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Maximizing Energy Efficiency For Automotive Chips

Silicon chips are central to today’s sophisticated advanced driver assistance systems, smart safety features, and immersive infotainment systems. Industry sources estimate that now there are over 1,000 integrated circuits (ICs), or chips, in an average ICE car, and twice as many in an average EV. Such a large amount of electronics translates into kilowatts of power being consumed – equivalent to a couple of dishwashers running continuously. For an ICE vehicle, this puts a lot of stress on the vehicle’s electrical and charging system, leading automotive manufacturers to consider moving to 48V systems (vs. today’s mainstream 12V systems). These 48V systems reduce the current levels in the vehicle’s wiring, enabling the use of lower cost smaller-gauge wire, as well as delivering higher reliability. For EVs, higher energy efficiency of on-board electronics translates directly into longer range – the primary consideration of many EV buyers (second only to price). Driver assistance and safety features often employ redundant component techniques to ensure reliability, further increasing vehicle energy consumption. Lack of energy efficiency for an EV also means more frequent charging, further stressing the power grid and producing a detrimental effect on the environment. All these considerations necessitate the need for a comprehensive energy-efficient design methodology for automotive ICs.

What’s driving demand for compute power in cars?

Classification and processing of massive amounts of data from multiple sources in automotive applications – video, audio, radar, lidar – results in a high degree of complexity in automotive ICs as software algorithms require large amounts of compute power. Hardware architectural decisions, and even hardware-software partitioning, must be done with energy efficiency in mind. There is a plethora of tradeoffs at this stage:

  • Flexibility of a general-purpose CPU-based architecture vs. efficiency of a dedicated digital signal processor (DSP) vs. a hardware accelerator
  • Memory sub-system design: how much is required, how it will be partitioned, how much precision is really needed, just to name a few considerations

In order to enable reliable decisions, architects must have access to a system that models, in a robust manner, power, performance, and area (PPA) characteristics of the hardware, as well as use cases. The idea is to eliminate error-prone estimates and guesswork.

To improve energy efficiency, automotive IC designers also must adopt many of the power reduction techniques traditionally used by architects and engineers in the low-power application space (e.g. mobile or handheld devices), such as power domain shutoff, voltage and frequency scaling, and effective clock and data gating. These techniques can be best evaluated at the hardware design level (register transfer level, or RTL) – but with the realistic system workload. As a system workload – either a boot sequence or an application – is millions of clock cycles long, only an emulation-based solution delivers a practical turnaround time (TAT) for power analysis at this stage. This power analysis can reveal intervals of wasted power – power consumption bugs – whether due to active clocks when the data stream is not active, redundant memory access when the address for the read operation doesn’t change for many clock cycles (and/or when the address and data input don’t change for the write operation over many cycles), or unnecessary data toggles while clocks are gated off.

To cope with the huge amount of data and the requirement to process that data in real time (or near real time), automotive designers employ artificial intelligence (AI) algorithms, both in software and in hardware. Millions of multiply-accumulate (MAC) operations per second and other arithmetic-intensive computations to process these algorithms give rise to a significant amount of wasted power due to glitches – multiple signal transitions per clock cycle. At the RTL stage, with the advanced RTL power analysis tools available today, it is possible to measure the amount of wasted power due to glitches as well as to identify glitch sources. Equipped with this information, an RTL design engineer can modify their RTL source code to lower the glitch activity, reduce the size of the downstream logic, or both, to reduce power.

Working together with the RTL design engineer is another critical persona – the verification engineer. In order to verify the functional behavior of the design, the verification engineer is no longer dealing just with the RTL source: they also have to verify the proper functionality of the global power reduction techniques such as power shutoff and voltage/frequency scaling. Doing so requires a holistic approach that leverages a comprehensive description of power intent, such as the Unified Power Format (UPF). All verification technologies – static, formal, emulation, and simulation – can then correctly interpret this power intent to form an effective verification methodology.

Power intent also carries through to the implementation part of the flow, as well as signoff. During the implementation process, power can be further optimized through physical design techniques while conforming to timing and area constraints. Highly accurate power signoff is then used to check conformance to power specifications before tape-out.

Design and verification flow for more energy-efficient automotive SoCs

Synopsys delivers a complete end-to-end solution that allows IC architects and designers to drive energy efficiency in automotive designs. This solution spans the entire design flow from architecture to RTL design and verification, to emulation-driven power analysis, to implementation and, ultimately, to power signoff. Automotive IC design teams can now put in place a rigorous methodology that enables intelligent architectural decisions, RTL power analysis with consistent accuracy, power-aware physical design, and foundry-certified power signoff.

The post Maximizing Energy Efficiency For Automotive Chips appeared first on Semiconductor Engineering.

Design Tool Think Tank Required

When I was in the EDA industry as a technologist, there were three main parts to my role. The first was to tell customers about new technologies being developed and tool extensions that would be appearing in the next release. These were features they might find beneficial both in the projects they were undertaking today, and even more so, would apply to future projects. Second, I would try and find out what new issues they were finding, or where the tools were not delivering the capabilities they required. This would feed into tool development planning. And finally, I would take those features selected by the marketing team for implementation and try to work out how best to implement them if it wasn’t obvious to the development teams.

By far the most difficult task out of the three was getting new requirements from customers. Most engineers have their heads down, concentrating on getting their latest chip out. When you ask them about new features, the only thing they offer are their current pain points. These usually involve incremental features or bugs, where the workaround is disliked, or insufficient performance.

Thirty years ago, when I first started doing that role, there were dedicated methodology groups within the larger companies whose job it was to develop flows and methodologies for future projects. This would appear to be the ideal people to ask, but in many cases they were so disconnected from the development team that what they asked for would never actually be used by the development team. These groups were idealists who wanted to instill revolutionary changes, whereas the development teams wanted evolutionary tools. The furthest many of those developments went was pilot projects that never became mainstream.

It seems as if the industry needs a better path to get requirements into the EDA companies. This used to be defined by the ITRS, which would look forward and project the new capabilities that would be required and the timeframes for them. That no longer exists. Today, standards are being driven by semiconductor companies. This is a change from the past, where we used to see the EDA companies driving the developments done within groups like Accellera. When I look at their recent undertakings, most of them are driven by end users.

Getting a standards group started today happens fairly late in the process. It implies an immediate need, but does not really allow time for solutions to be developed ahead of time. It appears that a think tank is required where the industry can discuss issues and problems for which new tool development is required. That can then be built into the EDA roadmaps so that the technology becomes available when it is needed.

One such area is power analysis. I have been writing stories about how important power and energy is becoming and may indeed soon become the limiter for many of the most complex designs. Some of the questions I always ask are:

  • What tools are being developed for doing power analysis of software?
  • How can you calculate the energy consumed for a given function?
  • How can users optimize a design for power or energy?

I rarely get straight answers to any of these questions. Instead, I’m often given vague ideas about how a user could do this in a manual fashion given the tools currently available.

I was beginning to think I was barking up the wrong tree and perhaps these were not legitimate concerns. My sanity was restored by a comment on one of my recent power related stories. Allan Cantle, OCP HPC Sub-Project Leader at Open Compute Project Foundation, wrote: “While it’s great to see articles like this highlight the need for us all to focus on energy centric computing, the sad news is that our tools don’t report energy in any obvious way to show the stupid architectural mistakes we often make from an energy consumption perspective. We are solving all the problems from a bottoms-up perspective by bringing things closer together. While that does bring tremendous energy efficiency benefits, it also creates massively increasing energy density. There is so much low-hanging fruit from a top-down system architecture approach that the industry is missing because we need to think outside the box and across our silos.”

Cantle went on to say: “A trivial improvement in tools that report energy consumption as a first-class metric will make it far easier for us to understand and rectify the mistakes we make as we build new energy-centric, domain-specific computers for each application. Alternatively, the silicon gods that rule our industry would be wise to take a step backward and think about the problem from a systems level perspective.”

I couldn’t agree more, and I find it frustrating that no EDA company seems to be listening. I am sure part of the problem is that the large customers are working on their own internal solutions, and they feel it will provide them with a competitive advantage. Until it becomes clear that all of their competitors have similar solutions, and that they no longer get an advantage from it, then they will look to transfer those solutions to the EDA companies so they do not have to maintain them. The EDA companies will then start to fight to make the solution they have acquired the standard. It all takes a long time.

In partial defense of the EDA companies, they are facing so many new issues these days that they are spread very thin dealing with new nodes, 2.5D, 3D, shift left, multi-physics, AI algorithms – to name just a few. They already spend more on R&D than most technology companies as a percentage of revenue.

Perhaps Accellera could start to include discussion forums in events like DVCon. This would allow for an open discussion about the problems they need to have solved. Perhaps they could start to produce the EDA equivalent of the old ITRS roadmap. It sure would save a lot of time and energy (pun intended).

The post Design Tool Think Tank Required appeared first on Semiconductor Engineering.

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