcoming mobile PC SoC, Lunar Lake. The next generation of Core Ultra processors, Intel is touting significant energy efficiency gains for the mobile-focused chip, with new architectures driving their Performance and Efficiency CPU cores, Xe2 GPU, and a much faster 45+ TOPS (INT8) NPU. While the Lunar Lake announcement is coming relatively soon after the Meteor Lake launch, Intel has made it clear that it’s not going to hold back on shipping future products; they are looking to make up for lost time. Still, Lunar Lake devices are not expected to hit retail shelves until Q4 of this year, so this announcement is coming months in advance of the hardware itself.

On the server front, Intel has been publicly prepping for the launch of a new generation of Xeons with the Xeon 6 platform. The most notable part of this being the release of the company’s first Efficiency-core Xeon, Sierra Forest. Sierra Forest is set to be the first Xeon 6 chip out the door this year, and will offer up to 288 E cores on a single chip, allowing Intel to tap into the many (many) core CPU markets that AMD and Arm-based rivals have been unopposed at thus far.

Finally, the company has fully pivoted its server AI accelerator strategy to its Gaudi accelerators. Gaudi 3 was introduced back in April, and while it isn’t expected to go toe-to-toe with NVIDIA’s top accelerators in every workload, Intel is betting that they can beat NVIDIA on critical workloads, all while undercutting them significantly in pricing. The first Gaudi 3 parts are set to be released in the second half of this year, so hopefully we’ll be hearing a bit more about Intel’s plans as part of their keynote.

As always, the AnandTech crew is live and in person to catch this final Computex keynote. So please come join us at 8:00pm PT / 11:00pm ET / 03:00 UTC to get all the details.

With AMD’s Zen 5 CPU architecture only a month away from its first product releases, the new CPU architecture was placed front and center for AMD’s prime Computex 2024 keynote. Outlining how Zen 5 will lead to improved products across AMD’s entire portfolio, the company laid out their product plans for the full triad: mobile, desktop, and servers. And while server chips will be the last parts to be released, AMD also saved the best for last by showcasing a 192 core EPYC “Turin” chip.

Turin is the catch-all codename for AMD’s Zen 5-based EPYC server processors – what will presumably be the EPYC 9005 series. The company has previously disclosed the name in earnings calls and other investor functions, outlining that the chip was already sampling to customers and that the silicon was “looking great.”

The Computex reveal, in turn, is the first time that the silicon has been shown off to the public. And with it, we’ve received the first official confirmation of the chip’s specifications. With SKUs up to 192 CPU cores, it’s going to be a monster of an x86 CPU.

AMD EPYC CPU Generations
AnandTech	EPYC 5th Gen (Turin, Z5c)	EPYC 9704 (Bergamo)	EPYC 9004 (Genoa)	EPYC 7003 (Milan)
CPU Architecture	Zen 5c	Zen 4c	Zen 4	Zen 3
Max CPU Cores	192	128	96	64
Memory Channels	12 x DDR5	12 x DDR5	12 x DDR5	8 x DDR4
PCIe Lanes	128 x 5.0	128 x 5.0	128 x 5.0	128 x 4.0
L3 Cache	?	256MB	384MB	256MB
Max TDP	360W?	360W	400W	280W
Socket	SP5	SP5	SP5	SP3
Manufacturing Process	CCD: TSMC N3 IOD:TSMC N6	CCD: TSMC N5 IOD: TSMC N6	CCD: TSMC N5 IOD: TSMC N6	CCD: TSMC N7 IOD: GloFo 14nm
Release Date	H2'2024	06/2023	11/2022	03/2021

Though only a brief tease, AMD’s Turin showcase did confirm a few, long-suspected details about the platform. AMD will once again be using their socket SP5 platform for Turin processors, which means the chips are drop-in compatible with EPYC 9004 Genoa (and Bergamo). The reuse of SP5 means that customers and server vendors can immediately swap out chips without having to build/deploy whole new systems. It also means that Turin will have the same base memory and I/O options as the EPYC 9004 series: 12 channels of DDR5 memory, and 128 PCIe 5.0 lanes.

In terms of power consumption, existing SP5 processors top out at 400 Watts, and we’d expect the same for these new, socket-compatible chips.

As for the Turin chip itself, while AMD is not going into further detail on its configuration, all signs point to this being a Zen 5c configuration – that is, built using CCDs designed around AMD’s compact Zen 5 core configuration. This would make the Turin chip on display the successor to Bergamo (EPYC 9704), which was AMD’s first compact core server processor, using Zen 4c cores. AMD’s compact CPU cores generally trade off per-core performance in favor of allowing more CPU cores overall, with lower clockspeed limits (by design) and less cache memory throughout the chip.

According to AMD, the CCDs on this chip were fabbed on a 3nm process (undoubtedly TSMC’s), with AMD apparently looking to take advantage of the densest process available in order to maximize the number of CPU cores the can place on a single chip. Even then, the CCDs featured here are quite sizable, and while we’re waiting for official die size numbers, it would come as no surprise if Zen 5’s higher transistor count more than offset the space savings of moving to 3nm. Still, AMD has been able to squeeze 12 CCDs on to the chip – 4 more than Bergamo – which is what’s allowing them to offer 192 CPU cores instead of 128 as in the last generation.

Meanwhile, the IOD is confirmed to be produced on 6nm. Judging from that fact, the pictures, and what AMD’s doing with their Zen 5 desktop products, there is a very good chance that AMD is using either the same or a very similar IOD as on Genoa/Bergamo. Which goes hand-in-hand with the socket/platform at the other end of the chip staying the same.

AMD’s brief teaser did not discuss at all any other Turin configurations. So there is nothing else official to share about Turin chips built using full-sized Zen 5 CPU cores. With that said, we know that the full-fat cores going into the Ryzen 9000 desktop series pack 8 cores to a CCD and are being fabbed on a 4nm process – not 3nm – so that strongly implies that EPYC Zen 5 CCDs will be the same. Which, if that pans out, means that Turin chips using high performance cores will max out at 96 cores, the same as Genoa.

Hardware configurations aside, AMD also showcased a couple of benchmarks, pitting the new EPYC chips against Intel’s Xeons. As you’d expect in a keynote teaser, AMD was winning handily. Though it is interesting to note that the chips benchmarked were all 128 core Turins, rather than on the 192 core model being shown off today.

AMD will be shipping EPYC Turin in the second half of this year. More details on the chips and configurations will follow once AMD gets closer to the EPYC launch.

For our second keynote of the day for Computex, we have the 4th Musketeer of the great PC powers, Qualcomm. Slated to be the most PC-focused of the four keynotes, company CEO Cristiano Amon will be presenting a keynote entitled “The PC Reborn.” And while Amon is no stranger to giving keynotes, this is slated to be his most PC-centric keynote yet, giving Computex attendees a clearer idea of how focused Qualcomm will be on the PC market with their new Windows-on-Arm SoCs.

The big focus for today's keynote is expected to be the Snapdragon X Elite and X Plus SoCs, which Qualcomm announced over half a year ago, and has been touting ever since. Now, the first consumer devices based on these chips are just a couple of weeks away from shipping, so Qualcomm is in their final promotional push for their new Windows-on-Arm platform. As a result, Qualcomm should have a lot more hardware to show off, with final silicon and shipping SKUs already defined.

While Snapdragon X is not Qualcomm’s first effort to ship an Arm-based SoC for Windows devices – there are 3 generations of 8cx Gen 3 platforms that everyone is happy never to mention again – the Snapdragon X is Qualcomm’s most serious effort yet. At its core is the new, high-performance/high-efficiency Oryon CPU core, which combined with the rest of Qualcomm’s tried-and-true mobile hardware experience, the company is hoping to mold into a revolutionary Arm-based SoC for Windows laptops. The company is also counting on a decade of software development on Microsoft’s part to make the Windows-on-Arm ecosystem whole, not to mention as frictionless as possible.

Besides energy efficiency, Qualcomm’s other big push is on the burgeoning field of NPUs. The Snapdragon X NPU is rated to deliver 45 TOPS of INT8 performance, which makes it the first PC NPU to meet Microsoft’s hardware requirement for Windows 11 Copilot+ AI functionality. So Qualcomm is looking to leverage this time-limited opportunity to be the first to offer new functionality in the Windows space – a privilege normally reserved for Intel or AMD.

Come join us at 10:30pm PT / 01:30am ET / 05:30 UTC to get all the details.

While the bulk of AMD’s Computex presentation was on CPUs and their Instinct lineup of dedicated AI accelerators, the company also has a small product refresh for the professional graphics and workstation AI crowd. AMD is releasing a dual-slot version of their high-end Radeon Pro W7900 card – aptly named the W7900 Dual Slot – with the intent being to improve compute density in workstations by making it possible to install 4 of the cards inside a single chassis.

The release of a dual-slot version of the card comes after the original Radeon Pro W7900 was the first time AMD went with a larger, triple-slot form factor for their flagship workstation card. With the W7000 generation bringing an all-around increase in power consumption, pushing the W7900 to 295 Watts, AMD originally opted to release a larger card for improved acoustics. However this came at the cost of compute density, as most systems could only fit 2 of the thicker cards. As a result, AMD is opting to release a dual-slot version of the hardware as well, to offer a more competitive product for high-density workstation systems – particularly those doing local AI inference.

AMD Radeon Pro Specification Comparison
	AMD Radeon Pro W7900DS	AMD Radeon Pro W7900	AMD Radeon Pro W7800	AMD Radeon Pro W6800
ALUs	12288 (96 CUs)		8960 (70 CUs)	3840 (60 CUs)
ROPs	192		128	96
Boost Clock	2.495GHz		2.495GHz	2.32HHz
Peak Throughput (FP32)	61.3 TFLOPS		45.2 TFLOPS	17.8 TFLOPS
Memory Clock	18 Gbps GDDR6		18 Gbps GDDR6	16 Gbps GDDR6
Memory Bus Width	384-bit		256-bit	256-bit
Memiry Bandwidth	864GB/sec		576GB/sec	512GB/sec
VRAM	48GB		32GB	32GB
ECC	Yes (DRAM)		Yes (DRAM)	Yes (DRAM)
Infinity Cache	96MB		64MB	128MB
Total Board Power	295W		260W	250W
Manufacturing Process	GCD: TSMC 5nm MCD: TSMC 6nm		GCD: TSMC 5nm MCD: TSMC 6nm	TSMC 7nm
Architecture	RDNA3		RDNA3	RDNA2
GPU	Navi 31		Navi 31	Navi 21
Form Factor	Dual Slot Blower	Triple Slot Blower	Dual Slot Blower	Dual Slot Blower
Launch Date	06/2024	Q2'2023	Q2'2023	06/2021
Launch Price (MSRP)	$3499	$3999	$2499	$2249

Other than the narrower cooler, the Radeon Pro W7900DS is for all intents and purposes identical to the original W7900, with the same Navi 31 GPU being driven to the same clockspeeds, and the overall board being run to the same 295 Total Board Power (TBP) limit. This is paired with the same 18Gbps GDDR6 as before, giving the card 48GB of VRAM.

Officially, AMD doesn’t have a noise specification for these cards. But you can expect that the W7900DS will be louder than its triple-slot senior. By all appearances, AMD is just using the cooler from the W7800, which was a dual-slot card from the start, so that cooler is being tasked with handling another 35W of heat dissipation.

As the W7800 was also AMD’s fastest dual-slot card up until now, it’s an apt point of comparison for compute density. With its full-fat Navi 31 GPU, the W7900DS will offer about 36% more compute/pixel throughput than its sibling/predecessor. So it’s a not-insubstantial improvement for the very specific niche AMD has in mind for the card.

And like so many other things being announced at Computex this year, that niche is AI. While AMD offers PCIe versions of their Instinct MI210 accelerators, those cards are geared at servers, with fully-passive coolers to match. So workstation-level compute is largely picked up by AMD’s Radeon Pro workstation cards, which are intended to go into a traditional PC chassis and use active cooling (blowers). In this case, AMD is specifically going after local inference workloads, as that’s what the Radeon hardware and its significant VRAM pool are best suited for.

The Radeon Pro W7900 Dual Slot will drop on June 19^th. Notably, AMD is introducing the card at a slightly lower price tag than they launched the original W7900 at last year, with the W7900DS hitting retail shelves at $3499, down from the W7900’s original $3999 price tag.

ROCm 6.1 For Radeons Coming as Well

Alongside the release of the W7900DS, AMD is also promoting the upcoming Radeon release of ROCm 6.1, their software stack for GPU computing. While baseline ROCm 6.1 was introduced back in April, the Windows version of AMD’s software stack is still a trailing (and feature limited) release. So that is slated to finally get bumped up to a ROCm 6.1 release on June 19^th, the same day the W7900DS launches.

ROCm 6.1 for Radeons is slated to bring a couple of major changes/improvements to the stack, particularly when it comes to expanding the scope of available features. Notably, AMD will finally be shipping Windows Subsystem for Linux 2 (WSL2) support, albeit at a beta level, allowing Windows users to access the much richer feature set and software ecosystem of ROCm under Linux. This release will also incorporate improved support for multi-GPU configurations, perfect timing for the launch of the Radeon Pro W7900DS.

Finally, ROCm 6.1 sees TensorFlow integrated into the ROCm software stack as a first-class citizen. While this matter involves more complexities than can be summarized in a simple news story, native TensorFlow support under Windows was previously blocked by a lack of a Windows version of AMD’s MIOpen machine learning library. Combined with WSL2 support, developers will have two ways to access TensorFlow on Windows systems going forward.

During their opening keynote at Computex 2024, AMD announced their intention to launch a pair of new Ryzen 5000 processors for their legacy AM4 platform. The new chips, both getting the XT suffix, will be the Ryzen 9 5900XT, a 16 core Zen 3 part, while the Ryzen 7 5800XT will be an 8 core Zen 3.

The new chips are intended to underscore AMD's ongoing commitment to supporting their consumer platforms over several years. And while the specification changes are rather minor overall – the Zen 3 CPU architecture has long since been taken as far as it can reasonable go – it does give AMD a chance to refresh the platform by slinging hardware at new price points. AMD did something very similar for the Ryzen 3000 generation with the late-model Ryzen 3000 XT chips.

AMD Ryzen 5000XT Series Processors (Zen 3)
AnandTech	Cores / Threads	Base Freq	Turbo Freq	L2 Cache	L3 Cache	TDP
Ryzen 9 5950X	16C / 32T	3.4 GHz	4.9 GHz	8 MB	64 MB	105 W
Ryzen 9 5900XT	16C / 32T	3.3 GHz	4.8 GHz	8 MB	64 MB	105 W
Ryzen 9 5900X	12C / 24T	3.7 GHz	4.8 GHz	6 MB	64 MB	105 W
Ryzen 7 5800XT	8C / 16T	3.8 GHz	4.8 GHz	4 MB	32 MB	105 W
Ryzen 7 5800X	8C / 16T	3.8 GHz	4.7 GHz	4 MB	32 MB	105 W

We've dedicated many column inches covering Zen 3 and the Ryzen 5000 series since they launched in late 2020, so there isn't anything new to add here. Zen 3 is no longer AMD's latest and greatest, but the platform as a whole is quite cheap to produce, making it a viable budget offering for new builds, or offering one last upgrade for old builds.

The Ryzen 9 5900XT is a 16 core part, and isn't to be confused with the Ryzen 9 5900X, which is a 12 core part. It ships with a peak turbo clockspeed of 4.8GHz, 100 MHz lower than the top-tier Ryzen 9 5950X. This makes it's XT designation somewhat of a misnomer compared to previous generations of XT chips, although it's clear that AMD has boxed themselves into a corner with their naming scheme, as they both need a way to designate that this is a new chip, and yet still place it below the 5950X.

Looking at the second chip, we have the Ryzen 7 5800XT. This is an 8 core part that does improve on its predecessor, offering a 4.8GHz max turbo clock that is 100MHz higher than the Ryzen 7 5800X's. Both chips otherwise share the same characteristics, including 6 MB of L2 cache and 32 MB of L3 cache, and all four of the chips – including the two new XT series and the corresponding X series chips – all come with a 105 Watt TDP.

In terms of motherboard compatibility, all of the AM4 motherboards that currently support the Ryzen 5000 series are also compatible with the Ryzen 5000XT series, although users are likely to need to perform a firmware update to ensure maximum compatibility; they are the same chips, but the microcodes are likely different.

AMD has provided some gaming performance figures comparing the Ryzen 9 5900XT to Intel's 13th Gen Core i7-13700K. It does offer very modest yet marginal gains in games by up to 4%; it's not mind-blowing, but the price could be the decisive factor here.

Regarding price, AMD hasn't disclosed anything official yet ahead of the expected launch of the Ryzen 5000XT series chips in July. It's hard to make a case for a pair of chips to be considered a fully-fledged series, but it does open up the doors for AMD to perhaps launch more 5000XT series chips in the future.

In a packed presentation kicking off this year’s Computex trade show, AMD CEO Dr. Lisa Su spent plenty of time focusing on the subject of AI. And while the bulk of that focus was on AMD’s impending client products, the company is also currently enjoying the rapid growth of their Instinct lineup of accelerators, with the MI300 continuing to break sales projections and growth records quarter after quarter. It’s no surprise then that AMD is looking to move quickly then in the AI accelerator space, both to capitalize on the market opportunities amidst the current AI mania, as well as to stay competitive with the many chipmakers large and small who are also trying to stake a claim in the space.

To that end, as part of this evening’s announcements, AMD laid out their roadmap for their Instinct product lineup for both the short and long term, with new products and new architectures in development to carry AMD through 2026 and beyond.

On the product side of matters, AMD is announcing a new Instinct accelerator, the HBM3E-equipped MI325X. Based on the same computational silicon as the company’s MI300X accelerator, the MI325X swaps out HBM3 memory for faster and denser HBM3E, allowing AMD to produce accelerators with up to 288GB of memory, and local memory bandwidths hitting 6TB/second.

Meanwhile, AMD also showcased their first new CDNA architecture/Instinct product roadmap in two years, laying out their plans through 2026. Over the next two years AMD will be moving very quickly indeed, launching two new CDNA architectures and associated Instinct products in 2025 and 2026, respectively. The CDNA 4-powered MI350 series will be released in 2025, and that will be followed up by the even more ambitious MI400 series in 2026, which will be based on the CDNA "Next" architecture.

During AMD's opening keynote at Computex 2024, company CEO Dr. Lisa Su revealed AMD's latest AI PC-focused chip lineup for the mobile market, the Ryzen AI 300 series. Based on AMD's new Zen 5 CPU microarchitecture, the Ryzen AI 300 series – codenamed Strix Point – is intended to offer an across-the-board improvement in mobile SoC performance, with AMD proclaiming that the Ryzen AI 300 series will offer the fastest AI inference performance within the compact and portable PC market.

Under the hood, the new mobile SoC from AMD incorporates not only their new Zen 5 CPU architecture, but also their new RDNA 3.5-based integrated graphics, and the third generation XDNA2-based NPU, the latter of which is rated to deliver 50 TOPS of performance for AI-based workloads. As a result, the Ryzen AI 300 series represents a significant upgrade in AMD's mobile chip lineup, with all of the major aspects of the platform receiving a major upgrade versus their Zen 4-era Phoenix/Hawk Point SoCs. The one thing the new platform won't get, however, is a process node improvement; AMD is building Strix Point on a 4nm node, just like Phoenix/Hawk Point before it.

For this morning's announcement, AMD has unveiled the first two Ryzen AI 300 SKUs designed for notebooks. The first of these is the Ryzen AI 9 HX 370, which features 12 Zen 5 cores with a maximum boost frequency of up to 5.1 GHz, and comes equipped with 36 MB cache (12 MB L2 + 24 MB L3). The other chip to be announced is the Ryzen AI 9 365, which has two fewer Zen 5 cores (10 cores) and operates with a 5,0 GHz boost frequency and a 10 MB L2 + 24 MB L3 cache allocation.

During AMD's Computex 2024 kick-off keynote, AMD's CEO, Dr. Lisa Su, officially unveiled and announced the company's next generation of Ryzen processors. Today marks the first unveiling of AMD's highly anticipated Zen 5 microarchitecture via the Ryzen 9000 series, which is set to bring several advancements over Zen 4 and the Ryzen 7000 series for desktop PCs, which will launch sometime in July 2024.

AMD has unveiled four new chip SKUs using its Zen 5 microarchitecture. The AMD Ryzen 9 9950X processor will be the new consumer flagship part, featuring 16 CPU cores and a speedy 5.7 GHz maximum boost frequency. The other SKUs include, 6, 8, and 12 core parts, giving users a varied combination of core and thread counts. All four of these initial chips will be X-series chips, meaning they will have an unlocked multipliers and higher TDPs/clockspeeds.

In regards to performance, AMD is touting an average (geomean) IPC increase in desktop workloads for Zen 5 of 16%. And with the new desktop Ryzen chips' turbo clockspeeds remaining largely identical to their Ryzen 7000 predecessors, this should translate into similar performance expectations for the new chips.

The AMD Ryzen 9000 series will also launch on the AM5 socket, which debuted with AMD's Ryzen 7000 series and marks AMD's commitment to socket/platform longevity. Along with the Ryzen 9000 series will come a pair of new high-performance chipsets: the X870E (Extreme) and the regular X870 chipsets. The fundamental features that vendors will integrate into their specific motherboards remain tight-lipped. Still, we do know that USB 4.0 ports are standard on the X870E/X870 boards, along with PCIe 5.0 for both PCIe graphics and NVMe storage, with higher AMD EXPO memory profile support expected than previous generations.

Computex keynote season is kicking into high gear this morning with the show's leading keynote, which is being delivered by AMD. Company CEO Dr. Lisa Su will be presenting a keynote entitled “The future of high-performance computing in the AI era,” and with a run time of 90 minutes, we're expecting AMD to have a whole host of product announcements covering their full spectrum of product categories.

The big expectation here is fresh news around AMD’s Zen 5 CPU core architecture, and the chips built around it. AMD’s most recent Zen 5 roadmap has it slated to deliver all three flavors of Zen 5 by the end of this year, and we’re coming up on the two-year anniversary of the Zen 4 architecture launch.

Along with client chips, AMD has been pushing their server CPUs hard, and they’ve previously told investors that the next-gen EPYC Turin CPU is “looking great”. So we’ll likely hear about both client and server Zen 5 product plans during this keynote.

On the GPU/accelerator side of matters, AMD is mid-cycle (at best) with their Instinct MI300 series accelerators. With the company’s sales repeatedly beating their own expectations, AMD doesn’t seem to need much help moving this premium silicon right now. But with AI being the operative buzzword of this year’s Computex (and indeed, the computing industry as a whole), it would be weird for AMD to not have something to say about their rapidly growing AI accelerator product line.

Come join us at 6:30pm PT / 9:30pm ET / 01:30 UTC to get all the details.

The annual Computex computer expo kicks off in Taepei this weekend. And this year’s show is shaping up to be the most packed in years.

Computex rivals CES for the most important PC trade show of the year, and in most years is attended by not only the numerous local Taiwanese firms (Asus, MSI, ASRock, and others), but the major chip developers have been increasing their own presence as well. These days, while CES itself tends to land more high-profile announcements, in recent years it’s been Computex that has delivered on more substantial announcements. This is largely because tech firms have aligned their product schedules to roll out near gear in the second half of the year, when retail sales are stronger due to the back-to-school and holiday shopping periods.

This year’s show, in turn, is looking to be an especially big year for the PC ecosystem. All the major PC chip firms – AMD, Intel, NVIDIA, and the 4^th Musketeer, Qualcomm – are holding keynote addresses at this year’s show, where they’re expected to announce new slates of PC products to ship later this year. In a normal year there is typically only major announcements from one or two of the major chip firms, so having all four of them at the show delivering lengthy keynotes is setting things up for what should be an exceptional show.

TSMC's 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company's recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2 dies.

TSMC has a number of advanced packaging technologies, including 2.5D CoWoS and 2.5D/3D InFO. Perhaps the most intriguing (and complex) method is their 3D-stacked system-on-integrated chips (SoIC) technology, which is TSMC's implementation of hybrid wafer bonding. Hybrid bonding allows two advanced logic devices to be stacked directly on top of each other, allowing for ultra-dense (and ultra-short) connections between the two chips, and is primarily aimed at high performance parts. For now, SoIC-X (bumpless) is used for select applications, such as AMD's 3D V-cache technology for CPUs, as well as their Instinct MI300-series AI products. And while adoption is growing, the current generation of the technology is constrained by limitations on die sizes and interconnection pitches.

But those limitations are expected to give way quickly, if all goes according to plan for TSMC. SoIC-X technology is going to advance fast, and by 2027, it will be possible assemble a chip pairing a reticle-sized top die made on TSMC's leading-edge A16 (1.6nm-class) on a bottom die produced using TSMC's N2 (2nm-class). These dies, in turn, would be connected using 3μm bond pitche ssilicon vias (TSVs), three times the density of the size of today's 9μm pitch. Such small interconnections will allow for a much larger number of connections overall, greatly increasing the bandwidth density (and thus performance) of the assembled chip.

TSMC's SoIC-X Roadmap Data by TSMC (Compiled by AnandTech)
	2022	2023	2024	2025	2026	2027
Top Die	N7	N5	N4	N3	N2	A16
Bottom Die	N7	≥N6	≥N5	≥N4	≥N3	≥N2
Bond Pitch	9 μm	9 μm	6 μm	6 μm	4.5 μm	3 μm
Size*	0.1 reticle	0.4 reticle	0.8 reticle	1 reticle	1 reticle	1 reticle

*TSMC considers reticle size as roughly 830 mm².

Improved hybrid bonding techniques are intended to allow TSMC's big HPC customers – AMD, Broadcom, Intel, NVIDIA, and the like – to build large, ultra-dense disaggregated processor designs for demanding applications, where distance between the dies is critical, as is the overall floor space used. Meanwhile, for applications where only performance matters, it will be possible to place multiple SoIC-X packages on a CoWoS interposer to get improved performance at a lower power consumption.

In addition to developing its bumpless SoIC-X packaging technology aimed at devices that require extreme performance, TSMC will also launch its bumped SoIC-P packaging process in the near future. SoIC-P is designed for cheaper lower performance applications that still want 3D-stacking, but don't need the additional performance and complexity that comes with bumpless copper-to-copper TSV connections. This packing technique will enable a broader range of companies to leverage SoIC, and while TSMC can't speak for their customers' plans, a cheaper version of the technology may make it accessible for more cost-conscious consumer applications.

Per TSMC's current plans, by 2025 the company will offer a face-to-back (F2B) bumped SoIC-P technology capable of pairing a 0.2-reticle sized N3 (3nm-class) top die with an N4 (4nm-class) bottom die, which will be connected using 25μm pitch microbumps (µbumps). In 2027, TSMC will introduce bumped face-to-face (F2F) SoIC-P technology, which will be able to place an N2 top die on an N3 bottom die with a pitch of 16μm.

TSMC's SoIC-P Roadmap Data by TSMC (Compiled by AnandTech)
	2025	2027
Top Die	N3	N2
Bottom Die	≥N4	≥N3
Bond Pitch	25 μm	16 μm
Size*	0.2 reticle	0.4 reticle
Die Orientation	face-to-back	face-to-face
Qualification Time	Q4 2024 for mobile SoC	Q2 2026 for HPC

*TSMC considers reticle size as roughly 830 mm²

A lot of work has to be done to make SoIC more popular and accessible among chip developers, including continuing to iprove their die-to-die interfaces. But TSMC seems to be very optimistic about SoIC adoption by the industry, and expects around 30 SoIC designs to be released by 2026 – 2027.

The introduction of the Intel NUC in the early 2010s kickstarted the ultra-compact form-factor (UCFF) trend for desktop systems. Processors with TDPs ranging from 6 - 15W formed the backbone of this segment in the initial years. The emergence of configurable TDPs for notebook processors has prompted some vendors to introduce UCFF systems with regular 45W TDP processors (albeit, in cTDP-down mode).

GEEKOM, the private label brand of Shenzhen Jiteng Network Technology Co., has emerged as a popular UCFF system vendor in the last couple of years. After starting off with systems based on older processors, the company has moved on to introducing units carrying the latest and greatest from both AMD and Intel. The company has also been innovating on the form-factor side with compact boards smaller than the traditional 4"x4" ones in the NUC clones. The GEEKOM A7 is one such system based on AMD's Phoenix lineup.

The system is available in two configurations - one with the Ryzen 7 7840HS, and the other with the Ryzen 9 7940HS. The company sent over the flagship configuration to put through our evaluation routine for small form-factor computing systems. Read on to explore the performance profile and value proposition of the system, along with a discussion of the trade-offs involved in cramming a powerful notebook processor inside a system smaller than the traditional NUC.

In addition to revealing its roadmap and plans concerning its current leading-edge process technologies, TSMC also shared progress of its N2 node as part of its Symposiums 2024. The company's first 2nm-class fabrication node, and predominantly featuring gate-all-around transistors, according to TSMC N2 has almost achieved its target performance and yield goals, which places it on track to enter high-volume manufacturing in the second half of 2025.

TSMC states that 'N2 development is well on track and N2P is next.' In particular, gate-all-around nanosheet devices currently achieve over 90% of their expected performance, whereas yields of 256 Mb SRAM (32 MB) devices already exceeds 80%, depending on the batch. All of this for a node that is over a year away from mass production.

Meanwhile, average yield of a 256 Mb SRAM was around 70% as of March, 2024, up from around 35% in April, 2023. Device performance has also been improving with higher frequencies being achieved while keeping power consumption in check.

Chip designer interest towards TSMC's first 2nm-class gate-all-around nanosheet transistor-based technology is significant, too. The number of new tape-outs (NTOs) in the first year of N2 is over two-times higher than it was for N5. Though with that said, given TSMC's close working relationship with a handful of high-volume vendors – most notably Appe – NTOs can be a very misleading figure since the first year of a new node at TSMC is capacity constrained, and consequently the bulk of that capacity goes to TSMC's priority partners.

Meanwhile, there were considerably more N5 tapeouts in its second year (some where N5P, of course) and N2 promises to have 2.6X more NTOs in its second year. So the node indeed looks quite promising. In fact, based on TSMC's slides (which we're unfortunately not able to republish), N2 is more popular than N3 in terms of NTOs both in the first and the second years of existence.

When it comes to the second year of N2, in the second half of 2026 TSMC plans to roll out its N2P technology, which promises additional performance and power benefits. N2P is expected to improve frequency by 15% - 20%, reduce power consumption by 30% - 40%, and increase chip density by over 1.15 times compared to N3E, significant benefits to move to all-new GAA nanosheet transistors.

Finally, for those companies that need the best in performance, power, and density, TSMC is poised to offer their A16 process in 2026. That node will also bring in backside power delivery, which will add costs, but is expected to greatly improve performance efficiency and scaling.

Lexar has a long history of serving the flash-based consumer storage market in the form of SSDs, memory cards, and USB flash drives. After having started out as a Micron brand, the company was acquired by Longsys which has diversified its product lineup with regular introduction of new products. Recently, the company announced a number of portable SSDs targeting different market segments. The Lexar ARMOR 700 Portable SSD makes its entry as the new flagship in the 20 Gbps PSSD segment.

Despite its flagship positioning and rugged nature, the ARMOR 700 is reasonably priced thanks to the use of a native USB flash controller - the Silicon Motion SM2320. Similar to the SL500, the product uses YMTC 3D TLC NAND (compared to the usual Micron or BiCS NAND that we have seen in SM2320-based PSSDs from other vendors). Read on for a detailed look at the ARMOR 700, including an analysis of its internals and evaluation of its performance consistency, power consumption, and thermal profile.

As the semiconductor industry continues to evolve, Arm stands at the forefront of innovation for its core and IP architecture, especially in the mobile space, by pushing the boundaries of technology to deliver cutting-edge solutions for end users. For 2024, Arm's year-on-year strategic advancements focus on enhancing last year's Armv9.2 architecture with a new twist. Arm has rebranded and re-strategized its efforts by introducing Arm Compute Subsystem (CSS), the direct successor to last year's Total Compute Solutions (TSC2023) platform.

Arm is also transitioning its latest IP and Cortex core designs, including the largest Cortex X925, the middle Cortex A725, and the refreshed and smaller Cortex A520 to the more advanced 3 nm process technology. Arm promises that the 3 nm process node will deliver unprecedented performance gains compared to last year's designs, power efficiency and scalability improvements, and new front and back-end refinements to its Cortex series of cores. Arms' new solutions look to power the next-generation mobile and AI applications as Arm, along with its complete AArch64 64-bit instruction execution and approach to solutions geared towards mobile and notebooks, look set to redefine end users' expectations within the Android and Windows on Arm products.

To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that Rapidus, a foundry startup backed by the Japanese government and several major Japanese companies, is going to enter in 2027, when its first fab comes online, just a few years from now.

In a fresh update on the status of bringing up the company's first leading-edge fab, Rapidus has revealed that they are intending to get in to the chip packaging game as well. Once complete, the ¥5 trillion ($32 billion) fab will be offering both chip lithography on a 2nm node, as well as packaging services for chips produced within the facility – a notable distinction in an industry where, even if packaging isn't outsourced entirely (OSAT), it's still normally handled at dedicated facilities.

Ultimately, while the company wants to serve the same clients as TSMC, Samsung, and Intel Foundry, the firm plans to do things almost completely differently than its competitors in a bid to speed up chipmaking from finishing design to getting a working chip out of the fab.

"We are very proud of being Japanese," said Henri Richard, general manager and president of Rapidus's subsidiary in the U.S. "[…] I know that some people may be looking at this thinking [that] Japan is known for quality, attention to detail, but not necessarily for speed, or flexibility. But I will tell you that Atsuyoshi Koike (the head of Rapidus) is a very special executive. That is, he has all the quality of Japan, with a lot of American thinking. So he is quite a unique guy, and certainly extraordinarily focused on creating a company that will be extremely flexible and extremely quick on its feet."

2nm Only, At First

Perhaps the most significant difference between Rapidus and traditional foundries is that the company will offer only leading-edge manufacturing technologies to its clients: 2 nm in 2027 (phase 1) and then 1.4 nm in the future (phase 2). This is a stark contrast with other contract fabs, including Intel, which tend to offer their customers a full range of fabrication processes to land more clients and produce more chips. Apparently, Rapidus hopes that that there will be enough Japanese and American chip developers that are inclined to use its 2 nm fabrication process to produce their designs. With that said, the number of chip designers that are using the most advanced production node at any given time is relatively small – limited to large firms who need first-mover advantage and have the margins to justify taking the risk – so it remains to be seen whether Rapidus's business model becomes successful. The company believes it will, since the market of chips made on advanced nodes is growing rapidly.

"Until recently IDC was giving a an estimation of the 2nm and below market as about $80 billion and I think we are going to see soon a revision of the potential to $150 billion," said Richard. "[…] TSMC is the 800 pound gorilla in the space. Samsung is there and Intel is going to enter that space. But the market growth is so significant and the demand is so high, that it does not take a lot of market share for Rapidus to be successful. One of the things that gives me great comfort is that when I talk to our EDA partners, when I talk to our potential clients, it is obvious that the entire industry is looking for alternative supply from a fully independent foundry. There is a place for Samsung in this industry, there is a place for Intel in this industry, the industry is currently owned by TSMC. But another totally independent foundry is more than welcome by all of the ecosystem partners and by the customers. So, I feel really, really good about Rapidus's positioning."

Speaking of advanced process technologies, it is notable that Rapidus does not plan to use ASML's High-NA Twinscan EXE lithography scanners for 2 nm production. Instead, Rapidus is sticking to ASML's proven Low-NA scanners, which will reduce costs of Rapidus's fab, though it will entail usage of EUV double patterning, which brings up costs and lengthens the production cycle in other ways. Even with those trade-offs, SemiAnalysis analysts believe that given the cost of High-NA EUV litho tools and halved imaging field, Low-NA double patterning could be more economically viable.

"We think we are absolutely comfortable with the current [Low-NA EUV] solution for 2nm, but we might consider a different solution at 1.4 nm," said Richard.

For now, only Intel plans to use High-NA tools to make chips on its 14A (1.4 nm-class) fabrication process sometimes in the middle of the decade. TSMC and Samsung Foundry look to be more cautious, so Rapidus is not alone with its attitude towards High-NA EUV tools.

Advanced Packaging at a Leading-Edge Fab

In addition to advanced process technologies, high-end chip designers (such as those used for AI and HPC applications) also need advanced packaging technologies (e.g., for HBM integration) and Rapidus is ready to offer them as well. What sets the company apart from its industry peers is that it plans to build and package chips in the same fab.

"We intend to have the backend capability in Hokkaido [semiconductor fab] as a differentiator," Richard said. "We have the benefit of starting from scratch and be able to build probably the first fully integrated front end back end semiconductor fab in the industry, I think. Others will retrofit and modify their existing capacity, but we have a clean sheet of paper and part of the secret sauce that Koike son is bringing to Rapidus are some very interesting ideas on how to integrate both front end and back end amongst others."

Intel, Samsung, and TSMC have separate facilities for chip manufacturing and packaging, as even the most sophisticated packaging methods involving silicon interposers (which are essentially large chips) don't match the complexity of modern processors. The tools that are used to build silicon interposers and equipment used to make full logic chips are vastly different, so installing them into the same cleanroom generally makes little sense as they do not complement each other very well.

On the other hand, transporting wafers from one site to another is a time consuming and risky endeavor, so integrating everything into one campus could make sense as it greatly simplifies supply chain.

"We are going to re reinvent the way, chip design, front end and the back end are working together toward the completion of a project," Richard said. […] The whole idea is we can do it fast, with high quality, high yield, and with a very short cycle time."

MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the volume of space required. And while we're eagerly awaiting to see CAMM2 show up in more laptops, its introduction in a PC motherboard comes as a bit of a surprise, since PCs aren't nearly as space-constrained.

MSI's Z790 Project Zero Plus motherboard, which supports Intel's latest 14^th Generation Core processors, is to a large degree a proof-of-concept product that is showcasing several new technologies and atypical configuration options. Key among these, of course, is the CAMM2 connector. The single connector supports a 128-bit DDR5 memory bus, allowing for a system to be fully populated with RAM with just a single, horizontally-mounted CAMM2 module. And in terms of design, the Zero Plus also features backside power connectors for improved cable management.

CAMM2 is designed to replace traditional modules in an SO-DIMM form-factor and is meant to occupy up to 64% less space than two DDR5 SO-DIMMs. In addition, CAMM2 greatly optimizes signal and power traces inside the motherboard, primarily by ensuring all memory trace lengths are identical, reducing some of the signaling penalties that normally come from supporting multiple SO-DIMM slots in a system. With DDR5 being particularly sensitive here – to the point where 2 DIMM Per Channel (2DPC) configurations take a max frequency hit even on desktop systems – CAMM2 modules are expected to simplify and, to a degree, improve laptop designs to better match DDR5's limitations.

Though whether CAMM2 sees widespread adoption remains to be seen. Unlike it's LPDDR5X counterpart, LPCAMM2, DDR5 CAMM2 hasn't attracted the same interest from laptop vendors quite yet, in large part because it doesn't introduce any new functionality (e.g. socketed LPDDR5X).

Meanwhile CAMM2 in ATX desktops is all but unexplored right now, which is why we're seeing experimental products like MSI's motherboard. The space savings alone aren't as important in desktops due to their size – though CAMM2 does cut down on Z-height, keeping memory away from CPU coolers. But PC makers will be looking at other factors such as inventory, as equipping desktop boards with CAMM2 connectors would allow them to use the same memory modules in both laptops and desktops. And longer term there is the question of whether CAMM2 can deliver tangible signaling benefits over traditional DIMMs.

MSI plans to showcase its Z790 Project Zero Plus platform at Computex, alongside memory partner Kingston. The latter will be at the show to demonstrate its Fury Impact CAMM2 memory module, which is one of the first DDR5 CAMM2 modules to be announced.

Intel's Meteor Lake series of processors has had a drawn-out launch since its details were officially presented in September 2023. The series marks Intel's foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market - ultraportables and notebooks. However, this has not prevented Intel and its partners from introducing it as a follow-up to Raptor Lake-P and Raptor Lake-H in the SFF / UCFF desktop market.

ASRock Industrial has consistently been the first to market with ultra-compact form-factor motherboards and mini-PCs, with product announcements coinciding with Intel's launch of its latest and greatest mobile processors. Meteor Lake has not been any different, with the NUC(S) Ultra 100 BOX series launching towards the end of Q4 2023. In the meanwhile, Intel's NUC business unit was purchased by ASUS and had its first major product announcement in the form of the Meteor Lake-based Revel Canyon NUCs at the 2024 CES.

The flagship NUC Ultra 100 BOX system is the NUC BOX-155H based on the Intel Core Ultra 7 155H. The Revel Canyon NUC lineup includes a model based on the Core Ultra 7 165H with vPro capabilities, with its claim to fame being the ability to hit 5 GHz on the performance cores. Read on for a detailed look at the features and performance profile of the ASRock Industrial NUC BOX-155H and the ASUS NUC14RVHv7. The analysis also helps in establishing the potential and benefits of Meteor Lake for the UCFF desktop market over its predecessors and the competition.

As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company's most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against each other when they enter high-volume manufacturing (HVM) in the second half of 2025.

Advertised PPA Improvements of New Process Technologies Data announced during conference calls, events, press briefings and press releases
Compiled by AnandTech	TSMC
	N3 vs N5	N3E vs N5	N3P vs N3E	N3X vs N3P	N2 vs N3E	N2P vs N3E	N2P vs N2	A16 vs N2P
Power	-25% -30%	-34%	-5% -10%	-7%***	-25% -30%	-30% -40%	-5% -10%	-15% -20%
Performance	+10% +15%	+18%	+5%	+5% Fmax @1.2V**	+10% +15%	+15% +20%	+5 +10%	+8% +10%
Density*	?	1.3x	1.04x	1.10x***	1.15x	1.15x	?	1.07x 1.10x
HVM	Q4 2022	Q4 2023	H2 2024	H2 2025	H2 2025	H2 2026	H2 2026	H2 2026

*Chip density published by TSMC reflects 'mixed' chip density consisting of 50% logic, 30% SRAM, and 20% analog.
**At the same area. 
***At the same speed.

The production nodes are N3X (3nm-class, extreme performance-focused) as well as N2 (2nm-class). TSMC says that when compared to N3P, chips made on N3X can either lower power consumption by 7% at the same frequency by lowering Vdd from 1.0V to 0.9V, increase performance by 5% at the same area, or increase transistor density by around 10% at the same frequency. Meanwhile, the key advantage of N3X compared to predecessors is its maximum voltage of 1.2V, which is important for ultra-high-performance applications, such as desktop or datacenter GPUs.

TSMC's N2 will be TSMC's first production node to use gate-all-around (GAA) nanosheet transistors and this will significantly enhance its performance, power, and area (PPA) characteristics. When compared to N3E, semiconductors produced on N3 can cut their power consumption by 25% - 30% (at the same transistor count and frequency), increase their performance by 10% - 15% (at the same transistor count and power), and increase transistor density by 15% (at the same speed and power). 

While N2 will certainly be TSMC's undisputed champ when it comes to power consumption and transistor density, N3X could possibly challenge it when it comes to performance, especially at high voltages. For many customers N3X will also have a benefit of using proven FinFET transistors, so N2 will not be automatically the best of TSMC's nodes in the second half of 2025.

2026: N2P and A16

In the following year TSMC will again offer two nodes that are set to target generally similar smartphone and high-performance computing applications: N2P (performance-enhanced 2nm-class) and A16 (1.6nm-class with backside power delivery).

N2P is expected to deliver a 5% - 10% lower power (at the same speed and transistor count) or a 5% - 10% higher performance (at the same power and transistor count) compared to the original N2. Meanwhile, A16 is set to offer an up to 20% lower power (at the same speed and transistors), up to 10% higher performance (at the same power and transistors), and up to 10% higher transistor density compared to N2P. 

Keeping in mind that A16 features enhanced backside power delivery network, it will likely be the node of choice for performance-minded chip designers. But of course, it will be more expensive to use A16 because of the backside power delivery, which requires additional process steps.

At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company's strategy to replicate its manufacturing processes across its multiple gigafab sites.

The need for large-scale multi-national fabs to have a process in place to replicate their facilities is well-documented at this point. As scaling-up at at the gigafab size means scaling-out instead, chip makers need to be able to quickly get new and updated manufacturing processes ported to other facilities in order to hit their necessary throughput – and to avoid a multi-quarter bottlenecks that come from having to freshly-tune a fab.

Intel, for their part, has a well-known Copy Exactly program, which is one of the company's major competitive advantages, allowing it to share process recipes across its fabs around the world to maximize yields and reduce performance variability. Meanwhile, as Taiwan Semiconductor Manufacturing Co. is building additional capacity in different parts of the world, it has reached the point where it needs a similar program in order to quickly maximize its yields and productivity at its new fabs in Japan and the U.S. And in some respects, TSMC's program goes even further than Intel's, with an additional focus on sustainability and social responsibility.

"As mentioned at last year's symposium, [Global Gigafab manufacturing] is a powerful global manufacturing and management platform," said Y.L. Wang, Vice President of Fab Operations TSMC. "We realise one fab management to ensure our Gigafab to achieve consistent operation efficiency as well as production quality on a global scale. Moreover, we also pursue sustainability across our global footprint covering green manufacturing, global talent development, supply chain localization, as well as social responsibility."

TSMC's Global GigaFab Manufacturing Data by TSMC (Compiled by AnandTech)
Manufacturing Excellence	Sustainability
Global One Fab Manufacturing	Green Manufacturing
ML-based Process Control	Global Talent Development
Manufacturing Agility and Quality	Supply Chain Localization
Maximum Productivity	Social Responsibility

When it comes to improvements of process technology, there are two main mechanisms: the continuous process improvements (CPI) to improve yields, as well as statistical process control (SPC) reduce performance variations. To do so, the company has multiple internal techniques that rely on machine learning-based process control, constant quality measuring, and various productivity improving methods. With Global Gigafab manufacturing TSMC can use CPI and SPC to improve yields and performance on the global scale by sharing knowledge between different sites.

"When we port a technology from Taiwan to Arizona, the fab set up, the process control system, everything is actually a copy from Taiwan," said Kevin Zhang, Senior Vice President, Business Development and Overseas Operations Office, and Deputy Co-COO at TSMC.

TSMC yet has to start making chips at its fabs in Germany, Japan, and the United States, so it remains to be seen how fast the foundry will increase yields to Taiwanese levels at its Fab 23 (in Kumamoto, Japan) and Fab 21 (in Arizona) when they begin operations in 2024 and 2025, but with Global Gigafab Manufacturing program in place, this is likely set to happen rather sooner than later.

Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC's chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS capacity by the end of 2024. But as it turns out, just doubling capacity once won't be enough, and the world's largest contract maker of chips is going to have to keep scaling up at a rapid pace.

At its European Technology Symposium last week TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026. As a result, TSMC's CoWoS capacity will more than quadruple from 2023 levels by the end of that period. And keeping in mind that TSMC is prepping additional versions of CoWoS (namely CoWoS-L) that will enable building system-in-packages (SiPs) of up to eight reticle sizes, increasing CoWoS capacity by four-fold in three years may still not be enough. The good news is that the various third-party off-site assembly and testing (OSAT) providers are also expanding their CoWoS-like capacity, so the demand for advanced packing isn't a problem that TSMC is facing (or resolving) on their own.

And CoWoS isn't the only advanced packaging technology line whose capacity TSMC is looking to rapidly expand. The company also has its system-on-integrated chips (SoIC) 3D stacking technology which adoption is poised to grow in the coming years. To meet demand for its SoIC packaging methods TSMC will expand SoIC capacity at a 100% compound annual growth rate by the end of 2026. As a result, SoIC capacity will grow by eight-fold from 2023 levels by late 2026.

Overall, TSMC itself expects leading-edge SiPs for demanding applications like AI and HPC will adopt both CoWoS and SoIC 3D stacking technologies in the coming years, which is why it needs to increase capacity for both methods to be able to build those highly-complex processors.

Ever since AMD re-emerged as a major competitor within the x86 CPU scene, one of AMD’s top priorities has been to win over customers in the highly lucrative and profitable server market. It’s a strategy that’s paid off well for AMD, as while they’re still the minority player in the space, they’ve continued to whittle away at what was once Intel’s absolute control over the market, slowly converting more and more customers over to the EPYC ecosystem.

Now as the Zen 4 CPU architecture approaches its second birthday, AMD is launching one final line of EPYC chips, taking aim at yet another Xeon market segment. This time it’s all about the entry-level 1P server market – small scale, budget-conscientious users who only need a handful of CPU cores – which AMD is addressing with their new EPYC 4004 series processors.

Within AMD’s various product stacks, the new EPYC 4004 family essentially replaces Ryzen chips for use in servers. Ryzen for servers was never a dedicated product lineup within AMD, but none the less it has been a product segment within the company since 2019, with AMD aiming it at smaller-scale hosting providers who opted to use racks of consumer-scale hardware, rather than going the high-density route with high core count EPYC processors.

With the upgrade to EPYC status, that hardware ecosystem is being re-deployed as a proper lineup with dedicated chips, and a handful of additional features befitting an EPYC chip. Consequently, AMD is also expanding the scope of the market segments they’re targeting by a hair, roping in small business (SMB) users, whom AMD wasn’t previously chasing. Though regardless of the name on the market segment, the end result is that AMD is carving out a budget-priced series of EPYC chips with 4 to 16 cores based on their consumer platforms.

Underlying the new EPYC 4004 series is AMD’s tried and true AM5 platform and Raphael processors, which we know better as the Ryzen 7000 series. Their new EPYC counterparts are an 8 chip stack that is comprised almost entirely of rebranded Ryzen 7000 SKUs, with all the same core counts, clockspeeds, and TDPs as their counterparts. The sole exception here being the very cheapest chip of the bunch, the 4 core 4124P.

AMD EPYC 4004 Processors
AnandTech	Core/ Thread		Base Freq	1T Freq	L3 Cache	PCIe	Memory	TDP (W)	Price (1KU)	Ryzen Version
4584PX	16	32	4200	5700	128MB (3D)	28 x 5.0	2 x DDR5-5200 UDIMM	120	$699	7950X3D
4484PX	12	24	4400	5600	128MB (3D)			120	$599	7900X3D
4564P	16	32	4500	5700	64MB			170	$699	7950X
4464P	12	24	3700	5400	64MB			65	$429	7900
4364P	8	16	4500	5400	32MB			105	$399	7700X
4344P	8	16	3800	5300	32MB			65	$329	7700
4244P	6	12	3800	5100	32MB			65	$229	7600
4124P	4	8	3800	5100	16MB			65	$149	New

Since these are all based on AMD’s consumer discrete CPUs, the underlying architecture in all of these chips is Zen 4 throughout. So despite being positioned below the EPYC 8004 Siena series, you won’t find any Zen 4c CPU cores here; everything is full-fat Zen 4 CCDs. Which means that while there are relatively few cores overall (for an EPYC processor), they are all high-performing cores, with nothing turboing lower than 5.1GHz.

Notably here, AMD is mixing in some of their 3D V-Cache chip SKUs as well, which are signified with the “PX” suffix. Based on the 7950X3D and 7900X3D respectively, both of these chips have 1 CCD with V-Cache stacked on top of them, affording the chip a total of 128MB of L3 cache. The remaining 6 SKUs all get the “P” suffix – indicating they’re 1 socket processors – and come with TDPs ranging from 65 Watts to 170 Watts.

This does mean that, by EPYC server standards, the 4004 series is not particularly energy efficient. This is a lineup that is intended to be cost-effective first and foremost. Instead, energy efficiency remains the domain of the EPYC 8004, with its modestly-clocked many-core Zen4c designs.

The reuse of Zen 4/AM5 means that the EPYC 4004 series comes with all of the features we’ve come to expect from the platform, including 28 lanes of PCIe 5.0, 2 channels (128-bits) of DDR5 memory at speeds up to DDR5-5200, and even integrated graphics. Since this is a server part, ECC is officially supported on the chips – though do note that like the Ryzen Pro workstation chips, this is UDIMM-only; registered DIMMs (RDIMMs) are not supported.

AMD isn’t disclosing the chipset being paired with the EPYC 4004 processors, and while it’s undoubtedly going to be AMD’s favorite ASMedia-designed I/O chipset, it’s interesting to note that it’s at the motherboard level where the new EPYC platform’s real server credentials are at. Separating itself from rank-and-file Ryzens, the EPYC 4004 platform is getting several additional enterprise features, including baseboard management controller (BMC) support, software RAID (RAIDXpert2 for Server), and official server OS support. To be sure, this is still a fraction of the features found in a high-end enterprise solution like the EPYC 9004/8004 series, but it’s some additional functionality befitting of a platform meant to be used in servers.

AMD’s new chips, in turn, are designed to compete against Intel’s entry-level Xeon-E family. Itself a redress of consumer hardware (Raptor Lake), the Xeon-E family is a P-core only chip lineup, with Intel offering SKUs with 4, 6, or 8 CPU cores. This leaves the EPYC 4004 family somewhat uniquely positioned compared to the Xeon-E family, as Intel doesn’t have anything that’s a true counterpart to AMD’s 12 and 16 core chips; after Xeon-E comes the far more capable (and expensive) Xeon-w family. So part of AMD’s strategy with the EPYC 4004 family is to serve a niche that Intel does not.

(As a side bonus, AMD’s core counts also end up playing well with Windows Server 2022 licensing. The Standard license covers up to 16 cores, so a top-end EPYC 4004 chip lets server owners max out their license, amortizing the software cost over more cores)

With regards to performance, Raptor Lake versus Zen 4 is largely settled by now. So I won’t spend too much time on AMD’s (many) benchmark slides. But suffice it to say, with a significant core count advantage, AMD can deliver an equally significant performance advantage in highly multi-threaded workloads (though in that scenario, it does come with a similar spike in power consumption compared to the 95 Watt Intel chips).

Wrapping things up, AMD is launching the new EPYC 4004 product stack immediately. With many of AMD’s regular server partners already signed up – and the core hardware readily available – there won’t be much of a ramp-up period to speak of.