Many chipmakers have disclosed delays or suspensions in their new European fab projects; however, TSMC's are proceeding more efficiently than those of their competitors.
TSMC Chairman C. C. Wei welcomes German Chancellor Olaf Scholz at Dresden plant. Credit: DIGITIMES
China-based foundries are rapidly expanding their capacity for mature logic IC processes, limiting local NOR production capability. As a result, global NOR flash supply and demand are close to equilibrium, with supply expected to be constrained in 2025, according to industry sources.
Since late July, there have been numerous speculations in the market that Nvidia's new generation Blackwell series roadmap has been adjusted. Reports suggest that the B100 models will be phased out, while the B200A will be launched as a degraded version. The B200 and GB200 releases will reportedly be postponed by one quarter.
TSMC has notified clients of a 3-8% price increase for its 5nm and 3nm process manufacturing in 2025 to reflect escalating costs, according to sources at IC design houses.
Winbond Electronics, a specialty DRAM and flash memory chipmaker, has begun ramping up its DDR4 chip output in the second half of 2024, with the memory output increase expected to boost its sales performance.
Japan has implemented additional tax incentives and other measures to vigorously pursue ambitious efforts aimed at rebuilding its semiconductor industry.
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.
Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to industry sources.
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics, and Intel in the advanced packaging field.
A fire recently broke out at Micron Technology's DRAM fab in Taichung, central Taiwan, prompting concerns among industry participants regarding the short-term pricing trend.
On June 7, AMD chairperson and CEO Lisa Su engaged in a dialogue on Artificial Intelligence (AI), accompanied by Acer chairman and CEO Jason Chen. Su talked about the importance of AI and the role Taiwan's industry supply chains will play.
DRAM spot prices will resume the same growth trend as contract prices after August, according to sources at Taiwan-based memory module manufacturers, who are optimistic about their operations in the second half of this year.
Despite a short-term correction in spot market prices for DRAM memory, contract prices will continue to rise in the second half of the year, according to memory module manufacturer Adata Technology.
Nvidia CEO Jensen Huang revealed two months ago, at a dinner party for Taiwanese partners in Silicon Valley, that he considers himself Taiwan's ambassador. Taiwan is positioned as a key player in the AI revolution, and all Taiwanese businesses must be prepared to effectively tell the "Taiwan story" to the rest of the world.
Supreme Electronics, which mostly sells memory chips, is optimistic about its operations in the second quarter of 2024, noting a seasonal increase in demand for handsets and PCs, as well as ongoing server demand strength.
ROM and flash memory maker Macronix International stayed in the red in the first quarter of 2024 with net losses amounting to NT$1.08 billion (US$33.2 million). Nevertheless, the chipmaker has seen overall client orders regain strength, according to company chairman Miin Wu.
Intel recently announced that its foundry operations, Intel Foundry, achieved a significant milestone in advanced semiconductor manufacturing by completing the assembly of the industry's first commercial high-numerical aperture extreme ultraviolet (High-NA EUV) lithography equipment, which is located at the company's R&D campus in Hillsboro, Oregon.
E-paper solutions provider E Ink Holdings (EIH) anticipates revenue will be at its lowest for 2024 in the first quarter of 2024 before increasing and sustaining growth through the final quarter of 2024.
Rumors persist that Apple is interested in investing in the development of the Apple Car. Recent speculations suggest that Project Titan, which has never been officially confirmed, might be terminated. According to industry sources, Apple's current main contract assembler, Hon Hai Technology Group (Foxconn), is not expected to be greatly affected despite its increasing emphasis on electric vehicles (EVs).
With TSMC's announcement in December 2023 that chairman Mark Liu will step down after the shareholder meeting in June 2024, the pure-play foundry has begun a new round of organizational restructuring.
On February 24, TSMC will hold an opening ceremony for its first fabrication facility in Japan, located in Kumamoto. The fab is scheduled to go online at the end of 2024.
IC design house Fitipower Integrated Technology anticipates that demand for peripheral ICs including display driver ICs and power management chips will be driven by AI and HPC device applications in 2024.
Inventory concerns that previously plagued Taiwanese MCU makers have gradually subsided over the last two quarters, but industry sources say the key question now is whether demand will resume.
At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more advanced processes between 2025 and 2027, including its first high-NA EUV process, 14A.
According to Young Liu, chairman of Hon Hai Technology (Foxconn), the Taiwan-based contract electronics vendor collaboration with Apple will be more extensive.
Niche memory IC design house Elite Semiconductor Memory Technology (ESMT) has stated that it is working on new AI product projects that will be a new growth engine, and demand for DDR4 products will increase this year.
China considers the third generation of semiconductors as the dominant industry that can outperform its global competitors. The silicon carbide (SiC) industry achieved significant long-term purchase agreements with several international automotive IDMs in 2023, thanks to government support spanning a decade. China plans to commence a price competition in 2024, as reported by sources within the supply chain.
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