BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development.

Onsemi plans to build a $2 billion silicon carbide production plant in the Czech Republic. The site would produce smart power semiconductors for electric vehicles, renewable energy technology, and data centers.

The global chip manufacturing industry is projected to boost capacity by 6% in 2024 and 7% in 2025, reaching 33.7 million 8-inch (200mm) wafers per month, according to SEMI‘s latest World Fab Forecast report. Leading-edge capacity for 5nm nodes and below is expected to grow by 13% in 2024, driven by AI demand for data center applications. Additionally, Intel, Samsung, and TSMC will begin producing 2nm chips using gate-all-around (GAA) FETs next year, boosting leading-edge capacity by 17% in 2025.

At the IEEE Symposium on VLSI Technology & Circuits, imec introduced:

• Functional CMOS-based CFETs with stacked bottom and top source/drain contacts.
• CMOS-based 56Gb/s zero-IF D-band beamforming transmitters to support next-gen short-range, high-speed wireless services at frequencies above 100GHz.
• ADCs for base stations and handsets, a key step toward scalable, high-performance beyond-5G solutions, such as cloud-based AI and extended reality apps.

Quick links to more news:

Global
In-Depth
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Global

Wolfspeed postponed plans to construct a $3 billion chip plant in Germany, underscoring the EU‘s challenges in boosting semiconductor production, reports Reuters. The North Carolina-based company cited reduced capital spending due to a weakened EV market, saying it now aims to start construction in mid-2025, two years later than 0riginally planned.

Micron is building a pilot production line for high-bandwidth memory (HBM) in the U.S., and considering HBM production in Malaysia to meet growing AI demand, according to a Nikkei report. The company is expanding HBM R&D facilities in Boise, Idaho, and eyeing production capacity in Malaysia, while also enhancing its largest HBM facility in Taichung, Taiwan.

Kioxia restored its Yokkaichi and Kitakami plants in Japan to full capacity, ending production cuts as the memory market recovers, according to Nikkei. The company, which is focusing on NAND flash production, has secured new bank credit support, including refinancing a ¥540 billion loan and establishing a ¥210 billion credit line. Kioxia had reduced output by more than 30% in October 2022 due to weak smartphone demand.

Europe’s NATO Innovation Fund announced its first direct investments, which includes semiconductor materials. Twenty-three NATO allies co-invested in this over $1B fund devoted to address critical defense and security challenges.

The second meeting of the U.S.–India Initiative on Critical and Emerging Technology (iCET) was held in New Delhi, with various funding and initiatives announced to support semiconductor technology, next-gen telecommunications, connected and autonomous vehicles, ML, and more.

Amazon announced investments of €10 billion in Germany to drive innovation and support the expansion of its logistics network and cloud infrastructure.

Quantum Machines opened the Israeli Quantum Computing Center (IQCC) research facility, backed by the Israel Innovation Authority and located at Tel Aviv University. Also, Israel-based Classiq is collaborating with NVIDIA and BMW, using quantum computing to find the optimal automotive architecture of electrical and mechanical systems.

Global data center vacancy rates are at historic lows, and power availability is becoming less available, according to a Siemens report featured on Broadband Breakfast. The company called for an influx of financing to find new ways to optimize data center technology and sustainability.

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In-Depth

Semiconductor Engineering published its Manufacturing, Packaging & Materials newsletter this week, featuring these top stories:

• Single Vs. Multi-Patterning Advancements For EUV
• Precise Control Of Copper Plating And CMP
• Ruthenium Interconnects On Tap
• Opportunities Grow For GPU Acceleration

More reporting this week:

• IC Industry’s Growing Role In Sustainability
• What’s Missing In Test

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Market Reports

Renesas completed its acquisition of Transphorm and will immediately start offering GaN-based power products and reference designs to meet the demand for wide-bandgap (WBG) chips.

Revenues for the top five wafer fab equipment (WFE) companies fell 9% YoY in Q1 2024, according to Counterpoint. This was offset partially by increased demand for NAND and DRAM, which increased 33% YoY, and strong growth in sales to China, which were up 116% YoY.

The SiC power devices industry saw robust growth in 2023, primarily driven by the BEV market, according to TrendForce. The top five suppliers, led by ST with a 32.6% market share and onsemi in second place, accounted for 91.9% of total revenue. However, the anticipated slowdown in BEV sales and weakening industrial demand are expected to significantly decelerate revenue growth in 2024. 

About 30% of vehicles produced globally will have E/E architectures with zonal controllers by 2032, according to McKinsey & Co. The market for automotive micro-components and logic semiconductors is predicted to reach $60 billion in 2032, and the overall automotive semiconductor market is expected to grow from $60 billion to $140 billion in the same period, at a 10% CAGR.

The automotive processor market generated US$20 billion in revenue in 2023, according to Yole. US$7.8 billion was from APUs and FPGAs and $12.2 billion was from MCUs. The ADAS and infotainment processors market was worth US$7.8 billion in 2023 and is predicted to grow to $16.4 billion by 2029 at a 13% CAGR. The market for ADAS sensing is expected to grow at a 7% CAGR.

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Security

The CHERI Alliance was established to drive adoption of memory safety and scalable software compartmentalization via the security technology CHERI, or Capability Hardware Enhanced RISC Instructions. Founding members include Capabilities Limited, Codasip, the FreeBSD Foundation, lowRISC, SCI Semiconductor, and the University of Cambridge.

In security research:

• Japan and China researchers explored a NAND-XOR ring oscillator structure to design an entropy source architecture for a true random number generator (TRNG).
• University of Toronto and Carleton University researchers presented a survey examining how hardware is applied to achieve security and how reported attacks have exploited certain defects in hardware.
• University of North Texas and Texas Woman’s University researchers explored the potential of hardware security primitive Physical Unclonable Functions (PUF) for mitigation of visual deepfakes.
• Villanova University researchers proposed the Boolean DERIVativE attack, which generalizes Boolean domain leakage.

Post-quantum cryptography firm PQShield raised $37 million in Series B funding.

Former OpenAI executive, Ilya Sutskever, who quit over safety concerns, launched Safe Superintelligence Inc. (SSI).

EU industry groups warned the European Commission that its proposed cybersecurity certification scheme (EUCS) for cloud services should not discriminate against Amazon, Google, and Microsoft, reported Reuters.

Cyber Europe tested EU cyber preparedness in the energy sector by simulating a series of large-scale cyber incidents in an exercise organized by the European Union Agency for Cybersecurity (ENISA).

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

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Education and Training

New York non-profit NY CREATES and South Korea’s National Nano Fab Center partnered to develop a hub for joint research, aligned technology services, testbed support, and an engineer exchange program to bolster chips-centered R&D, workforce development, and each nation’s high-tech ecosystem.

New York and the Netherlands agreed on a partnership to promote sustainability within the semiconductor industry, enhance workforce development, and boost semiconductor R&D.

Rapidus is set to send 200 engineers to AI chip developer Tenstorrent in the U.S. for training over the next five years, reports Nikkei. This initiative, led by Japan’s Leading-edge Semiconductor Technology Center (LSTC), aims to bolster Japan’s AI chip industry.

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Product News

UMC announced its 22nm embedded high voltage (eHV) technology platform for premium smartphone and mobile device displays. The 22eHV platform reduces core device power consumption by up to 30% compared to previous 28nm processes. Die area is reduced by 10% with the industry’s smallest SRAM bit cells.​

Alphawave Semi announced a new 9.2 Gbps HBM3E sub-system silicon platform capable of 1.2 terabytes per second. Based on the HBM3E IP, the sub-system is aimed at addressing the demand for ultra-high-speed connectivity in high-performance compute applications.

Movellus introduced the Aeonic Power product family for on-die voltage regulation, targeting the challenging area of power delivery.

Cadence partnered with Semiwise and sureCore to develop new cryogenic CMOS circuits with possible quantum computing applications. The circuits are based on modified transistors found in the Cadence Spectre Simulation Platform and are capable of processing analog, mixed-signal, and digital circuit simulation and verification at cryogenic temperatures.

Renesas launched R-Car Open Access (RoX), an integrated development platform for software-defined vehicles (SDVs), designed for Renesas R-Car SoCs and MCUs with tools for deployment of AI applications, reducing complexity and saving time and money for car OEMs and Tier 1s.

Infineon released industry-first radiation-hardened 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvolatile memory devices, with up to 120 years of data retention at 85-degree Celsius, along with random access and full memory write at bus speeds. Plus, a CoolGaN Transistor 700 V G4 product family for efficient power conversion up to 700 V, ideal for consumer chargers and notebook adapters, data center power supplies, renewable energy inverters, and more.

Ansys adopted NVIDIA’s Omniverse application programming interfaces for its multi-die chip designers. Those APIs will be used for 5G/6G, IoT, AI/ML, cloud computing, and autonomous vehicle applications. The company also announced ConceptEV, an SaaS solution for automotive concept design for EVs.

Fig. 1: Field visualization of 3D-IC with Omniverse. Source: Ansys

QP Technologies announced a new dicing saw for its manufacturing line that can process a full cassette of 300mm wafers 7% faster than existing tools, improving throughput and productivity.

NXP introduced its SAF9xxx of audio DSPs to support the demand for AI-based audio in software-defined vehicles (SDVs) by using Cadence’s Tensilica HiFi 5 DSPs combined with dedicated neural-network engines and hardware-based accelerators.

Avionyx, a provider of software lifecycle engineering in the aerospace and safety-critical systems sector, partnered with Siemens and will leverage its Polarion application lifecycle management (ALM) tool. Also, Dovetail Electric Aviation adopted Siemens Xcelerator to support sustainable aviation.

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Research

Researchers from imec and KU Leuven released a +70 page paper “Selecting Alternative Metals for Advanced Interconnects,” addressing interconnect resistance and reliability.

A comprehensive review article — “Future of plasma etching for microelectronics: Challenges and opportunities” — was created by a team of experts from the University of Maryland, Lam Research, IBM, Intel, and many others.

Researchers from the Institut Polytechnique de Paris’s Laboratory of Condensed Matter for Physics developed an approach to investigate defects in semiconductors. The team “determined the spin-dependent electronic structure linked to defects in the arrangement of semiconductor atoms,” the first time this structure has been measured, according to a release.

Lawrence Berkeley National Laboratory-led researchers developed a small enclosed chamber that can hold all the components of an electrochemical reaction, which can be paired with transmission electron microscopy (TEM) to generate precise views of a reaction at atomic scale, and can be frozen to stop the reaction at specific time points. They used the technique to study a copper catalyst.

The Federal Drug Administration (FDA) approved a clinical trial to test a device with 1,024 nanoscale sensors that records brain activity during surgery, developed by engineers at the University of California San Diego (UC San Diego).

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Events and Further Reading

Find upcoming chip industry events here, including:

Event	Date	Location
Standards for Chiplet Design with 3DIC Packaging (Part 2)	Jun 21	Online
DAC 2024	Jun 23 – 27	San Francisco
RISC-V Summit Europe 2024	Jun 24 – 28	Munich
Leti Innovation Days 2024	Jun 25 – 27	Grenoble, France
ISCA 2024	Jun 29 – Jul 3	Buenos Aires, Argentina
SEMICON West	Jul 9 – 11	San Francisco
Flash Memory Summit	Aug 6 – 8	Santa Clara, CA
USENIX Security Symposium	Aug 14 – 16	Philadelphia, PA
Hot Chips 2024	Aug 25- 27	Stanford University
Find All Upcoming Events Here

Upcoming webinars are here.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

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The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

By Adam Kovac, Karen Heyman, and Liz Allan.

India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan’s Powerchip. The second fab will be a joint investment between CG Power, Japan’s Renesas Electronics, and Thailand’s Stars Microelectronics. Tata will run the packaging facility, as well. India expects these efforts will add 20,000 advanced technology jobs and 60,000 indirect jobs, according to the Times of India. The country has been talking about building a fab for at least the past couple of decades, but funding never materialized.

The U.S. Department of Commerce (DoC) issued a CHIPS Act-based Notice of Funding Opportunity for R&D to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. The U.S. Secretary of Commerce said the government is prioritizing CHIPS Act funding for projects that will be operational by 2030 and anticipates America will produce 20% of the world’s leading-edge logic chips by the end of the decade.

The top three foundries plan to implement backside power delivery as soon as the 2nm node, setting the stage for faster and more efficient switching in chips, reduced routing congestion, and lower noise across multiple metal layers. But this novel approach to optimizing logic performance depends on advances in lithography, etching, polishing, and bonding processes.

Intel spun out Altera as a standalone FPGA company, the culmination of a rebranding and reorganization of its former Programmable Solutions Group. The move follows Intel’s decision to keep Intel Foundry at arm’s length, with a clean line between the foundry and the company’s processor business.

Multiple new hardware micro-architecture vulnerabilities were published in the latest Common Weakness Enumeration release this week, all related to transient execution (CWE 1420-1423).

The U.S. Office of the National Cyber Director (ONCD) published a technical report calling for the adoption of memory safe programming languages, aiming to reduce the attack surface in cyberspace and anticipate systemic security risk with better diagnostics. The DoC also is seeking information ahead of an inquiry into Chinese-made connected vehicles “to understand the extent of the technology in these cars that can capture wide swaths of data or remotely disable or manipulate connected vehicles.”

Quick links to more news:

Design and Power
Manufacturing and Test
Automotive
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Pervasive Computing and AI
Events

Design and Power

Micron began mass production of a new high-bandwidth chip for AI. The company said the HBM3E will be a key component in NVIDIA’s H2000 Tensor Core GPUs, set to begin shipping in the second quarter of 2024. HBM is a key component of 2.5D advanced packages.

Samsung developed a 36GB HBM3E 12H DRAM, saying it sets new records for bandwidth. The company achieved this by using advanced thermal compression non-conductive film, which allowed it to cram 12 layers into the area normally taken up by 8. This is a novel way of increasing DRAM density.

Keysight introduced QuantumPro, a design and simulation tool, plus workflow, for quantum computers. It combines five functionalities into the Advanced Design System (ADS) 2024 platform. Keysight also introduced its AI Data Center Test Platform, which includes pre-packaged benchmarking apps and dataset analysis tools.

Synopsys announced a 1.6T Ethernet IP solution, including 1.6T MAC and PCS Ethernet controllers, 224G Ethernet PHY IP, and verification IP.

Tenstorrent, Japan’s Leading-Edge Semiconductor Technology Center (LSTC) , and Rapidus are co-designing AI chips. LSTC will use Tenstorrent’s RISC-V and Chiplet IP for its forthcoming edge 2nm AI accelerator.

This week’s Systems and Design newsletter features these top stories:

• 2.5D Integration: Big Chip Or Small PCB: Defining whether a 5D device is a PCB shrunk to fit into a package or a chip that extends beyond the limits of a single die can have significant design consequences.
• Commercial Chiplets: Challenges of establishing a commercial chiplet.
• Accellera Preps New Standard For Clock-Domain Crossing: New standard aims to streamline the clock-domain crossing flow.
• Thinking Big: From Chips To Systems: Aart de Geus discusses the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices.
• Integration challenges for RISC-V: Modifying the source code allows for democratization of design, but it adds some hurdles for design teams (video).

Demand for high-end AI servers is driven by four American companies, which will account for 60% of global demand in 2024, according to Trendforce. NVIDIA is projected to continue leading the market, with AMD closing the gap due its lower cost model.

The EU consortium PREVAIL is accepting design proposals as it seeks to develop next-gen edge-AI technologies. Anchors include CEA-Leti, Fraunhofer-Gesellschaft, imec, and VTT, which will use their 300mm fabrication, design, and test facilities to validate prototypes.

Siemens joined an initiative to expand educational opportunities in the semiconductor space around the world. The Semiconductor Education Alliance was launched by Arm in 2023 and focuses on helping teach skills in IC design and EDA.

Q-CTRL announced partnerships with six firms that it says will expand access to its performance-management software and quantum technologies. Wolfram, Aqarios, and qBraid will integrate Q-CTRL’s Fire Opal technology into their products, while Qblox, Keysight, and Quantware will utilize Q-CTRL’s Boulder Opal hardware system.

NTT, Red Hat, NVIDIA, and Fujitsu teamed up to provide data pipeline acceleration and contain orchestration technologies targeted at real-time AI analysis of massive data sets at the edge.

Manufacturing and Test

The U.S. Department of Energy (DOE)’s Office of Electricity launched the American-Made Silicon Carbide (SiC)  Packaging Prize. This $2.25 million contest invites competitors to propose, design, build, and test state-of-the-art SiC semiconductor packaging prototypes.

Applied Materials introduced products and solutions for patterning issues in the “angstrom era,” including line edge roughness, tip-to-tip spacing limitations, bridge defects, and edge placement errors.

imec reported progress made in EUV processes, masks and metrology in preparation for high-NA EUV. It also identified advanced node lithography and etch related processes that contribute the most to direct emissions of CO2, along with proposed solutions.

proteanTecs will participate in the Arm Total Design ecosystem, which now includes more than 20 companies united around a charter to accelerate and simplify the development of custom SoCs based on Arm Neoverse compute subsystems.

NikkeiAsia took an in-depth look at Japan’s semiconductor ecosystem and concluded it is ripe for revival with investments from TSMC, Samsung, and Micron, among others. TrendForce came to a similar conclusion, pointing to the fast pace of Japan’s resurgence, including the opening of TSMC’s fab.

‍FormFactor closed its sale of its Suzhou and Shanghai companies to Grand Junction Semiconductor for $25M in cash.

The eBeam Initiative celebrated its 15th anniversary and welcomed a new member, FUJIFILM. The group also uncorked its fourth survey of its members technology using deep learning in the photomask-to-wafer manufacturing flow.

Automotive

Apple shuttered its electric car project after 10 years of development. The chaotic effort cost the company billions of dollars, according to The New York Times.

Infineon released new automotive programmable SoCs with fifth-gen human machine interface (HMI) technology, offering improved sensitivity in three packages. The MCU offers up to 84 GPIOs and 384 KB of flash memory. The company also released automotive and industrial-grade 750V G1 discrete SiC MOSFETs aimed at applications such as EV charging, onboard chargers, DC-DC converters, energy, solid state circuit breakers, and data centers.

Cadence expanded its Tensilica IP portfolio to boost computation for automotive sensor fusion applications. Vision, radar, lidar, and AI processing are combined in a single DSP for multi-modal, sensor-based system designs.

Ansys will continue translating fast computing into fast cars, as the company’s partnership with Oracle Red Bull Racing was renewed. The Formula 1 team uses Ansys technology to improve car aerodynamics and ensure the safety of its vehicles.

Lazer Sport adopted Siemens’ Xcelerator portfolio to connect 3D design with 3D printing for prototyping and digital simulation of its sustainable KinetiCore cycling helmet.

The chair of the U.S. Federal Communications Commission (FCC) suggested automakers that sell internet-connected cars should be subject to a telecommunications law aiming to protect domestic violence survivors, reports CNBC. This is due to emerging cases of stalking through vehicle location tracking technology and remote control of functions like locking doors or honking the horn.

BYD‘s CEO said the company does not plan to enter the U.S. market because it is complicated and electrification has slowed down, reports Yahoo Finance. Meanwhile, the first shipment of BYD vehicles arrived in Europe, according to DW News.

Ascent Solar Technologies’ solar module products will fly on NASA’s upcoming Lightweight Integrated Solar Array and AnTenna (LISA-T) mission.

Security

Researchers at Texas A&M University and the University of Delaware proposed the first red-team attack on graph neural network (GNN)-based techniques in hardware security.

A panel of four experts discuss mounting concerns over quantum security, auto architectures, and supply chain resiliency.

Synopsys released its ninth annual Open Source Security and Risk Analysis report, finding that 74% of code bases contained high-risk open-source vulnerabilities, up 54% since last year.

President Biden issued an executive order to prevent the large-scale transfer of Americans’ personal data to countries of concern. Types of data include genomic, biometric, personal health, geolocation, financial, and other personally identifiable information, which bad actors can use to track and scam Americans.

The National Institute of Standards and Technology (NIST) released Cybersecurity Framework (CSF) 2.0 to provide a comprehensive view for managing cybersecurity risk.

The EU Agency for Cybersecurity (ENISA) published a study on best practices for cyber crisis management, saying the geopolitical situation continues to impact the cyber threat landscape and planning for threats and incidents is vital for crisis management.

The U.S. Department of Energy (DOE) announced $45 million to protect the energy sector from cyberattacks.

The National Security Agency (NSA), the Federal Bureau of Investigation (FBI), and others published an advisory on Russian cyber actors using compromised routers.  Also the Cybersecurity and Infrastructure Security Agency (CISA), the UK National Cyber Security Centre (NCSC), and partners advised of tactics used by Russian Foreign Intelligence Service cyber actors to gain initial access into a cloud environment.

CISA, the FBI, and the Department of Health and Human Services (HHS) updated an advisory concerning the ALPHV Blackcat ransomware as a service (RaaS), which primarily targets the healthcare sector.

CISA also published a guide to support university cybersecurity clinics and issued other alerts.

Pervasive Computing and AI

Renesas expanded its RZ family of MPUs with a single-chip AI accelerator that offers 10 TOPS per watt power efficiency and delivers AI inference performance of up to 80 TOPS without a cooling fan. The chip is aimed at next-gen robotics with vision AI and real-time control.

Infineon launched dual-phase power modules to help data centers meet the power demands of AI GPU platforms. The company also released a family of solid-state isolators to deliver faster switching with up to 70% lower power dissipation.

Fig. 1: Infineon’s dual phase power modules: Source: Infineon

Amber Semiconductor announced a reference design for brushless motor applications using its AC to DC conversion semiconductor system to power ST‘s STM32 MCUs.

Micron released its universal flash storage (UFS) 4.0 package at just 9×13 mm, built on 232-layer 3D NAND and offering up to 1 terabyte capacity to enable next-gen phone designs and larger batteries.

LG and Meta teamed up to develop extended reality (XR) products, content, services, and platforms within the virtual space.

Microsoft and Mistral AI partnered to accelerate AI innovation and to develop and deploy Mistral’s next-gen large language models (LLMs).

Microsoft’s vice chair and president announced the company’s AI access principles, governing how it will operate AI datacenter infrastructure and other AI assets around the world.

Singtel and VMware partnered to enable enterprises to manage their connectivity and cloud infrastructure through the Singtel Paragon platform for 5G and edge cloud.

Keysight was selected as the Test Partner for the Deutsche Telekom Satellite NB-IoT Early Adopter Program, providing an end-to-end NB-IoT NTN testbed that allows designers and developers to validate reference designs for solutions using 3GPP Release 17 (Rel-17) NTN standards.

Global server shipments are predicted to increase by 2.05% in 2024, with AI servers accounting for about 12%, reports TrendForce. Also, the smartphone camera lens market is expected to rebound in 2024 with 3.8% growth driven by AI-smartphones, to reach about 4.22 billion units, reports TrendForce.

Yole released a smartphone camera comparison report with a focus on iPhone evolution and analysis of the structure, design, and teardown of each camera module, along with the CIS dimensions, technology node, and manufacturing processes.

Counterpoint released a number of 2023 reports on smartphone shipments by country and operator migrations to 5G.

Events

Find upcoming chip industry events here, including:

Event	Date	Location
International Symposium on FPGAs	Mar 3 – 5	Monterey, CA
DVCON: Design & Verification	Mar 4 – 7	San Jose, CA
ISES Japan 2024: International Semiconductor Executive Summit	Mar 5 – 6	Tokyo, Japan
ISS Industry Strategy Symposium Europe	Mar 6 – 8	Vienna, Austria
GSA International Semiconductor Conference	Mar 13 – 14	London
Device Packaging Conference (DPC 2024)	Mar 18 – 21	Fountain Hills, AZ
GOMACTech	Mar 18 – 21	Charleston, South Carolina
SNUG Silicon Valley	Mar 20 – 21	Santa Clara, CA
All Upcoming Events

Upcoming webinars are here, including topics such as digital twins, power challenges in data centers, and designing for 112G interface compliance.

Further Reading and Newsletters

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.