One of the big challenges for IC test is making sense of mountains of data, a direct result of more features being packed onto a single die, or multiple chiplets being assembled into an advanced package. Collecting all that data through various agents and building models on the tester no longer makes sense for a couple reasons — there is too much data, and there are multiple customers using the same equipment. Steve Zamek, director of product management at PDF Solutions, and Eli Roth, product manager at Teradyne, explain how to optimize testing around different data sources, how to partition that data between the edge and the cloud, and how to ensure it remains secure.

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