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xMEMS unveils revolutionary cooling SoC for AI devices

US-based xMEMS Labs has developed the XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing semiconductor micro-electro-mechanical systems (MEMS) technology. This innovative chip, acting like an "ice jacket" for AI chips, can be customized in size and intelligently controlled to meet specific cooling needs.

Credit: xMEMS

Generalplus forecasts automotive MCU growth in 2025 despite global economic uncertainties

Generalplus, a leading microcontroller (MCU) manufacturer, anticipates steady revenue growth despite ongoing global economic fluctuations. Yixing Jia, General Manager of Generalplus, identifies the consumer market as the most significant variable in the global economy.

General Manager of Generalplus, Yixing Jia. Credit: DIGITIMES

Lifespan of NEVs is less than half that of fuel vehicles, according to China's official trade-in measures

China's recent "Detailed Implementation Rules for Subsidies for Automobile Trade-ins" measure has shortened the lifespan of electric vehicles (EVs) eligible for scrapping to 6 years (registered before April 30, 2018), allowing owners to receive a subsidy of CNY7,000 for trading in their old vehicles to purchase new ones.

Credit: AFP

AMD's new game in town: US$4.9 billion bet to challenge Nvidia's AI dominance

In a bold move to bolster its position in the fiercely competitive AI and data center markets, AMD has acquired ZT Systems for US$4.9 billion. This strategic acquisition signals AMD's intent to close the gap with Nvidia and marks the latest in a series of acquisitions and corporate investments supporting its AI strategy.

Credit: AFP

Japan to reportedly subsidize firms to develop supply chain, independent of China in SEA

Fifteen Japanese companies plan to invest approximately JPY100 billion (US$680 million) in research, development, and equipment across Southeast Asia, focusing on the electric vehicle, semiconductor, and energy sectors. The Japanese government is reportedly set to subsidize around one-third of this investment.

Credit: Suzuki

Taiwan-based manufacturers anticipate Metalens adoption in iPhone 16

As smartphone camera resolutions continue to improve, lenses inevitably become thicker, impacting the weight of the devices. Market rumors suggest that Apple has been researching metalens technology over the past few years, with plans to initially use it to replace the plastic lenses in the iPad's Face ID system. Metalens technology could debut in the Face ID of the iPhone 16 Pro and flagship models as early as 2024.

Credit: DIGITIMES

Harnessing photons as the next frontier in information technology

There are four fundamental forces in nature, ranked from strongest to weakest: strong interactions, electromagnetic interactions, weak interactions, and gravity. While nuclear energy is associated with strong interaction, the advancements of 20th and 21st-century civilization have largely been driven by applications of electromagnetic interaction.

Credit: AFP

Wiwynn sues X for US$61 million over unpaid server parts amid shifts to consignment model

Wiwynn, a Taiwanese cloud infrastructure provider, is suing X (formerly Twitter) for US$61 million, alleging a breach of a 2014 purchase agreement due to non-payment for approximately US$120 million in server parts. This lawsuit comes as Wiwynn shifts to a new business model where customers purchase and store components in Wiwynn's warehouses before assembly.

Credit: AFP

Getac sees strong growth in rugged industrial computer orders, up 30-40%

James Huang, Chairman of Getac Technology (Getac), announced that by the end of 2025, all of Getac's rugged industrial computers will be equipped with NPUs (Neural Processing Units) to capitalize on AI-driven opportunities in the rugged industrial computer market. Huang expects that, under the influence of AI, the potential performance of Getac's rugged industrial computers could increase by 30-40%.

James Huang, Chairman of Getac. Credit: DIGITIMES

TSMC breaks ground on EUR10 billion semiconductor fab in Dresden

ESMC has commenced construction on a new semiconductor fabrication facility in Dresden, Germany. The joint venture between TSMC, Robert Bosch, Infineon, and NXP is investing over EUR10 billion (US$11 billion) to establish the EU's first FinFET-capable pure-play foundry. This facility is anticipated to enhance semiconductor manufacturing capabilities in Europe and generate significant employment opportunities.

Credit: AFP

ESMC breaks ground on Dresden fab

European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. The event brought together government officials, customers, suppliers, business partners and academia to celebrate a milestone in establishing what will be the EU's first-ever FinFET-capable pure-play foundry.

Credit: TSMC
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