Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys’ recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys’ president and CEO, said in an interview that the sale of the software group “gives us the ability to have management bandwidth, capital, and to double down on what we’re doing in our core business.”

The U.S. Commerce Department reportedly pulled export licenses from Intel and Qualcomm that permitted them to ship semiconductors to Huawei, the Financial Times reported. The move comes after advanced chips from Intel reportedly were used in new laptops and smartphones from the China-based company. 

Apple debuted its second-generation 3nm M4 chip with the launch of the new iPad Pro. The CPU and GPU each have up to 10 cores, with a neural engine capable of 38 TOPS, and a total of 28 billion transistors. Apple also is working with TSMC to develop its own AI processors for running software in data centers, reports The Wall Street Journal.

The U.S. is expected to triple its semiconductor manufacturing capacity by 2032, according to a new report by the Semiconductor Industry Association and Boston Consulting. By that year, the U.S. is projected to have 28% of global capacity for advanced logic manufacturing and over a quarter of total global capital expenditures.

Fig. 1: Source: Semiconductor Industry Association and Boston Consulting Group.

Quick links to more news:

Global
Market Reports
Automotive
Security
Product News
Education and Training
Research
In-Depth
Events
Further Reading

Around The Globe

The U.S. Commerce Department plans to solicit bids from organizations interested in creating and managing a new CHIPS Manufacturing USA institute focused on digital twins in the semiconductor sector. The government will award up to $285 million to the selected proposal.

The U.S. National Science Foundation and Department of Energy announced the first 35 projects to be supported with computational time through the National Artificial Intelligence Research Resource (NAIRR) Pilot. The initial selected projects will gain access to several U.S. supercomputing centers and other resources, with the goal of advancing responsible AI research.

Through its new Federal AI Sandbox, MITRE is offering up its computing power to U.S. government agencies. “Our new Federal AI Sandbox will help level the playing field, making the high-quality compute power needed to train and test custom AI solutions available to any agency,” stated Charles Clancy, MITRE, senior vice president and chief technology officer, in the release.

Saudi Arabia’s $100 billion investment fund for semiconductor and AI technology pledged it would divest from China if requested by the U.S, reported Bloomberg.

Japan’s SoftBank is holding talks with UK-based AI Chip firm Graphcore about a possible acquisition, reports Bloomberg.

India’s chip industry is heating up. Mindgrove launched the country’s first SoC, named Secure IoT. The chip clocks at 700 MHz, and the company is touting its key security algorithms, secure boot, and on-chip OTP memory. Meanwhile, Lam Research is expanding its global semiconductor fabrication supply chain to include India.

Microsoft will build a $3.3 billion AI data center in Racine, Wisconsin, the same location as the failed Foxconn investment touted six years ago.

Markets And Money

The SIA announced first-quarter global semiconductor sales grew more than 15% YoY, still 5.7% below Q4 2023, but a big improvement over last year. Consider that the semiconductor materials market contracted 8.2% in 2023 to $66.7 billion, down from a record $72.7 billion in 2022, according to a new report from SEMI.

The demand for AI-powered consumer electronics will drive global AI chipset shipments to 1.3 billion by 2030, according to ABI Research.

TrendForce released several new industry reports this week. Among the highlights:

• HBM prices are expected to increase by up to 10% in 2025, representing more than 30% of total DRAM value.
• In Q2, DRAM contract prices rose 13% to 18%, while NAND flash prices increased 15% to 20%.
• The top 10 design firms’ combined revenue increased 12% in 2023, with NVIDIA taking the lead for the first time.

A number of acquisitions were announced recently:

• High-voltage IC company, Power Integrations, will purchase the assets of Odyssey Semiconductor Technologies, a developer of gallium nitride (GaN) transistors.
• Mobix Labs agreed to buy RF design company RaGE Systems for $20 million in cash, stock, and incentives.
• V-Tek, a packaging services and inspection company, acquired A&J Programming, a manufacturer of automated handling and programming equipment.

The global smartphone market grew 6% year-over-year, shipping 296.9 million units in Q124, according to a Counterpoint report.  Samsung toppled Apple for the top spot with a 20% share.

Automotive

U.S. Justice Department is investigating whether Tesla committed securities or wire fraud for misleading consumers and investors about its EV’s autopilot capabilities, according to Reuters.

The automotive ecosystem is undergoing a huge transformation toward software-defined vehicles, spurring new architectures that can be future-proofed and customized with software.

Infineon introduced a microcontroller for the automotive battery management sector, integrating high-precision analog and high-voltage subsystems on a single chip. Infineon also inked a deal with China’s Xiaomi to provide SiC power modules for Xiaomi’s new SU7 smart EV.

Keysight and ETAS are teaming up to embed ETAS fuzz testing software into Keysight’s automotive cybersecurity platform.

Also, Keysight’s device security research lab, Riscure Security Solutions, can now conduct vehicle type approval evaluations under United Nations R155/R156 regulations. Keysight acquired Riscure in March.

Two autonomous driving companies received big funding. British AI company Wayve received a $1.05 billion Series C investment from SoftBank, with contributions from NVIDIA and Microsoft. Hyundai spent an additional $475 million on Motional, according its recent earnings report.

The automotive imaging market grew to U.S. $5.7 billion in 2023 due to increased production, autonomy demand, and higher-resolution offerings.

Automotive Grade Linux (AGL), a collaborative cross-industry effort developing an open source platform for all Software-Defined Vehicles (SDVs), released cloud-native functionality, RISC-V architecture and flutter applications.

Security

SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts to heterogeneous systems in package, where chiplets frequently have their own memory hierarchy.

Machine learning is being used by hackers to find weaknesses in chips and systems, but it also is starting to be used to prevent breaches by pinpointing hardware and software design flaws.

txOne Networks, provider of Cyber-Physical Systems security, raised $51 million in Series B extension round of funding.

The U.S. Department of Justice charged a Russian national with his role as the creator, developer and administrator of the LockBit, a prolific ramsomware group, that allegedly stole $100 million in payments from 2,000 victims.

The Cybersecurity and Infrastructure Security Agency (CISA) launched “We Can Secure Our World,” a new public awareness program promoting “basic cyber hygiene” and the agency also issues a number of alerts/advisories.

Product News

Siemens unveiled its Solido IP Validation Suite software, an automated quality assurance product designed to work across all design IP types and formats. The suite includes Solido Crosscheck and IPdelta software, which both provide in-view, cross-view and version-to-version QA checks.

proteanTecs announced its lifecycle monitoring solution is being integrated into SAPEON’s new AI processors.

SpiNNcloud Systems revealed their SpiNNaker2 system, an event-based AI platform supercomputer containing chips that are a mesh of 152 ARM-based cores. The platform has the ability to emulate 10 billion neurons while still maintaining power efficiency and reliability.

Ansys partnered with Schrodinger to develop new computational materials. The collaboration will see Schrodinger’s molecular modeling technology used in Ansys’ simulation tools to evaluate performance ahead of the prototype phase.

Keysight introduced a pulse generator to its handheld radio frequency analyzer software options. The Option 357 pulse generator is downloadable on B- and C-Series FieldFox analyzers.

Education and Training

Semiconductor fever is hitting academia:

• Penn State discussed its role in leading 15 universities to drive advances in chip integration and packaging.
• Georgia Tech’s explained its research is happening at all the levels of the “semiconductor stack,” touting its 28,500 square feet of academic cleanroom space.
• And in the past month Purdue University, Dassault Systems and Lam Research expanded an existing deal to use virtual twins and simulation tools in workforce development.

Arizona State University is beefing up their technology programs with a new bachelor’s and doctoral degree in robotics and autonomous systems.

Microsoft is partnering with Gateway Technical College in Wisconsin to create a Data Center Academy to train Wisconsinites for data center and STEM roles by 2030.

Research

Stanford-led researchers used ordinary-appearing glasses for an augmented reality headset, utilizing waveguide display techniques, holographic imaging, and AI.

UC Berkeley, LLNL, and MIT engineered a miniaturized on-chip energy storage and power delivery, using an atomic-scale approach to modify electrostatic capacitors.

ORNL and other researchers observed a “surprising isotope effect in the optoelectronic properties of a single layer of molybdenum disulfide” when they substituted heavier isotope of molybdenum in the crystal.

Three U.S. national labs are partnering with NVIDIA to develop advanced memory technologies for high performance computing.

In-Depth

In addition to this week’s Automotive, Security and Pervasive Computing newsletter, here are more top stories and tech talk from the week:

• Communication Is Key To Finding And Fixing Bugs In ICs
• Can Models Created With AI Be Trusted?
• Adapting To Evolving IC Requirements

Events

Find upcoming chip industry events here, including:

Event	Date	Location
ASMC: Advanced Semiconductor Manufacturing Conference	May 13 – 16	Albany, NY
ISES Taiwan 2024: International Semiconductor Executive Summit	May 14 – 15	New Taipei City
Ansys Simulation World 2024	May 14 – 16	Online
Women In Semiconductors	May 16	Albany, NY
European Test Symposium	May 20 – 24	The Hague, Netherlands
NI Connect Austin 2024	May 20 – 22	Austin, Texas
ITF World 2024 (imec)	May 21 – 22	Antwerp, Belgium
Embedded Vision Summit	May 21 – 23	Santa Clara, CA
ASIP Virtual Seminar 2024	May 22	Online
Electronic Components and Technology Conference (ECTC) 2024	May 28 – 31	Denver, Colorado
Hardwear.io Security Trainings and Conference USA 2024	May 28 – Jun 1	Santa Clara, CA
Find All Upcoming Events Here

Upcoming webinars are here.

Further Reading

Read the latest special reports and top stories, or check out the latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys’ recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys’ president and CEO, said in an interview that the sale of the software group “gives us the ability to have management bandwidth, capital, and to double down on what we’re doing in our core business.”

The U.S. Commerce Department reportedly pulled export licenses from Intel and Qualcomm that permitted them to ship semiconductors to Huawei, the Financial Times reported. The move comes after advanced chips from Intel reportedly were used in new laptops and smartphones from the China-based company. 

Apple debuted its second-generation 3nm M4 chip with the launch of the new iPad Pro. The CPU and GPU each have up to 10 cores, with a neural engine capable of 38 TOPS, and a total of 28 billion transistors. Apple also is working with TSMC to develop its own AI processors for running software in data centers, reports The Wall Street Journal.

The U.S. is expected to triple its semiconductor manufacturing capacity by 2032, according to a new report by the Semiconductor Industry Association and Boston Consulting. By that year, the U.S. is projected to have 28% of global capacity for advanced logic manufacturing and over a quarter of total global capital expenditures.

Fig. 1: Source: Semiconductor Industry Association and Boston Consulting Group.

Quick links to more news:

Global
Market Reports
Automotive
Security
Product News
Education and Training
Research
In-Depth
Events
Further Reading

Around The Globe

The U.S. Commerce Department plans to solicit bids from organizations interested in creating and managing a new CHIPS Manufacturing USA institute focused on digital twins in the semiconductor sector. The government will award up to $285 million to the selected proposal.

The U.S. National Science Foundation and Department of Energy announced the first 35 projects to be supported with computational time through the National Artificial Intelligence Research Resource (NAIRR) Pilot. The initial selected projects will gain access to several U.S. supercomputing centers and other resources, with the goal of advancing responsible AI research.

Through its new Federal AI Sandbox, MITRE is offering up its computing power to U.S. government agencies. “Our new Federal AI Sandbox will help level the playing field, making the high-quality compute power needed to train and test custom AI solutions available to any agency,” stated Charles Clancy, MITRE, senior vice president and chief technology officer, in the release.

Saudi Arabia’s $100 billion investment fund for semiconductor and AI technology pledged it would divest from China if requested by the U.S, reported Bloomberg.

Japan’s SoftBank is holding talks with UK-based AI Chip firm Graphcore about a possible acquisition, reports Bloomberg.

India’s chip industry is heating up. Mindgrove launched the country’s first SoC, named Secure IoT. The chip clocks at 700 MHz, and the company is touting its key security algorithms, secure boot, and on-chip OTP memory. Meanwhile, Lam Research is expanding its global semiconductor fabrication supply chain to include India.

Microsoft will build a $3.3 billion AI data center in Racine, Wisconsin, the same location as the failed Foxconn investment touted six years ago.

Markets And Money

The SIA announced first-quarter global semiconductor sales grew more than 15% YoY, still 5.7% below Q4 2023, but a big improvement over last year. Consider that the semiconductor materials market contracted 8.2% in 2023 to $66.7 billion, down from a record $72.7 billion in 2022, according to a new report from SEMI.

The demand for AI-powered consumer electronics will drive global AI chipset shipments to 1.3 billion by 2030, according to ABI Research.

TrendForce released several new industry reports this week. Among the highlights:

• HBM prices are expected to increase by up to 10% in 2025, representing more than 30% of total DRAM value.
• In Q2, DRAM contract prices rose 13% to 18%, while NAND flash prices increased 15% to 20%.
• The top 10 design firms’ combined revenue increased 12% in 2023, with NVIDIA taking the lead for the first time.

A number of acquisitions were announced recently:

• High-voltage IC company, Power Integrations, will purchase the assets of Odyssey Semiconductor Technologies, a developer of gallium nitride (GaN) transistors.
• Mobix Labs agreed to buy RF design company RaGE Systems for $20 million in cash, stock, and incentives.
• V-Tek, a packaging services and inspection company, acquired A&J Programming, a manufacturer of automated handling and programming equipment.

The global smartphone market grew 6% year-over-year, shipping 296.9 million units in Q124, according to a Counterpoint report.  Samsung toppled Apple for the top spot with a 20% share.

Automotive

U.S. Justice Department is investigating whether Tesla committed securities or wire fraud for misleading consumers and investors about its EV’s autopilot capabilities, according to Reuters.

The automotive ecosystem is undergoing a huge transformation toward software-defined vehicles, spurring new architectures that can be future-proofed and customized with software.

Infineon introduced a microcontroller for the automotive battery management sector, integrating high-precision analog and high-voltage subsystems on a single chip. Infineon also inked a deal with China’s Xiaomi to provide SiC power modules for Xiaomi’s new SU7 smart EV.

Keysight and ETAS are teaming up to embed ETAS fuzz testing software into Keysight’s automotive cybersecurity platform.

Also, Keysight’s device security research lab, Riscure Security Solutions, can now conduct vehicle type approval evaluations under United Nations R155/R156 regulations. Keysight acquired Riscure in March.

Two autonomous driving companies received big funding. British AI company Wayve received a $1.05 billion Series C investment from SoftBank, with contributions from NVIDIA and Microsoft. Hyundai spent an additional $475 million on Motional, according its recent earnings report.

The automotive imaging market grew to U.S. $5.7 billion in 2023 due to increased production, autonomy demand, and higher-resolution offerings.

Automotive Grade Linux (AGL), a collaborative cross-industry effort developing an open source platform for all Software-Defined Vehicles (SDVs), released cloud-native functionality, RISC-V architecture and flutter applications.

Security

SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts to heterogeneous systems in package, where chiplets frequently have their own memory hierarchy.

Machine learning is being used by hackers to find weaknesses in chips and systems, but it also is starting to be used to prevent breaches by pinpointing hardware and software design flaws.

txOne Networks, provider of Cyber-Physical Systems security, raised $51 million in Series B extension round of funding.

The U.S. Department of Justice charged a Russian national with his role as the creator, developer and administrator of the LockBit, a prolific ramsomware group, that allegedly stole $100 million in payments from 2,000 victims.

The Cybersecurity and Infrastructure Security Agency (CISA) launched “We Can Secure Our World,” a new public awareness program promoting “basic cyber hygiene” and the agency also issues a number of alerts/advisories.

Product News

Siemens unveiled its Solido IP Validation Suite software, an automated quality assurance product designed to work across all design IP types and formats. The suite includes Solido Crosscheck and IPdelta software, which both provide in-view, cross-view and version-to-version QA checks.

proteanTecs announced its lifecycle monitoring solution is being integrated into SAPEON’s new AI processors.

SpiNNcloud Systems revealed their SpiNNaker2 system, an event-based AI platform supercomputer containing chips that are a mesh of 152 ARM-based cores. The platform has the ability to emulate 10 billion neurons while still maintaining power efficiency and reliability.

Ansys partnered with Schrodinger to develop new computational materials. The collaboration will see Schrodinger’s molecular modeling technology used in Ansys’ simulation tools to evaluate performance ahead of the prototype phase.

Keysight introduced a pulse generator to its handheld radio frequency analyzer software options. The Option 357 pulse generator is downloadable on B- and C-Series FieldFox analyzers.

Education and Training

Semiconductor fever is hitting academia:

• Penn State discussed its role in leading 15 universities to drive advances in chip integration and packaging.
• Georgia Tech’s explained its research is happening at all the levels of the “semiconductor stack,” touting its 28,500 square feet of academic cleanroom space.
• And in the past month Purdue University, Dassault Systems and Lam Research expanded an existing deal to use virtual twins and simulation tools in workforce development.

Arizona State University is beefing up their technology programs with a new bachelor’s and doctoral degree in robotics and autonomous systems.

Microsoft is partnering with Gateway Technical College in Wisconsin to create a Data Center Academy to train Wisconsinites for data center and STEM roles by 2030.

Research

Stanford-led researchers used ordinary-appearing glasses for an augmented reality headset, utilizing waveguide display techniques, holographic imaging, and AI.

UC Berkeley, LLNL, and MIT engineered a miniaturized on-chip energy storage and power delivery, using an atomic-scale approach to modify electrostatic capacitors.

ORNL and other researchers observed a “surprising isotope effect in the optoelectronic properties of a single layer of molybdenum disulfide” when they substituted heavier isotope of molybdenum in the crystal.

Three U.S. national labs are partnering with NVIDIA to develop advanced memory technologies for high performance computing.

In-Depth

In addition to this week’s Automotive, Security and Pervasive Computing newsletter, here are more top stories and tech talk from the week:

• Communication Is Key To Finding And Fixing Bugs In ICs
• Can Models Created With AI Be Trusted?
• Adapting To Evolving IC Requirements

Events

Find upcoming chip industry events here, including:

Event	Date	Location
ASMC: Advanced Semiconductor Manufacturing Conference	May 13 – 16	Albany, NY
ISES Taiwan 2024: International Semiconductor Executive Summit	May 14 – 15	New Taipei City
Ansys Simulation World 2024	May 14 – 16	Online
Women In Semiconductors	May 16	Albany, NY
European Test Symposium	May 20 – 24	The Hague, Netherlands
NI Connect Austin 2024	May 20 – 22	Austin, Texas
ITF World 2024 (imec)	May 21 – 22	Antwerp, Belgium
Embedded Vision Summit	May 21 – 23	Santa Clara, CA
ASIP Virtual Seminar 2024	May 22	Online
Electronic Components and Technology Conference (ECTC) 2024	May 28 – 31	Denver, Colorado
Hardwear.io Security Trainings and Conference USA 2024	May 28 – Jun 1	Santa Clara, CA
Find All Upcoming Events Here

Upcoming webinars are here.

Further Reading

Read the latest special reports and top stories, or check out the latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

NBC News reports that carmaker Hyundai has paused its ads on Twitter, citing the presence of neo-Nazi material alongside its own posts.

"We have paused our ads on X and are speaking to X directly about brand safety to ensure this issue is addressed," Hyundai said in the statement. 

— Read the rest

The post Hyundai suspends advertising on Twitter after Nazi material runs with ads appeared first on Boing Boing.

By Adam Kovac, Gregory Haley, and Liz Allan.

Cadence plans to acquire BETA CAE Systems for $1.24 billion, the latest volley in a race to sell multi-physics simulation and analysis across a broad set of customers with deep pockets. Cadence said the deal opens the door to structural analysis for the automotive, aerospace, industrial, and health care sectors. Under the terms of the agreement, 60% of the purchase would be paid in cash, and the remainder in stock.

South Korea’s National Intelligence Service reported that North Korea was targeting cyberattacks at domestic semiconductor equipment companies, using a “living off the land” approach, in which the attacker uses minimal malware to attack common applications installed on the server. That makes it more difficult to spot an attack. According to the government, “In December last year, Company A, and in February this year, Company B, had their configuration management server and security policy server hacked, respectively, and product design drawings and facility site photos were stolen.”

As the memory market goes, so goes the broader chip industry. Last quarter, and heading into early 2024, both markets began showing signs of sustainable growth. DRAM revenue jumped 29.6% in Q4 for a total of $17.46 billion. TrendForce attributed some of that to  new efforts to stockpile chips and strategic production control. NAND flash revenue was up 24.5% in Q4, with solid growth expected to continue into the first part of this year, according to TrendForce. Revenue for the sector topped $11.4 billion in Q4, and it’s expected to grow another 20% this quarter. SSD prices rebounded in Q4, as well, up 15% to $23.1 billion. Across the chip industry, sales grew 15.2% in January compared to the same period in 2023, according to the Semiconductor Industry Association (SIA). This is the largest increase since May 2022, and that trend is expected to continue throughout 2024 with double-digit growth compared to 2023.

Marvell said it is working with TSMC to develop a technology platform for the rapid deployment of analog, mixed-signal, and foundational IP. The company plans to sell both custom and commercial chiplets at 2nm.

The Dutch government is concerned that ASML, the only maker of EUV/high-NA EUV lithography equipment in the world, is considering leaving the Netherlands, according to De Telegraaf.

Quick links to more news:

Design and Power
Manufacturing and Test
Automotive and Batteries
Security
Pervasive Computing and AI
Events

Design and Power

AMD appears to have hit a roadblock with the U.S. Department of Commerce (DoC) over a new AI chip it designed for the Chinese market, as reported by Bloomberg. U.S. officials told the company the new chip is too powerful to be sold without a license.

JEDEC released its new memory standard as a free download on its website. The JESD239 Graphics Double Data Rate SGRAM can reach speeds of 192 GB/s and improve signal-to-noise ratio.

Accellera rolled out its IEEE Std. 1800‑2023 Standard for SystemVerilog—Unified Hardware Design, Specification, and Verification Language, which is now available for free download. The decision to offer it at no cost is due to Accellera’s participation in the IEEE GET Program, which was founded in 2010 with the intention of providing  open access to some standards. Accellera also announced it had approved for release the Verilog-AMS 2023 standard, which offers enhancements to analog constructs, dynamic tolerance for event control statements, and other upgrades.

Chiplets are a hot topic these days. Six industry experts discuss chiplet standards, interoperability, and the need for highly customized AI chiplets.

Optimizing EDA hardware for the cloud can shorten the time required for large and complex simulations, but not all workloads will benefit equally, and much more can be done to improve those that can.

Flex Logix is developing InferX DSP for use with existing EFLX eFPGA from 40nm to 7nm. InferX achieves about 30 times the DSP performance/mm² than eFPGA.

The number of challenges is growing in power semiconductors, just as it is in traditional chips. This tech talk looks at integrating power semiconductors with other devices, different packaging impacts, and how these devices will degrade over time.

Vultr announced it will use NVIDIA’s HGX H100 GPU clusters to expand its Seattle-based cloud data center. The company said the expansion, which will be powered by hydroelectricity, will make the facility one of the cleanest, most power efficient data centers in the country.

Amazon Web Services will expand its presence in Saudi Arabia, announcing a new $5.3 billion infrastructure region in the country that will launch in 2026. The new region will offer developers, entrepreneurs and companies access to healthcare, education and other services.

Google is teaming up with the Geneva Science and Diplomacy Anticipator (GESDA) to launch the XPRIZE Quantum Applications, with a $5 million in prizes for winners who can demonstrate ways to use quantum computing to solve real-world problems. Teams must submit a proposal that includes analysis of how long their algorithm would need to run before reaching a solution to a problem, such as improving drug development or designing new battery materials.

South Korea’s nepes corporation has turned to Siemens EDA for solutions in the development of advanced 3D-IC packages. The deal will see nepes incorporating several Siemens technologies, including the Calibre nmPlatform, Hyperlynx software and Xpedition Substrate Integrator software.

Siemens also formalized a partnership with Nuclei System Technology in which the pair of companies will work together on solution support for Nuclei’s RISC-V processor cores. The collaboration will allow clients to monitor CPU program execution in real-time via Nuclei’s RISC-V CPU Ips.

Keysight and ETS-Lindgren announced a breakthrough test solution for cellular devices using non-terrestrial networks. The solution is capable of measuring and validating the performance of both the transmitter and receiver of devices capable of supporting the network.

Nearly fifty companies raised $800 million for power electronics, data center interconnects, and more last month.

Manufacturing and Test

SEMI Europe issued a position statement to the European Union, warning against additional export controls or rules on foreign investment. SEMI argued that free trade partnerships are a better method for ensuring security than bans or restrictions.

Revenues for the top five wafer fab equipment manufacturers declined 1% YoY in 2023 to $93.5 billion, according to Counterpoint Research. The drop was attributed to weak spending on memory, inventory adjustments, and low demand in consumer electronics. The tide is changing, though.

Bruker closed two acquisitions. One involved Chemspeed Technologies, a Switzerland-based provider of automated laboratory R&D and QC workflow solutions. The second involved Phasefocus, an image processing company based in the UK.

A Swedish company, SCALINQ, released a commercially available large-scale packaging solution capable of controlling quantum devices with hundreds of qubits.

Solid Sands, a provider of testing and qualification technology for compilers and libraries, will partner with California-based Emprog to establish a representative presence in the U.S.

Automotive

Tesla halted production at its Brandenberg, Germany, gigafactory after an environmental activist group attacked an electricity pylon, reports the Guardian.

Stellantis will invest €5.6 billion (~$6.1B) in South America to support more than 40 new products, decarbonization technologies, and business opportunities.

The amount of data being collected, processed, and stored in vehicles is exploding, and so is the value of that data. That raises questions that are still not fully answered about how that data will be used, by whom, and how it will be secured.

While industry experts expect many benefits of V2X technology, technological and social hurdles to cross. But there is progress.

Infineon released its next-gen silicon carbide (SiC) MOSFET trench technology with 650V and 1,200V options improving stored energies and charges by up to 20%, ideal for power semiconductor applications such as photovoltaics, energy storage, DC EV charging, motor drives, and industrial power supplies.

Hyundai selected Ansys to supply structural simulation solutions for vehicle body system analysis, providing end-to-end, predictively accurate capabilities for virtual performance validation.

ION Mobility used the Siemens Xcelerator portfolio for styling, mechanical engineering, and electric battery pack development for its ION M1-S electric motorbike.

Ethernovia sampled a family of automotive PHY transceivers that scale from 10 Gbps to 1 Gbps over 15 meters of automotive cabling.

The California Public Utilities Commission (CPUC) approved Waymo’s plan to expand its driverless robotaxi services to Los Angeles and other cities near San Francisco, reports Reuters.

By 2027, next-gen battery EVs (BEVs) will on average be cheaper to produce than comparable gas-powered cars, reports Gartner. But the firm noted that average cost of EV accident repair will rise by 30%, and 15% of EV companies founded in the last decade will be acquired or bankrupt.

University of California San Diego (UCSD) researchers developed a cathode material for solid-state lithium-sulfur batteries that is electrically conductive and structurally healable.

ION Storage Systems announced its anodeless and compressionless solid-state batteries (SSBs) achieved 125 cycles with under 5% capacity degradation in performance. ION has been working with the U.S. Department of Defense (DoD) to test its SSB before expanding into markets such as EVs, energy storage, consumer electronics, and aerospace.

Security

Advanced process nodes and higher silicon densities are heightening DRAM’s susceptibility to Rowhammer attacks, as reduced cell spacing significantly decreases the hammer count needed for bit flips. A multi-layered, system-level approach is crucial to DRAM protection.

Researchers at Bar-Ilan University and Rafael Defense Systems proposed an analytical electromagnetic model for IC shielding against hardware attacks.

Keysight acquired the IP of Firmalyzer, whose firmware security analysis technology will be integrated into the Keysight IoT Security Assessment and Automotive Security solutions, providing analysis into what is happening inside the IoT device itself.

Flex Logix joined the Intel Foundry U.S. Military Aerospace Government (USMAG) Alliance, ensuring U.S. defense industrial base and government customers have access to the latest technology, enabling successful designs for mission critical programs.

The EU Council presidency and European Parliament reached a provisional agreement on a Cyber Solidarity Act and an amendment to the Cybersecurity Act (CSA) concerning managed security services.

The EU Agency for Cybersecurity (ENISA) and partners updated the compendium on elections cybersecurity in response to issues such as AI deep fakes, hacktivists-for-hire, the sophistication of threat actors, and the current geopolitical context.

The Cybersecurity and Infrastructure Security Agency (CISA) launched efforts to help secure the open source software ecosystem; updated its Public Safety Communications and Cyber Resiliency Toolkit; and issued other alerts including security advisories for VMware, Apple, and Cisco.

Pervasive Computing and AI

Johns Hopkins University engineers used natural language prompts and ChatGPT4 to produce detailed instructions to build a spiking neural network (SNN) chip. The neuromorphic accelerators could power real-time machine intelligence for next-gen embodied systems like autonomous vehicles and robots.

The global AI hardware market size was estimated at $53.71 billion in 2023, and is expected to reach about $473.53 billion by 2033, at a compound annual growth rate of 24.5%, reports Precedence Research.

National Institute of Standards and Technology (NIST) researchers and partners built compact chips capable of converting light into microwaves, which could improve navigation, communication, and radar systems.

Fig. 1: NIST researchers test a chip for converting light into microwave signals. Pictured is the chip, which is the fluorescent panel that looks like two tiny vinyl records. The gold box to the left of the chip is the semiconductor laser that emits light to the chip. Credit: K. Palubicki/NIST

The Indian government is investing 103 billion rupees ($1.25B) in AI projects, including computing infrastructure and large language models (LLMs).

Infineon is collaborating with Qt Group, bringing Qt’s graphics framework to Infineon’s graphics-enabled TRAVEO T2G cluster MCUs to optimize graphical user interface (GUI) development.

Keysight leveraged fourth-generation AMD EPYC CPUs to develop a new benchmarking methodology to test mobile and 5G private network performance. The method uses realistic traffic generation to uncover a CPU’s true power and scalability while observing bandwidth requirements.

The AI industry is pushing a nuclear power revival, reports NBC, and Amazon bought a nuclear-powered data center in Pennsylvania from Talen Energy for $650 million, according to WNEP.

Bank of America was awarded 644 patents in 2023 for technology including information security, AI, machine learning (ML), online and mobile banking, payments, data analytics, and augmented and virtual reality (AR/VR).

Mistral AI’s large language model, Mistral Large, became available in the Snowflake Data Cloud for customers to securely harness generative AI with their enterprise data.

China’s smartphone unit sales declined 7% year over year in the first six weeks of 2024, with Apple declining 24%, reports Counterpoint.

Shipments of LCD TV panels are expected to reach 55.8 million units in Q1 2024, a 5.3% quarter over quarter increase, reports TrendForce. And an estimated 5.8 billion LED lamps and luminaires are expected to reach the end of their lifespan in 2024, triggering a wave of secondary replacements and boosting total LED lighting demand to 13.4 billion units.

Korea Institute of Science and Technology (KIST) researchers mined high-purity gold from electrical and electronic waste.

The San Diego Supercomputer Center (SDSC) and the University of Utah launched a National Data Platform pilot project, aimed at making access to and use of scientific data open and equitable.

Events

Find upcoming chip industry events here, including:

Event	Date	Location
ISS Industry Strategy Symposium Europe	Mar 6 – 8	Vienna, Austria
GSA International Semiconductor Conference	Mar 13 – 14	London
Device Packaging Conference (DPC 2024)	Mar 18 – 21	Fountain Hills, AZ
GOMACTech	Mar 18 – 21	Charleston, South Carolina
SNUG Silicon Valley	Mar 20 – 21	Santa Clara, CA
SEMICON China	Mar 20 – 22	Shanghai
OFC: Optical Communications & Networking	Mar 24 – 28	Virtual; San Diego, CA
DATE: Design, Automation and Test in Europe Conference	Mar 25 – 27	Valencia, Spain
SEMI Therm	Mar 25- 28	San Jose, CA
MemCon	Mar 26 – 27	Silicon Valley
All Upcoming Events

Upcoming webinars are here.

Further Reading and Newsletters

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

The amount of data being collected, processed, and stored in vehicles is exploding, and so is the value of that data. That raises questions that are still not fully answered about how that data will be used, by whom, and how it will be secured.

Automakers are competing based on the latest versions of advanced technologies such as ADAS, 5G, and V2X, but the ECUs, software-defined vehicles, and in-cabin monitoring also demand more and more data, and they are using that data for purposes that extend beyond just getting the vehicle from point A to point B safely. They now are vying to offer additional subscription-based services according to customers’ interests, as various entities, including insurance companies, indicate a willingness to pay for information on drivers’ habits.

Collecting this data can help OEMs gain insights and potentially generate additional revenue. However, gathering it raises privacy and security concerns about who will own this massive amount of data and how it should be managed and used. And as automotive data use increases, how will it impact future automotive design?

Fig. 1: Connected vehicles rely on software to communicate between vehicles and the cloud. Source: McKinsey & Co.

“Much of the data generated in the vehicle will have immense value to OEMs and their partners for analyzing driver behavior and vehicle performance and for developing new or enhanced features,” said Sven Kopacz, autonomous vehicle section manager at Keysight Technologies. “On the other hand, the privacy of data use can be viewed as a risk to some. But the real value – as already implemented and used by Tesla and others – is the constant feedback to improve those ADAS algorithms, enable a CI/CD DevOps software development model, and allow the rapid download of updates. Only time will tell if law enforcement and the courts will demand this data and how lawmakers will respond.”

Types of data generated
According to Precedence Research, the global automotive data market size will grow from $2.19 billion in 2022 to $14.29 billion by 2032, with many types of data collected, including:

• Autonomous driving: Data on all levels, from L1 to L5, including that collected from the multiple sensors installed on vehicles.
• Infrastructure: Remote monitoring, OTA updates, and data used for remote control by control centers, V2X, and traffic patterns.
• Infotainment: Information on how customers are using applications, such as voice control, gesture, maps, and parking.
• Connected information: Information on payment to third-party parking apps, accident information, data from dashboard cameras, handheld devices, mobile applications, and driver behavior monitoring.
• Vehicle health: Repair and maintenance records, insurance underwriting, fuel consumption, telematics.

This information may be useful for future automotive design, predictive maintenance, and safety improvements, and insurance companies are expected to be able to reduce underwriting costs with more comprehensive information on accidents. Based on the information collected, OEMs should be able to design more reliable and safer cars, and to stay in close touch with customer wants. For example, experiments can be conducted to gauge customer demand for subscription-based services such as automatic parking and more sophisticated voice input and commands.

“Diagnostic data for service and repair has been a core of automotive data analytics for decades,” noted Lorin Kennedy, senior staff product management manager for SLM in-field analytics at Synopsys. “With the advent of connected vehicles and advanced machine learning (ML) analytics, which enable a greater quantity of data to be routinely processed, this data has gained exponentially in value. As data drives feature enhancements such as mobile-like experiences and advanced driver assist capabilities, OEMs increasingly need to better understand the dependability and reliability of the semiconductor systems powering these new features. The collection of monitoring and sensor data from electronic components and the semiconductors themselves will be a growing diagnostic data requirement across all types of automotive technologies like ADAS, IVI, ECUs, etc. to ensure quality and reliability on these more advanced nodes.”

Anticipated updates to ISO 26262 regulations regarding the application of predictive maintenance to hardware, identifying degrading intermittent faults caused by silicon aging, and over-stress conditions in the field are areas to be addressed, as well. Those can include silicon lifecycle management (SLM) technologies, which can deliver more comprehensive knowledge about the health and remaining useful life of silicon as it ages.

“That knowledge, in turn, will enable service updates and future OTA releases that leverage additional semiconductor compute power,” Kennedy said. “Overall fleet performance will benefit, and the semiconductor and system design process will, too, as new insights help achieve greater efficiencies. OEM, Tier One, and semiconductor supplier collaboration on what the data brings to light – from silicon to software system performance – will enable vehicles to meet the functional safety design parameters that are becoming increasingly crucial in advanced electronics.”

Still, for data generated in vehicles, OEMs will need to prioritize which data can provide value for drivers immediately, and which data should be sent to the cloud via 5G connections.

“Tradeoffs between on-board processing to reduce data volume and data transmission network costs will likely dictate prioritization,” Keysight’s Kopacz said. “For example, camera, lidar, and radar sensor data for ADAS applications may have value for training ADAS algorithms, but the volume of raw data will be very costly to transmit and store. Likewise, driver attention data can have high value in UI design, and would be best gathered in a meta-data form. V2X data has a relatively lower data volume and should ultimately be a key data source for ADAS, providing in-car non-line-of-sight visibility of other vehicles, road infrastructure, and road conditions. Sharing this over V2N links can enable effective safety applications, but angle random walk (ARW) sensor data needs to be considered more carefully due to its complex nature. Infotainment streaming content into the vehicle also can be a valuable revenue stream for OEMs, and the content providers as well, as network operators working together.”

Impacts on automotive cybersecurity
As vehicles become more autonomous and connected, data use will increase, and so will the value of that data. This raises cybersecurity and data privacy concerns. Hackers want to steal personal data collected by the vehicles, and can use ransomware and other attacks to do so. The idea of taking control of vehicles — or worse, stealing them — also attracts hackers. Techniques used include hacking vehicle apps and wireless connections on the vehicles (diagnostics, key fob attacks and keyless jamming). Protecting data access, vehicles, and infrastructure from attacks is increasingly important and challenging.

Cybersecurity risks increase with software-defined vehicles. Memory especially will need to be safeguarded.

“The integration of advanced technology into EVs poses significant cybersecurity challenges that demand immediate attention and sophisticated solutions,” said Ilia Stolov, center head of secure memory solution at Winbond. “Central to the digital fortresses within modern electronic platforms are flash non-volatile memories, housing invaluable assets like code, private data, and company credentials. Unfortunately, their ubiquity has rendered them attractive targets for hackers seeking unauthorized access to sensitive information.”

Stolov noted that Winbond has been actively working to secure flash memory from hacks.

Additionally, there are important considerations in securing memory designs, such as:

• DICE root of trust: The Device Identifier Composition Engine (DICE) should be used to create the secure flash root of trust for hardware security. This secure identity forms the basis for building trust in the hardware. Other security measures can therefore rely on the authenticity and integrity of the boot code, protecting against firmware and software attacks. The initial boot process and subsequent software execution are based on trusted and verified measurements, helping prevent the injection of malicious code into the system.
• Code and data protection: Protecting code and data is crucial for maintaining system-wide integrity. Unauthorized modifications to code or data can lead to malfunctions, system instability, or the introduction of malicious code, compromising the hardware’s intended functionality or exploiting system vulnerabilities.
• Authentication protocols: Authentication is a fundamental and crucial component of cybersecurity, serving as the frontline defense against unauthorized access and potential security breaches. Employing authentication protocols to restrict access to authorized actors and approved software layers only using cryptography credentials is important.
• Secure software updates with rollback protection: Regular updates extend beyond bug fixes including remote firmware over-the-air (OTA) updates, guards against rollback attacks, and ensures the execution of only legitimate updates.
• Post-quantum cryptography: Anticipating the post-quantum computing era to include NIST 800-208 Leighton-Micali Signature (LMS) cryptography safeguards EVs against the potential threats posed by future quantum computers.
• Platform resiliency: Automatic detection of unauthorized code changes enables swift recovery to a secure state, effectively thwarting potential cyber threats. Adhering to NIST 800-193 recommendations for platform resiliency ensures a robust defense mechanism.
• Secure supply chain: Guaranteeing the origin and integrity of flash content throughout the supply chain, these secure flash devices prevent content tampering and misconfiguration during platform assembly, transportation, and configuration. This, in turn, safeguards against cyber adversaries.

Considering the transition to SDVs and connected cars, data vulnerability becomes even more significant.

“Depending on where data resides, different protection measures are in place,” said Keysight’s Kopacz. “Intrusion detection systems (IDS), crypto services, and key management are becoming standard solutions in vehicles. Especially sensitive data for safety features needs to be protected and verified. Thus, redundancy becomes more relevant. With SDVs, the vehicle software is constantly updated or changed throughout the entire vehicle life cycle. Ever-evolving cyber threats are particularly challenging. Accordingly, the entire vehicle software must be continuously checked for new security gaps. OEMs are going to need comprehensive testing solutions to minimize security threats. This will need to include the cybersecurity testing of the entire attack surface, covering all vehicle interfaces – wired vehicle communication networks such as CAN or automotive Ethernet or wireless connections via Wi-Fi, Bluetooth, or cellular communications. OEMs will also need to test the backend that provides over-the-air (OTA) software updates. Such solutions can reduce the risk of damage or data theft by cybercriminals.”

Data management and privacy concerns
Another issue to be resolved is how the massive amount of data collected will be managed and used. Ideally, data will be analyzed to yield commercial value without causing privacy concerns. For example, infotainment platform data might reveal what types of music are most popular, helping the music industry to improve marketing strategies. Who will monitor the transfer of such data, though? How will customers be made aware of the data collection? And will they have an opportunity to opt out of having their data sold?

As with airplanes, vehicle black boxes are installed to record information for analysis of the data after an accident occurs. The information recorded includes vehicle speed, the braking situation, and the activation of air bags, among other things. If an accident occurs resulting in a fatality, and the data from ADAS and ECU uncover vulnerability in the designs, could that data be used as evidence in court against manufacturers or their supply chains? Armed with this information, the insurance industry may decline claims. Would one or more manufacturers of the ADAS/ECU be required to hand over the data when ordered by the authorities?

“Quality requirements for sophisticated electronic parts will continue to become more rigid and strict, allowing only a few defective parts per billion (DPPB) due to the impact failed components can have on the safety and well-being of human life,” noted Guy Cortez, senior staff product management manager for SLM analytics at Synopsys. “SLM data analytics will continue to play a substantial role in the health, maintainability, and sustainability of these devices throughout their life within the vehicle. Through the power of analytics, you can do proper root cause analysis of any failed device (e.g., return merchandise authorization, or RMA). What’s more, you will also be able to find ‘like’ devices that ultimately may exhibit similar failed behavior over time. Thus empowered, you can proactively recall these like devices before they fail during operation in the field. Upon further analysis, the device(s) in question may require a design re-spin by the device developer in order to correct any identified issue. With a proper SLM solution deployed throughout the automotive ecosystem, you can achieve a higher level of predictability, and thus higher quality and safety for the automotive manufacturer and consumer.”

OEM impact
While modern cars have been described as computers on wheels, they are now more like mobile phones on wheels. OEMs are designing cars that do not skimp on features. Semi-autonomous driving, voice-controlled infotainment systems, and the monitoring of many functions—including driver behavior— are yielding a large amount of data. While that data can be used to improve future designs. OEMs’ approaches to security and privacy vary, with some offering stronger security and privacy protection than others.

Mercedes-Benz is paying attention to data security and privacy, and is compliant to UN ECE R155 / R156, a European norm for cybersecurity and software update management systems, according to the company. Which data is processed in connection with digital vehicle services depends on which services the customer selects. Only the data required for the respective service will be processed. Additionally, the “Mercedes me connect” app’s terms of use and privacy information make it transparent for customers to see what data is needed for and how it is processed. Customers can determine which services they want to use.

Hyundai indicated it would follow a user-centric focus, prioritizing safety, information security, and data privacy with fault-tolerant software architectures to enhance cybersecurity. Hyundai Motor Group’s global software center, 42dot, is currently developing integrated hardware/software security solutions that detect and block data tampering, hacking, and external cyber threats, as well as abnormal communication using big data and AI algorithms.

And according to the BMW Group, the company manages a connected fleet of more than 20 million vehicles globally. More than 6 million vehicles are updated over-the-air on a regular basis. Together with other services, more than 110 terabytes of data traffic per day are processed between the connected vehicles and cloud-backend. All BMW vehicle interfaces permit consumers to opt in or out of various types of data collection and processing that may happen on their vehicles. If preferred, BMW customers may opt out of all optional data collection relating to their vehicles at any time by visiting the BMW iDrive screen in their vehicle. Additionally, to completely stop the transfer of any data from BMW vehicles to BMW services, customers can contact the company to request that the embedded SIM on their vehicles be disabled.

Not all OEMs hold the same philosophy on privacy. According to a study on 25 brands conducted by the Mozilla Foundation, a nonprofit organization, 56% will share data with law enforcement in response to an informal request, 84% share or sell personal data, and 100% earned the foundation’s “privacy not included” warning label.

More importantly, are customers educated or informed on the privacy issue?

Fig. 2: Once data is collected from a vehicle, it can go to multiple destinations without the knowledge of customers. Source: Mozilla, *Privacy Not Included.

Applying data to automotive design in the future
OEMs collect many different types of automotive data in relation to autonomous driving, infrastructure, infotainment, connected vehicles, and vehicle health and maintenance. The ultimate goal, however, is not just to compile massive raw data; rather, it is to extract value from it. One of the questions OEMs need to ask is how to apply technology to extract information that is really useful in future automotive design.

“OEMs are trying to test and validate the various functions of their vehicles,” said David Fritz, vice president of virtual and hybrid systems at Siemens EDA. “This can involve millions of terabytes of data. Sometimes, a huge portion of the data is redundant and useless. The real value in the data is, once it gets distilled, that it’s in a form where humans can relate to the meaning of the data, and it also can be pushed into the systems while they’re being developed and tested and before the vehicles are even on the ground. We’ve known for quite some time that many countries and regulatory bodies around the world have been collecting what they call an accident database. When an accident occurs, the police show up on the scene collecting relevant data. ‘There was an intersection here, a stop sign there. And this car was traveling in this direction roughly this many miles an hour. The weather condition is this. The car entered the intersection in the yellow light and caused an accident, etc.’ This is an accident scenario. Technologies are available to take those scenarios and put them in a standard form called Open Scenario. Based on the information, a new set of data can be generated to determine what the sensors would be seeing in those accident situations, and then push it through both a virtual version of the vehicle and environment and in the future, and push those scenarios through the sensors in this physical vehicle itself. This is really the distillation of that data into a form that a human can wrap their mind around. Otherwise, you could collect billions of terabytes of raw data and try to push that into these systems, and it wouldn’t actually help you any more than if someone were sitting in a car and dragging those for billions of miles.”

But that data also can be very useful. “If an OEM wants to obtain safety certification, say in Germany, the OEM can provide a set of data of scenarios on how the vehicle will navigate,” Fritz said. “An OEM can provide a set of data to the German authority, with a set of scenarios to prove the vehicle will navigate in a safe manner under various conditions. By comparing that with the data in the accident database, the German government can say that as long as you avoid 95% of the accidents in that database, you’re certified. That’s actionable from the perspectives of human drivers, insurance, engineering, and visual simulation. The data prove the vehicle is going to behave as expected. The alternative is to drive around, as in the case of autonomous vehicles, and try to justify the accident was not caused by the vehicle, while facing the lawsuit. It does not seem to make sense, but that’s what’s happening today.”

Related Reading
Curbing Automotive Cybersecurity Attacks
A growing number of standards and regulations within the automotive ecosystem promises to save developments costs by fending off cyberattacks.
Software-Defined Vehicles Ready To Roll
New approach could have big effects on cost, safety, security, and time to market.

The post Increased Automotive Data Use Raises Privacy, Security Concerns appeared first on Semiconductor Engineering.