Samsung has released an update to the Samsung Health Monitor app in India, which brings the Irregular Heart Rhythm Notification (IHRN) feature to the Galaxy Watch 4 (and probably all newer Galaxy Watches). This brings one more health-related feature to Galaxy Watch 4 users in the country.

Galaxy Watch 4 gets Irregular Hearth Rhythm Notification feature in India via Samsung Health Monitor

Samsung has released a new update (version 1.3.4.004) to the Samsung Health Monitor app with a download size of 58.54MB (via Yash Agarwal). It brought the Irregular Heart Rhythm Notification (IHRN) feature to the Galaxy Watch 4 and the Galaxy Watch 4 Classic. Once the Samsung Health Monitor app's newest version is installed on your Galaxy smartphone, you can open the app to find a new pop-up window that notifies you about the IHRN feature.

This new feature is only available for Wear OS-based Galaxy Watches. Since the Samsung Health Monitor app is compatible with all Wear OS-based Galaxy Watches, the new feature might be available to the Galaxy Watch 5 series, Galaxy Watch 6 series, Galaxy Watch 7, and Galaxy Watch Ultra.

Earlier this year, Samsung released the Samsung Health Monitor app in India to bring blood pressure and ECG features to Galaxy Watches in the country.

The story continues after our Galaxy Watch 7 hands-on video.

How to activate Irregular Heart Rhythm Notification (IHRN) feature on Galaxy Watches?

To activate the Irregular Heart Rhythm Notification (IHRN) feature on your Wear OS-based Galaxy Watch, follow the steps listed below.

1. Open the Samsung Health Monitor app on your Galaxy phone and navigate to the ECG tab.
2. Click the three-dot icon on the top-right corner of the screen and then tap on Settings.
3. Tap on Notifications and then enable the Irregular Heart Rhythm toggle.

You will now receive notifications when your Galaxy Watch detects an irregular heart rhythm. A few times a day, when you are still, the Galaxy Watch will check your pulse. If it detects one hour of an irregular heart rhythm, it might indicate Atrial Fibrillation (A.Fib). If you get the IHRN notification, take your ECG reading immediately from the Samsung Health Monitor app and contact your doctor or an appropriate health clinic for consultation.

Thanks for the tip, Yash!

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 PUBG Mobile was restricted in India last September as the public authority considered it to be a security danger. In any case, the game designer had declared back in November that it would bring back the PUBG Mobile to the Indian market. A week ago, the authority YouTube channel for the game posted a video inadvertently which implied towards an unavoidable dispatch of PUBG Mobile in the country. Additionally, a standard was two or three days prior proposing that PUBG Mobile will be renamed Battlegrounds Mobile India around there. All things considered, after all the dramatization, PUBG Mobile has at long last made a rebound to the Indian market today as Battlegrounds Mobile India.

Recently, the authority site for Battlegrounds Mobile India went live, following which, Krafton, the game's designer, reported the uncover of the game in the Indian market. While we actually don't a careful date when the game will be free to download, the site page says that it is "Coming Soon," proposing that it could dispatch in the coming weeks. 

As indicated by Krafton, it will team up with accomplices to assemble "an esports environment while getting game substance consistently, beginning with a progression of India-explicit in-game occasions at dispatch." The official statement noticed that Battlegrounds Mobile India will dispatch as an allowed to-play game. There will, in any case, be a pre-enlistment before its dispatch. The game designer additionally accepted the open door to declare that protection and information security will be the main concern. 

Alongside the declaration of the game, Krafton has uncovered the protection strategy for Battlegrounds Mobile India. As per it, players under 18 years should get agree from guardians to play the game. Besides, minors won't be permitted to play Battlegrounds Mobile India over three hours per day or spend more than Rs 7,000 for in-application buys.

PUBG mobile Lite India

Fans eagerly waiting for PUBG mobile Lite release date 

As Consulted by  renowned PUBG Mobile India official Ocean Sharma, Battlegrounds Mobile India could be made accessible by June.

Indian PUBG Mobile fans have been standing by enthusiastically for the game's rebound in the country. Krafton's most recent declaration of the new title has got fight royale lovers in the country considerably more energized.

Landmarks Mobile India is set to highlight selective in-game substance like occasions, restricted release outfits, and that's only the tip of the iceberg. Beside this, Krafton has plans for various competitions and alliances to cultivate the improvement of the serious side of the title.

With every one of the new advancements occurring, it is normal that the game will before long make its rebound in India.

In the mean time, according to Krafton's declaration, Battlegrounds Mobile India will have a pre-enrollment measure before its delivery.

There's nothing left but to trust that the authority declaration will be made about the pre-enrollment and download measure. They can follow the online media handles of the game to stay aware of the multitude of updates.

As you all know that PUBG mobile India has not been officially launched but here is how you can get the test app. You can enjoy the game before the launch. 

Click below to download PUBG Mobile India 

App Link-Download

Obb Link-Download

Milestones Mobile India dispatch date 

Milestones Mobile India will have India-explicit highlights 

You can't play Battlegrounds Mobile India with players outside the country 

Milestones Mobile India limitations for players under 18 years 

Client information will be put away in India 

Samsung has announced that it will bring some exciting offers on its AI TVs in India. During the company's ‘AI-Powered Freedom‘ sale, the South Korean firm aims to democratize AI and make its latest premium TV range more accessible to consumers in the country.

Samsung India's ‘AI-Powered Freedom' sale to bring offers and discounts on its premium TVs

Samsung has announced the ‘AI-Powered Freedom' sale event for the Indian market. During this upcoming event ahead of India's 78th Independence Day, the company will offer cashback discounts of up to 20% on select TVs and easy EMIs starting at just INR 2,777 (~$33) per month for up to 36 months. This event will start on August 3, 2024, and end on August 31, 2024.

The company's AI-equipped TVs include its new Neo QLED 8K TVs, Neo QLED TVs (4K), OLED TVs, and Crystal 4K UHD TVs. These TVs are secured by Samsung Knox to protect sensitive data with multiple layers of software and hardware. Depending on the model, buyers who buy select premium AI TVs can get a free Serif TV worth INR 89,990 (~ $1,073) or a free soundbar worth INR 47,990 (~$573).

Samsung hasn't announced the rest of the offers and discounts yet, and they will be revealed in the coming days.

Samsung's latest Neo QLED, Neo QLED 8K, and OLED TVs feature processors that have built-in neural processing units (NPUs) for faster AI processing. This processing is used for improved audio and picture quality, depending on the scene and picture that is being displayed.

The post Samsung to bring exciting offers on its AI TVs in India appeared first on SamMobile.

In March, India announced a major investment to establish a semiconductor-manufacturing industry. With US $15 billion in investments from companies, state governments, and the central government, India now has plans for several chip-packaging plants and the country’s first modern chip fab as part of a larger effort to grow its electronics industry.

But turning India into a chipmaking powerhouse will also require a substantial investment in R&D. And so the Indian government turned to IEEE Fellow and retired Georgia Tech professor Rao Tummala, a pioneer of some of the chip-packaging technologies that have become critical to modern computers. Tummala spoke with IEEE Spectrum during the IEEE Electronic Component Technology Conference in Denver, Colo., in May.

Rao Tummala

Rao Tummala is a pioneer of semiconductor packaging and a longtime research leader at Georgia Tech.

What are you helping the government of India to develop?

Rao Tummala: I’m helping to develop the R&D side of India’s semiconductor efforts. We picked 12 strategic research areas. If you explore research in those areas, you can make almost any electronic system. For each of those 12 areas, there’ll be one primary center of excellence. And that’ll be typically at an IIT (Indian Institute of Technology) campus. Then there’ll be satellite centers attached to those throughout India. So when we’re done with it, in about five years, I expect to see probably almost all the institutions involved.

Why did you decide to spend your retirement doing this?

Tummala: It’s my giving back. India gave me the best education possible at the right time.

I’ve been going to India and wanting to help for 20 years. But I wasn’t successful until the current government decided they’re going to make manufacturing and semiconductors important for the country. They asked themselves: What would be the need for semiconductors, in 10 years, 20 years, 30 years? And they quickly concluded that if you have 1.4 billion people, each consuming, say, $5,000 worth of electronics each year, it requires billions and billions of dollars’ worth of semiconductors.

“It’s my giving back. India gave me the best education possible at the right time.” —Rao Tummala, advisor to the government of India

What advantages does India have in the global semiconductor space?

Tummala: India has the best educational system in the world for the masses. It produces the very best students in science and engineering at the undergrad level and lots of them. India is already a success in design and software. All the major U.S. tech companies have facilities in India. And they go to India for two reasons. It has a lot of people with a lot of knowledge in the design and software areas, and those people are cheaper [to employ].

What are India’s weaknesses, and is the government response adequate to overcoming them?

Tummala: India is clearly behind in semiconductor manufacturing. It’s behind in knowledge and behind in infrastructure. Government doesn’t solve these problems. All that the government does is set the policies and give the money. This has given companies incentives to come to India, and therefore the semiconductor industry is beginning to flourish.

Will India ever have leading-edge chip fabs?

Tummala: Absolutely. Not only will it have leading-edge fabs, but in about 20 years, it will have the most comprehensive system-level approach of any country, including the United States. In about 10 years, the size of the electronics industry in India will probably have grown about 10 times.

This article appears in the August 2024 print issue as “5 Questions for Rao Tummala.”

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development.

Onsemi plans to build a $2 billion silicon carbide production plant in the Czech Republic. The site would produce smart power semiconductors for electric vehicles, renewable energy technology, and data centers.

The global chip manufacturing industry is projected to boost capacity by 6% in 2024 and 7% in 2025, reaching 33.7 million 8-inch (200mm) wafers per month, according to SEMI‘s latest World Fab Forecast report. Leading-edge capacity for 5nm nodes and below is expected to grow by 13% in 2024, driven by AI demand for data center applications. Additionally, Intel, Samsung, and TSMC will begin producing 2nm chips using gate-all-around (GAA) FETs next year, boosting leading-edge capacity by 17% in 2025.

At the IEEE Symposium on VLSI Technology & Circuits, imec introduced:

• Functional CMOS-based CFETs with stacked bottom and top source/drain contacts.
• CMOS-based 56Gb/s zero-IF D-band beamforming transmitters to support next-gen short-range, high-speed wireless services at frequencies above 100GHz.
• ADCs for base stations and handsets, a key step toward scalable, high-performance beyond-5G solutions, such as cloud-based AI and extended reality apps.

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Wolfspeed postponed plans to construct a $3 billion chip plant in Germany, underscoring the EU‘s challenges in boosting semiconductor production, reports Reuters. The North Carolina-based company cited reduced capital spending due to a weakened EV market, saying it now aims to start construction in mid-2025, two years later than 0riginally planned.

Micron is building a pilot production line for high-bandwidth memory (HBM) in the U.S., and considering HBM production in Malaysia to meet growing AI demand, according to a Nikkei report. The company is expanding HBM R&D facilities in Boise, Idaho, and eyeing production capacity in Malaysia, while also enhancing its largest HBM facility in Taichung, Taiwan.

Kioxia restored its Yokkaichi and Kitakami plants in Japan to full capacity, ending production cuts as the memory market recovers, according to Nikkei. The company, which is focusing on NAND flash production, has secured new bank credit support, including refinancing a ¥540 billion loan and establishing a ¥210 billion credit line. Kioxia had reduced output by more than 30% in October 2022 due to weak smartphone demand.

Europe’s NATO Innovation Fund announced its first direct investments, which includes semiconductor materials. Twenty-three NATO allies co-invested in this over $1B fund devoted to address critical defense and security challenges.

The second meeting of the U.S.–India Initiative on Critical and Emerging Technology (iCET) was held in New Delhi, with various funding and initiatives announced to support semiconductor technology, next-gen telecommunications, connected and autonomous vehicles, ML, and more.

Amazon announced investments of €10 billion in Germany to drive innovation and support the expansion of its logistics network and cloud infrastructure.

Quantum Machines opened the Israeli Quantum Computing Center (IQCC) research facility, backed by the Israel Innovation Authority and located at Tel Aviv University. Also, Israel-based Classiq is collaborating with NVIDIA and BMW, using quantum computing to find the optimal automotive architecture of electrical and mechanical systems.

Global data center vacancy rates are at historic lows, and power availability is becoming less available, according to a Siemens report featured on Broadband Breakfast. The company called for an influx of financing to find new ways to optimize data center technology and sustainability.

In-Depth

Semiconductor Engineering published its Manufacturing, Packaging & Materials newsletter this week, featuring these top stories:

• Single Vs. Multi-Patterning Advancements For EUV
• Precise Control Of Copper Plating And CMP
• Ruthenium Interconnects On Tap
• Opportunities Grow For GPU Acceleration

More reporting this week:

• IC Industry’s Growing Role In Sustainability
• What’s Missing In Test

Market Reports

Renesas completed its acquisition of Transphorm and will immediately start offering GaN-based power products and reference designs to meet the demand for wide-bandgap (WBG) chips.

Revenues for the top five wafer fab equipment (WFE) companies fell 9% YoY in Q1 2024, according to Counterpoint. This was offset partially by increased demand for NAND and DRAM, which increased 33% YoY, and strong growth in sales to China, which were up 116% YoY.

The SiC power devices industry saw robust growth in 2023, primarily driven by the BEV market, according to TrendForce. The top five suppliers, led by ST with a 32.6% market share and onsemi in second place, accounted for 91.9% of total revenue. However, the anticipated slowdown in BEV sales and weakening industrial demand are expected to significantly decelerate revenue growth in 2024. 

About 30% of vehicles produced globally will have E/E architectures with zonal controllers by 2032, according to McKinsey & Co. The market for automotive micro-components and logic semiconductors is predicted to reach $60 billion in 2032, and the overall automotive semiconductor market is expected to grow from $60 billion to $140 billion in the same period, at a 10% CAGR.

The automotive processor market generated US$20 billion in revenue in 2023, according to Yole. US$7.8 billion was from APUs and FPGAs and $12.2 billion was from MCUs. The ADAS and infotainment processors market was worth US$7.8 billion in 2023 and is predicted to grow to $16.4 billion by 2029 at a 13% CAGR. The market for ADAS sensing is expected to grow at a 7% CAGR.

Security

The CHERI Alliance was established to drive adoption of memory safety and scalable software compartmentalization via the security technology CHERI, or Capability Hardware Enhanced RISC Instructions. Founding members include Capabilities Limited, Codasip, the FreeBSD Foundation, lowRISC, SCI Semiconductor, and the University of Cambridge.

In security research:

• Japan and China researchers explored a NAND-XOR ring oscillator structure to design an entropy source architecture for a true random number generator (TRNG).
• University of Toronto and Carleton University researchers presented a survey examining how hardware is applied to achieve security and how reported attacks have exploited certain defects in hardware.
• University of North Texas and Texas Woman’s University researchers explored the potential of hardware security primitive Physical Unclonable Functions (PUF) for mitigation of visual deepfakes.
• Villanova University researchers proposed the Boolean DERIVativE attack, which generalizes Boolean domain leakage.

Post-quantum cryptography firm PQShield raised $37 million in Series B funding.

Former OpenAI executive, Ilya Sutskever, who quit over safety concerns, launched Safe Superintelligence Inc. (SSI).

EU industry groups warned the European Commission that its proposed cybersecurity certification scheme (EUCS) for cloud services should not discriminate against Amazon, Google, and Microsoft, reported Reuters.

Cyber Europe tested EU cyber preparedness in the energy sector by simulating a series of large-scale cyber incidents in an exercise organized by the European Union Agency for Cybersecurity (ENISA).

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Education and Training

New York non-profit NY CREATES and South Korea’s National Nano Fab Center partnered to develop a hub for joint research, aligned technology services, testbed support, and an engineer exchange program to bolster chips-centered R&D, workforce development, and each nation’s high-tech ecosystem.

New York and the Netherlands agreed on a partnership to promote sustainability within the semiconductor industry, enhance workforce development, and boost semiconductor R&D.

Rapidus is set to send 200 engineers to AI chip developer Tenstorrent in the U.S. for training over the next five years, reports Nikkei. This initiative, led by Japan’s Leading-edge Semiconductor Technology Center (LSTC), aims to bolster Japan’s AI chip industry.

Product News

UMC announced its 22nm embedded high voltage (eHV) technology platform for premium smartphone and mobile device displays. The 22eHV platform reduces core device power consumption by up to 30% compared to previous 28nm processes. Die area is reduced by 10% with the industry’s smallest SRAM bit cells.​

Alphawave Semi announced a new 9.2 Gbps HBM3E sub-system silicon platform capable of 1.2 terabytes per second. Based on the HBM3E IP, the sub-system is aimed at addressing the demand for ultra-high-speed connectivity in high-performance compute applications.

Movellus introduced the Aeonic Power product family for on-die voltage regulation, targeting the challenging area of power delivery.

Cadence partnered with Semiwise and sureCore to develop new cryogenic CMOS circuits with possible quantum computing applications. The circuits are based on modified transistors found in the Cadence Spectre Simulation Platform and are capable of processing analog, mixed-signal, and digital circuit simulation and verification at cryogenic temperatures.

Renesas launched R-Car Open Access (RoX), an integrated development platform for software-defined vehicles (SDVs), designed for Renesas R-Car SoCs and MCUs with tools for deployment of AI applications, reducing complexity and saving time and money for car OEMs and Tier 1s.

Infineon released industry-first radiation-hardened 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvolatile memory devices, with up to 120 years of data retention at 85-degree Celsius, along with random access and full memory write at bus speeds. Plus, a CoolGaN Transistor 700 V G4 product family for efficient power conversion up to 700 V, ideal for consumer chargers and notebook adapters, data center power supplies, renewable energy inverters, and more.

Ansys adopted NVIDIA’s Omniverse application programming interfaces for its multi-die chip designers. Those APIs will be used for 5G/6G, IoT, AI/ML, cloud computing, and autonomous vehicle applications. The company also announced ConceptEV, an SaaS solution for automotive concept design for EVs.

Fig. 1: Field visualization of 3D-IC with Omniverse. Source: Ansys

QP Technologies announced a new dicing saw for its manufacturing line that can process a full cassette of 300mm wafers 7% faster than existing tools, improving throughput and productivity.

NXP introduced its SAF9xxx of audio DSPs to support the demand for AI-based audio in software-defined vehicles (SDVs) by using Cadence’s Tensilica HiFi 5 DSPs combined with dedicated neural-network engines and hardware-based accelerators.

Avionyx, a provider of software lifecycle engineering in the aerospace and safety-critical systems sector, partnered with Siemens and will leverage its Polarion application lifecycle management (ALM) tool. Also, Dovetail Electric Aviation adopted Siemens Xcelerator to support sustainable aviation.

Research

Researchers from imec and KU Leuven released a +70 page paper “Selecting Alternative Metals for Advanced Interconnects,” addressing interconnect resistance and reliability.

A comprehensive review article — “Future of plasma etching for microelectronics: Challenges and opportunities” — was created by a team of experts from the University of Maryland, Lam Research, IBM, Intel, and many others.

Researchers from the Institut Polytechnique de Paris’s Laboratory of Condensed Matter for Physics developed an approach to investigate defects in semiconductors. The team “determined the spin-dependent electronic structure linked to defects in the arrangement of semiconductor atoms,” the first time this structure has been measured, according to a release.

Lawrence Berkeley National Laboratory-led researchers developed a small enclosed chamber that can hold all the components of an electrochemical reaction, which can be paired with transmission electron microscopy (TEM) to generate precise views of a reaction at atomic scale, and can be frozen to stop the reaction at specific time points. They used the technique to study a copper catalyst.

The Federal Drug Administration (FDA) approved a clinical trial to test a device with 1,024 nanoscale sensors that records brain activity during surgery, developed by engineers at the University of California San Diego (UC San Diego).

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Samsung's first wireless Dolby Atmos standalone speaker, the Music Frame, has been launched in India. While the speaker was listed on the company's website for the Indian market in April 2024, it is available for purchase only now.

Music Frame is available for purchase in India

You can now purchase the Music Frame speaker in India. It is priced at INR 23,990 ($288) and is available through Amazon.in, Samsung.com, and authorized offline and online retailers across the country.

Samsung is offering an instant discount of INR 1,799 ($22) on purchases made using an ICICI Bank credit or debit card. The same offer is available for credit and debit cards from all other leading banks.

Watch our hands-on video of the Music Frame speaker below.

What makes the Music Frame speaker interesting?

The Music Frame is a stereo speaker with six drivers: two mid-range drivers, two tweeters, and two woofers. It features Wireless Dolby Atmos with Spatial Audio. It also has Bluetooth 5.2, Wi-Fi 5, AirPlay 2, Chromecast Built-In, Roon Compatible, Spotify Connect, and Tap Sound.

Its audio features include an Active Voice Amplifier, Adaptive Sound, Q-Symphony, and SpaceFit Sound Pro. It also features Alexa, Bixby, Google Assistant, and SmartThings. By connecting the SmartThings USB dongle, it can be turned into a SmartThings Hub.

Using Q-Symphony, it can be wirelessly connected to Samsung TVs and soundbars. You can even pair two Music Frames with your recently released Samsung TV.

Since you can attach your printed photos to the Music Frame, it looks like a photo frame and fits into the aesthetics of your home's interiors. You can also change its bezels using its magnetic system.

Mohandeep Singh, Senior Vice President at Samsung India's Visual Display Business, said, “Modern consumers are increasingly seeking products that not only blend functionality and aesthetics, but also add visual appeal. This trend is driven by a desire for products that reflect their personality and style, and enhance the overall ambience of their living space. The new Music Frame epitomizes exceptional technology in the form of a picture frame with its unique, elegant design while delivering a cinematic audio experience.“

The post Samsung launches Music Frame wireless Dolby Atmos speaker in India appeared first on SamMobile.

Could we see an Assassin’s Creed game based in India? According to Harsha Malkan, Ubisoft India's communications director, “you never know.”

During a visit to the Ubisoft Mumbai office for the Ubisoft Forward 2024 watch party, YouTuber sikhwarrior spoke with Malkan about several topics. When asked …

We are working with two partner organisations in Odisha, India, to develop and roll out the IT & Coding Curriculum (Kaushali), a computing curriculum for government high schools. Last year we launched the first part of the curriculum and rolled out teacher training. Read on to find out what we have learned from this work.

Supporting government schools in Odisha to teach computing

Previously we shared an insight into how we established Code Clubs in Odisha to bring computing education to young people. Now we are partnering with two Indian civil society organisations to develop high school curriculum resources for computing and support teachers to deliver this content.

With our two partners, we trained 311 master teachers during July and August 2023. The master teachers, most often mathematics or science teachers, were in turn tasked with training teachers from around 8000 government schools. The aim of the training was to enable the 8000 teachers to deliver the curriculum to grades 9 and 10 in the June 2023 – April 2024 academic year.

At the Foundation, we have been responsible for providing ongoing support to 1898 teachers from 10 districts throughout the academic year, including through webinars and other online and in-person support.

To evaluate the impact our work in Odisha is having, we gathered data using a mixed-methods approach that included gathering feedback from teachers via surveys and interviews, visiting schools, capturing reflections from our trainers, and reviewing a sample of students’ projects.

Positive impact on teachers and students

In our teacher survey, respondents were generally positive about the curriculum resources:

• 87% of the 385 respondents agreed that the curriculum resources were both high quality and useful for their teaching
• 91% agreed that they felt more confident to teach students IT & Coding as a result of the curriculum resources

Teachers also tended to agree that the initial training had helped improve their understanding and confidence, and they appreciated our ongoing support webinars.

“The curriculum resources are very useful for students.” – Teacher in Odisha

“The webinar is very useful to acquire practical knowledge regarding the specific topics.”  – Teacher in Odisha

Teachers who responded to our survey observed a positive impact on students:

• 93% agreed their students’ digital literacy skills had improved
• 90% agreed that their students’ coding knowledge had improved

Students’ skills were also demonstrated by the Scratch projects we reviewed. And students from Odisha shared 314 projects in Coolest Projects — our online technology showcase for young people — including the project ‘We’ll build a new Odisha’ and an apple catching game.

Feedback and observations about teacher training

On school visits, our team observed that the teachers adopted and implemented the practical elements of the initial training quite well. However, survey responses and interviews showed that often teachers were not yet using all the elements of the curriculum as intended.

In their feedback, many teachers expressed a need for further regular training and support, and some reported additional challenges, such as other demands on their time and access to equipment.

When we observed training sessions master teachers delivered to teachers, we saw that, in some cases, information was lost within the training cascade (from our trainers, to master teachers, to teachers), including details about the intended pedagogical approach. It can be difficult to introduce experienced teachers to new pedagogical methods within a short training session, and teachers’ lack of computing knowledge also presents a challenge.

We will use all this data to shape how we support teachers going forward. Some teachers didn’t share feedback, and so in our further evaluation work, we will focus on making sure we hear a broad and representative range of teachers’ views and experiences.

What’s new this year?

In the current academic year, we are rolling out more advanced curriculum content for grade 10 students, including AI literacy resources developed at the Foundation. We’re currently training master teachers on this content, and they will pass on their knowledge to other teachers in the coming months. Based on teachers’ feedback, the grade 10 curriculum and the training also include a recap of some key points from the grade 9 curriculum.

A State Resource Group (SRG) has also been set up, consisting of 30 teachers who will support us with planning and providing ongoing support to master teachers and other teachers in Odisha. We have already trained the SRG members on the new curriculum content to enable them to best support teachers across the state. In addition to this, our local team in Odisha plans to conduct more visits and reach out directly to teachers more often. 

Our plans for the future

The long-term vision for our work in India is to enable any school in India to teach students about computing and creating with digital technologies. A critical part of achieving this vision is the development of a comprehensive computing curriculum for grade 6 to 12, specifically tailored for government schools in India. Thanks to our work in Odisha, we are in a better position to understand the unique challenges and limitations of government schools. We’re designing our curriculum to address these challenges and ensure that every Indian student has the opportunity to thrive in the 21st century. If you would like to know more about our work and impact in India, please reach out to us via [email protected].

We take evaluation of our work seriously and are always looking to understand how we can improve and increase the impact we have on the lives of young people. To find out more about our approach to impact, you can read about our recently updated theory of change, which supports how we evaluate what we do.

The post Introducing a computing curriculum in Odisha appeared first on Raspberry Pi Foundation.

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology.

Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out of China, Out of Taiwan,” according to TrendForce.

Alphawave joined forces with Arm to develop an advanced chiplet based on Arm’s Neoverse Compute Subystems for AI/ML. The chiplet contains the Neoverse N3 CPU core cluster and Arm Coherent Mesh Network, and will be targeted at HPC in data centers, AI/ML applications, and 5G/6G infrastructure.

ElevATE Semiconductor and GlobalFoundries will partner for high-voltage chips to be produced at GF’s facility in Essex Junction, Vermont, which GF bought from IBM. The chips are essential for semiconductor testing equipment, aerospace, and defense systems.

NVIDIA, OpenAI, and Microsoft are under investigation by the U.S. Federal Trade Commission and Justice Department for violation of antitrust laws in the generative AI industry, according to the New York Times.

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Apollo Global Management will invest $11 billion in Intel’s Fab 34 in Ireland, thereby acquiring a 49% stake in Intel’s Irish manufacturing operations.

imec and ASML opened their jointly run High-NA EUV Lithography Lab in Veldhoven, the Netherlands. The lab will be used to prepare  the next-generation litho for high-volume manufacturing, expected to begin in 2025 or 2026.

Expedera opened a new semiconductor IP design center in India. The location, the sixth of its kind for the company, is aimed at helping to make up for a shortfall in trained technicians, researchers, and engineers in the semiconductor sector.

Foxconn will build an advanced computing center in Taiwan with NVIDIA’s Blackwell platform at its core. The site will feature GB200 servers, which consist of 64 racks and 4,608 GPUs, and will be completed by 2026.

Intel and its 14 partner companies in Japan will use Sharp‘s LCD plants to research semiconductor production technology, a cost reduction move that should also produce income for Sharp, according to Nikkei Asia.

Japan is considering legislation to support the commercial production of advanced semiconductors, per Reuters.

Saudi Arabia aims to establish at least 50 semiconductor design companies as part of a new National Semiconductor Hub, funded with over $266 million.

Air Liquide is opening a new industrial gas production facility in Idaho, which will produce ultra-pure nitrogen and other gases for Micron’s new fab.

Microsoft will invest 33.7 billion Swedish crowns ($3.2 billion) to expand its cloud and AI infrastructure in Sweden over a two-year period, reports Bloomberg. The company also will invest $1 billion to establish a new data center in northwest Indiana.

AI data centers could consume as much as 9.1% of the electricity generated in the U.S. by 2030, according to a white paper published by the Electric Power Research Institute. That would more than double the electricity currently consumed by data centers, though EPRI notes this is a worst case scenario and advances in efficiency could be a mitigating factor.

Markets and Money

The Semiconductor Industry Association (SIA) announced global semiconductor sales increased 15.8% year-over-year in April, and the group projected a market growth of 16% in 2024. Conversely, global semiconductor equipment billings contracted 2% year-over-year to US$26.4 billion in Q1 2024, while quarter-over-quarter billings dropped 6% during the same period, according to SEMI‘s Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

Cadence completed its acquisition of BETA CAE Systems International, a provider of multi-domain, engineering simulation solutions.

Cisco‘s investment arm launched a $1 billion fund to aid AI startups as part of its AI innovation strategy. Nearly $200 million has already been earmarked.

The power and RF GaN markets will grow beyond US$2.45 billion and US$1.9 billion in 2029, respectively, according to Yole, which is offering a webinar on the topic.

The micro LED chip market is predicted to reach $580 million by 2028, driven by head-mounted devices and automotive applications, according to TrendForce. The cost of Micro LED chips may eventually come down due to size miniaturization.

In-Depth

Semiconductor Engineering published its Automotive, Security, and Pervasive Computing newsletter this week, featuring these top stories:

• The Uncertainty Of Certifying AI For Automotive
• Why It’s So Hard To Secure AI Chips
• Toward A Software-Defined Hardware World

More reporting this week:

• Chip Design Digs Deeper Into AI
• Why IC Design Safety Nets Have Limits
• Opportunities Grow For GPU Acceleration

Security

Scott Best, Rambus senior director of Silicon Security Products, delivered a keynote at the Hardwear.io conference this week (below), detailing a $60 billion reverse engineering threat for hardware in just three markets — $30 billion for printer consumables, $20 billion for rechargeable batteries with some type of authentication, and $10 billion for medical devices such as sonogram probes.

Photo source: Ed Sperling/Semiconductor Engineering

wolfSSL debuted wolfHSM for automotive hardware security modules, with its cryptographic library ported to run in automotive HSMs like Infineon’s Aurix Tricore TC3XX.

Cisco integrated AMD Pensando data processing units (DPUs) with its Hypershield security architecture for defending AI-scale data centers.

OMNIVISION released an intelligent CMOS image sensor for human presence detection, infrared facial authentication, and always-on technology with a single sensing camera. And two new image sensors for industrial and consumer security surveillance cameras.

Digital Catapult announced a new cohort of companies will join Digital Security by Design’s Technology Access Program, gaining access to an Arm Morello prototype evaluation hardware kit based on Capability Hardware Enhanced RISC Instructions (CHERI), to find applications across critical UK sectors.

University of Southampton researchers used formal verification to evaluate the hardware reliability of a RISC-V ibex core in the presence of soft errors.

Several institutions published their students’ master’s and PhD work:

• Virginia Tech published a dissertation proposing sPACtre, a defense mechanism that aims to prevent Spectre control-flow attacks on existing hardware.
• Wright State University published a thesis proposing an approach that uses various machine learning models to bring an improvement in hardware Trojan identification with power signal side channel analysis
• Wright State University published a thesis examining the effect of aging on the reliability of SRAM PUFs used for secure and trusted microelectronics IC applications.
• Nanyang Technological University published a Final Year Project proposing a novel SAT-based circuit preprocessing attack based on the concept of logic cones to enhance the efficacy of SAT attacks on complex circuits like multipliers.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Education and Training

Renesas and the Indian Institute of Technology Hyderabad (IIT Hyderabad) signed a three-year MoU to collaborate on VLSI and embedded semiconductor systems, with a focus on R&D and academic interactions to advance the “Make in India” strategy.

Charlie Parker, senior machine learning engineer at Tignis, presented a talk on “Why Every Fab Should Be Using AI.”

Penn State and the National Sun Yat-Sen University (NSYSU) in Taiwan partnered to develop educational and research programs focused on semiconductors and photonics.

Rapidus and Hokkaido University partnered on education and research to enhance Japan’s scientific and technological capabilities and develop human resources for the semiconductor industry.

The University of Minnesota named Steve Koester its first “Chief Semiconductor Officer,” and launched a website devoted to semiconductor and microelectronics research and education.

The state of Michigan invested $10 million toward semiconductor workforce development.

Product News

Siemens reported breakthroughs in high-level C++ verification that will be used in conjunction with its Catapult software. Designers will be able to use formal property checking via the Catapult Formal Assert software and reachability coverage analysis through Catapult Formal CoverCheck.

Infineon released several products:

• 600 V CoolMOS 8 high voltage superjunction (SJ) MOSFET product family.
• CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense device.
• New CoolSiC MOSFET discretes 650 V, with two product families housed in the Thin-TOLL 8×8 and TOLT packages to increase system power density.

Augmental, an MIT Media Lab spinoff, released a tongue-based computer controller, dubbed the MouthPad.

NVIDIA revealed a new line of products that will form the basis of next-gen AI data centers. Along with partners ASRock Rack, ASUS, GIGABYTE, Ingrasys, and others, the NVIDIA GPUs and networking tech will offer cloud, on-premises, embedded, and edge AI systems. NVIDIA founder and CEO Jensen Huang showed off the company’s upcoming Rubin platform, which will succeed its current Blackwell platform. The new system will feature new GPUs, an Arm-based CPU and advanced networking with NVLink 6, CX9 SuperNIC and X1600 converged InfiniBand/Ethernet switch.

Intel showed off its Xeon 6 processors at Computex 2024. The company also unveiled architectural details for its Lunar Lake client computing processor, which will use 40% less SoC power, as well as a new NPU, and X2 graphic processing unit cores for gaming.

Research

imec released a roadmap for superconducting digital technology to revolutionize AI/ML.

CEA-Leti reported breakthroughs in three projects it considers key to the next generation of CMOS image sensors. The projects involved embedding AI in the CIS and stacking multiple dies to create 3D architectures.

Researchers from MIT’s Computer Science & Artificial Intelligence Laboratory (MIT-CSAIL) used a type of generative AI, known as diffusion models, to train multi-purpose robots, and designed the Grasping Neural Process for more intelligent robotic grasping.

IBM and Pasqal partnered to develop a common approach to quantum-centric supercomputing and to promote application research in chemistry and materials science.

Stanford University and Q-NEXT researchers investigated diamond to find the source of its temperamental nature when it comes to emitting quantum signals.

TU Wien researchers investigated how AI categorizes images.

In Canada:

• Simon Fraser University received funding of over $80 million from various sources to upgrade the supercomputing facility at the Cedar National Host Site.
• The Digital Research Alliance of Canada announced $10.28 million to renew the University of Victoria’s Arbutus cloud infrastructure.
• The Canadian government invested $18.4 million in quantum research at the University of Waterloo.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Usually, Samsung rolls out a new software update to all the devices in a series together. However, that was not the case with the last software update to the Galaxy Tab A9 series. Last week, the company released One UI 6.1 to the Galaxy Tab A9 but not the Galaxy Tab A9+. Well, the tech giant is now rolling out One UI 6.1 to the Galaxy Tab A9+ as well.

One UI 6.1 brings many new features to the Galaxy Tab A9+. You can check out all the features it offers in our article dedicated to the topic or in our video below. To give you a quick rundown, it brings additional options to customize the user interface, including wallpapers, edit images and videos in the Gallery app, share files with Galaxy phones and tablets and other Android devices, protect your data in the tablet and the device’s battery, check the weather, multitask, and type.

Currently, Samsung is rolling out One UI 6.1 to the international variant of the Galaxy Tab A9+, which carries the model number SM-X216B, in many regions around the globe, including Europe and India. The new software update has firmware version X216BXXU2CXF1. Along with the new software, the update also brings the May 2024 security patch to the Galaxy Tab A9+. It fixes 45 security issues. To get the update, go to Settings » Software update » Download and install.

The post Galaxy Tab A9+ finally gets One UI 6.1 update appeared first on SamMobile.

Last week, Samsung released One UI 6.1 to many smartphones. The Galaxy A23 5G was one of those devices. However, back then, the company rolled out the new software only for the Verizon-exclusive variant of the smartphone in the United States. Now, Samsung has released One UI 6.1 to the international variant of the Galaxy A23 5G in India.

The software update that brings One UI 6.1 to the Galaxy A23 5G in India changes the firmware version of the phone to A236EXXU5EXDA. It also brings the April 2024 security patch to the smartphone, which fixes many security issues. To get the latest software update, go to Settings » Software update » Download and install. You can also download it from our database and install it manually using Odin.

One UI 6.1 brings many new features to the Galaxy A23 5G. A few noteworthy ones include new options to customize UI, edit images and videos, and protect your data in the phone and the device’s battery. Unfortunately, the new software doesn’t bring Galaxy AI to the Galaxy A23 5G. You can check out our video above to learn more about One UI 6.1.

The post Galaxy A23 5G gets One UI 6.1 update in India appeared first on SamMobile.

Samsung started rolling out the May 2024 security patch to Galaxy phones and tablets in the second week of this month. So far, the company has released the latest security update to many devices. Unfortunately, we have reached the last day of the month and there’s a long list of devices to which the brand hasn’t released this month’s security update.

Well, the Galaxy M15 won’t be on that list as Samsung is rolling out the May 2024 security patch to the phone in India right before we bid goodbye to the month. The new software update changes the phone’s firmware version to M156BXXS2AXE5 and fixes 45 security issues. To get the update, go to Settings » Software update » Download and install.

Samsung launched the Galaxy M15 with Android 14-based One UI 6.0, and the device is eligible to get One UI 6.1. The new software packs many new features. You can check them out in the video above or learn more about them in this article. Expect Samsung to roll out One UI 6.1 to the Galaxy M15 in the next couple of weeks, or at worst, a couple of months.

The post Samsung releases May 2024 security update to Galaxy M15 in India appeared first on SamMobile.

Chinese smartphone manufacturers have been trying to catch up to Samsung's lead in the foldable segment for a few years now. They've been able to close the gap but the progress still remains limited, largely due to the problems with market access that they face in North America, particularly the United States.

Those manufacturers are now taking the fight to Samsung in other lucrative markets where they don't have such issues. Vivo's already come out with its Galaxy Z Fold 6 rival, dubbed the Vivo X Fold 3 Pro, and it appears the company will be assembling the device locally in India to enhance competitiveness.

Vivo wants to improve its competitive in India's foldable market

The Vivo X Fold 3 Pro was first unveiled in China back in March this year. It features a 6.53-inch OLED cover display and an 8.03-inch internal foldable panel. It even has an IPX8 water resistance rating, matching one of the key selling points of the Galaxy Z Fold series.

You'll find Qualcomm's latest Snapdragon 8 Gen 3 chipset under the hood with 16GB of RAM and up to 1TB of internal storage. It has a whole host of other top-notch features as well, making the device deserving of its ~$1,385 price tag, lower than the Galaxy Z Fold's $1,799 starting price.

Vivo has its sights set on the premium segment in India. The company is going to assemble the Vivo X Fold 3 Pro in India, using some local materials in the supply chain as well, to better compete against Samsung in the rapidly growing foldable smartphone segment. The devices will be assembled at Vivo's new 170-acre factory in Noida.

No word as yet on pricing but the mid-June launch window makes it clear that Vivo wants to get its product out in the market before Samsung releases the Galaxy Z Fold 6, which won't happen until the end of July at the very least, as the Unpacked event takes place on July 10.

The post Vivo’s making its Galaxy Z Fold 6 killer locally in this major market appeared first on SamMobile.

Enlarge / A sea-borne variant of the commercial Ceres 1 rocket lifts off near the coast of Rizhao, a city of 3 million in China's Shandong province. (credit: VCG via Getty Images)

Welcome to Edition 6.46 of the Rocket Report! It looks like we will be covering the crew test flight of Boeing's Starliner spacecraft and the fourth test flight of SpaceX's giant Starship rocket over the next week. All of this is happening as SpaceX keeps up its cadence of flying multiple Starlink missions per week. The real stars are the Ars copy editors helping make sure our stories don't use the wrong names.

As always, we welcome reader submissions, and if you don't want to miss an issue, please subscribe using the box below (the form will not appear on AMP-enabled versions of the site). Each report will include information on small-, medium-, and heavy-lift rockets as well as a quick look ahead at the next three launches on the calendar.

Another North Korean launch failure. North Korea's latest attempt to launch a rocket with a military reconnaissance satellite ended in failure due to the midair explosion of the rocket during the first-stage flight this week, South Korea's Yonhap News Agency reports. Video captured by the Japanese news organization NHK appears to show the North Korean rocket disappearing in a fireball shortly after liftoff Monday night from a launch pad on the country's northwest coast. North Korean officials acknowledged the launch failure and said the rocket was carrying a small reconnaissance satellite named Malligyong-1-1.

Read 20 remaining paragraphs | Comments

In 2020, Samsung launched Samsung Care+ in India, a series of plans that offer extended warranty and/or accidental damage protection for Samsung’s devices, such as smartphones, tablets, and laptops. Well, Samsung India has just made an announcement about Samsung Care+ and we can’t get our heads around it.

Samsung has issued a press release announcing that it has launched Samsung Care+ in India. It doesn’t make sense considering that the company has already been offering the service in the country for the last four years. It looks like the brand is just relaunching the service to let more people know that such a thing exists and attract more customers.

No, Samsung hasn't upgraded Samsung Care+ in India with more benefits

Some publications have reported that the announcement is about the company upgrading Samsung Care+ to offer two screen replacements per year instead of one. However, that doesn’t seem to be the case as Samsung hasn’t mentioned that upgrade anywhere in the press release.

In fact, the page for Samsung Care+ on Samsung’s website for India clearly says “Under Screen Protection, ADLD & Comprehensive Protection Samsung Care+ plans, you are allowed to raise One (1) damage claim per year.” The same condition is also mentioned on the buying page.

The story continues after the video…

We have come across an image from Samsung that says “Multiple Claims Zero Worries,” which the company seems to have taken down. We think that it would have given some people the notion that the company will now offer at least two screen replacements per year rather than one. However, that isn’t the case.

On a related note, Samsung has given owners of Galaxy S24, Galaxy Z Fold 5, and Galaxy Z Flip 5 in the United States a (second) chance to purchase Samsung Care+. The campaign is live for a limited period of time. So, if you are interested, now is the time to act.

The post Samsung relaunches Samsung Care+ in India appeared first on SamMobile.

Ctrl-Alt-Speech is a weekly podcast about the latest news in online speech, from Mike Masnick and Everything in Moderation‘s Ben Whitelaw.

Subscribe now on Apple Podcasts, Overcast, Spotify, Pocket Casts, YouTube, or your podcast app of choice — or go straight to the RSS feed.

In this week’s round-up of the latest news in online speech, content moderation and internet regulation, Mike and Ben cover:

• Commission opens formal proceedings against Meta under the Digital Services Act related to the protection of minors on Facebook and Instagram (European Commission)
• Meta, TikTok, other platforms told to expect EU guidelines soon on child protection, age verification (MLex)
• Got a text that you think is a scam? S’pore’s new centre to fight online harms can help verify it (Straits Times)
• Bipartisan Bill To Repeal Section 230 Defended In Facts-Optional Op-Ed (Techdirt)
• Indian journalists turned to YouTube to dodge Modi’s censorship. Some of their channels are now being blocked (Reuters Institute for Journalism)
• She was accused of faking an incriminating video of teenage cheerleaders. She was arrested, outcast and condemned. The problem? Nothing was fake after all (The Guardian)
• Commission services sign administrative arrangement with Ofcom to support the enforcement of social media regulations (Pub Affairs Bruxelles)
• Singapore’s proposed online safety laws look like more censorship in disguise (Rest of World)

This episode is brought to you with financial support from the Future of Online Trust & Safety Fund.

Realme India is bringing their new GT 6T smartphone in India. For those unaware, the GT-branded smartphones from Realme often target the upper mid-range market. ...

The post Realme GT 6T Launch Date in India Announced appeared first on Gizchina.com.

HMD Global is now focusing on its self-branded phones. The company is revealing its new smartphones in different parts of the world. Previously, we reported ...

The post HMD Arrow: The Fan-Named Smartphone All Set To Launch appeared first on Gizchina.com.

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry’s gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea.

UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC process for chips used in smartphones and other 5G/6G mobile devices. The process uses wafer-to-wafer bonding technology to address radio frequency interference between stacked dies and reduces die size by 45%.

Fig. 1: UMC’s 3D IC solution for RFSOI technology. Source: UMC

The first programmable chip capable of shaping, splitting, and steering beams of light is now being produced by Skywater Technology and Lumotive. The technology is critical for advancing lidar-based systems used in robotics, automotive, and other 3D sensing applications.

Driven by demand for AI chips, SK hynix revealed it has already booked its entire production of high-bandwidth memory chips for 2024 and is nearly sold out of its production capacity for 2025, reported the Korea Times, while SEMI reported that silicon wafer shipments declined in Q1 2024, quarter over quarter, a 13% drop, attributed to continued weakness in IC fab utilization and inventory adjustments.

PCI-SIG published the CopprLink Internal and External Cable specifications to provide PCIe 5.0 and 6.0 signaling at 32 and 64 GT/s and leverage standard connector form factors for applications including storage, data centers, AI/ML, and disaggregated memory.

The U.S. Department of Commerce (DoC) launched the CHIPS Women in Construction Framework to boost the participation of women and economically disadvantaged people in the workforce, aiming to support on-time and successful completion of CHIPS Act-funded projects. Intel and Micron adopted the framework.

Quick links to more news:

Market Reports
Global
In-Depth
Education and Training
Security
Product News
Quantum
Research
Events
Further Reading

Markets and Money

The SiC wafer processing equipment market is growing rapidly, reports Yole. SiC devices will exceed $10B by 2029 at a CAGR of 25%, and the SiC manufacturing tool market is projected to reach $5B by 2026.

imec.xpand launched a €300 million (~$321 million) fund that will invest in semiconductor and nanotechnology startups with the potential to push semiconductor innovation beyond traditional applications and drive next-gen technologies.

Blaize raised $106 million for its programmable graph streaming processor architecture suite and low-code/no-code software platform for edge AI.

Guerrilla RF completed the acquisition of Gallium Semiconductor‘s portfolio of GaN power amplifiers and front-end modules.

About 90% of connected cars sold in 2030 will have embedded 5G capability, reported Counterpoint. Also, about 75% of laptop PCs sold in 2027 will be AI laptop PCs with advanced generative AI, and the global high-level OS (HLOS) or advanced smartwatch market is predicted to grow 15% in 2024.

Global

Powerchip Semiconductor opened a new 300mm facility in northwestern Taiwan targeting the production of AI semiconductors. The facility is expected to produce 50,000 wafers per month at 55, 40, and 28nm nodes.

Taiwan-based KYEC Semiconductor will withdraw its China operations by the third quarter due to increasing geopolitical tensions, reports the South China Morning Post.

Japan will expand its semiconductor export restrictions to China related to four technologies: Scanning electron microscopes, CMOS, FD-SOI, and the outputs of quantum computers, according to TrendForce.

IBM will invest CAD$187 million (~US$137M in Canada’s semiconductor industry, with the bulk of the investment focused on advanced assembly, testing, and packaging operations.

Microsoft will invest US$2.2 billion over the next four years to build Malaysia’s digital infrastructure, create AI skilling opportunities, establish an AI Center of Excellence, and enhance cybersecurity.

In-Depth

New stories and tech talks published by Semiconductor Engineering this week:

• Multi-Die Design Pushes Complexity To The Max
• Design Considerations In Photonics
• Overlay Optimization In Advanced IC Substrates
• Fundamental Issues In Computer Vision Still Unresolved
• Sensor Fusion Challenges In Automotive

Security

Infineon collaborated with ETAS to integrate the ESCRYPT CycurHSM 3.x automotive security software stack into its next-gen AURIX MCUs to optimize security, performance, and functionality.

Synopsys released Polaris Assist, an AI-powered application security assistant on its Polaris Software Integrity Platform, combining LLM technology with application security knowledge and intelligence.

In security research:

• UT Dallas, Intel, NXP, and TI published a framework for early anomaly detection in AMS components of automotive SoCs.
• The University of Central Florida said that LLMs can be harnessed to automatically rectify security-relevant vulnerabilities inherent in hardware designs within the semiconductor context.
• Western University leveraged hardware security modules for enhanced intra-domain security.
• A team in India proposed a post-quantum secure PUF-based cross-domain authentication mechanism for Internet of Drones.

U.S. President Biden signed a National Security Memorandum to enhance the resilience of critical infrastructure, and the White House announced key actions taken since Biden’s AI Executive Order, including measures to mitigate risk.

CISA and partners published a fact sheet on pro-Russia hacktivists who seek to compromise industrial control systems and small-scale operational technology systems in North American and European critical infrastructure sectors. CISA issued other alerts including two Microsoft vulnerabilities.

Education and Training

The U.S. National Institute for Innovation and Technology (NIIT) and the Department of Labor (DoL) partnered to celebrate the inaugural Youth Apprenticeship Week on May 5 to 11, highlighting opportunities in critical industries such as semiconductors and advanced manufacturing.

SUNY Poly received an additional $4 million from New York State for its Semiconductor Processing to Packaging Research, Education, and Training Center.

The University of Pennsylvania launched an online Master of Science in Engineering in AI degree.

The American University of Armenia celebrated its 10-year collaboration with Siemens, which provides AUA’s Engineering Research Center with annual research grants.

Product News

Renesas and SEGGER Embedded Studio launched integrated code generator support for its 32-bit RISC-V MCU. 

Rambus introduced a family of DDR5 server Power Management ICs (PMICs), including an extreme current device for high-performance applications.

Fig. 2: Rambus’ server PMIC on DDR5 RDIMM. Source: Rambus

Keysight added capabilities to Inspector, part of the company’s recently acquired device security research and test lab Riscure, that are designed to test the robustness of post-quantum cryptography (PQC) and help device and chip vendors identify and fix hardware vulnerabilities. Keysight also validated new conformance test cases for narrowband IoT non-terrestrial networks standards.

Ansys’ RedHawk-SC and Totem power integrity platforms were certified for TSMC‘s N2 nanosheet-based process technology, while its RaptorX solution for on-chip electromagnetic modeling was certified for TSMC’s N5 process.

Netherlands-based athleisure brand PREMIUM INC selected CLEVR to implement Siemens’ Mendix Digital Lifecycle Management for Fashion & Retail solution.

Micron will begin shipping high-capacity DRAM for AI data centers.

Microchip uncorked radiation-tolerant SoC FPGAs for space applications that uses a real-time Linux-capable RISC-V-based microprocessor subsystem.

Quantum

University of Chicago researchers developed a system to boost the efficiency of quantum error correction using a framework based on quantum low-density party-check (qLDPC) codes and new hardware involving reconfigurable atom arrays.

PsiQuantum will receive AUD $940 million (~$620 million) in equity, grants, and loans from the Australian and Queensland governments to deploy a utility-scale quantum computer in the regime of 1 million physical qubits in Brisbane, Australia.

Japan-based RIKEN will co-locate IBM’s Quantum System Two with its Fugaku supercomputer for integrated quantum-classical workflows in a heterogeneous quantum-HPC hybrid computing environment. Fugaku is currently one of the world’s most powerful supercomputers.

QuEra Computing was awarded a ¥6.5 billion (~$41 million) contract by Japan’s National Institute of Advanced Industrial Science and Technology (AIST) to deliver a gate-based neutral-atom quantum computer alongside AIST’s ABCI-Q supercomputer as part of a quantum-classical computing platform.

Novo Holdings, the controlling stakeholder of pharmaceutical company Novo Nordisk, plans to boost the quantum technology startup ecosystem in Denmark with DKK 1.4 billion (~$201 million) in investments.

The University of Sydney received AUD $18.4 million (~$12 million) from the Australian government to help grow the quantum industry and ecosystem.

The European Commission plans to spend €112 million (~$120 million) to support AI and quantum research and innovation.

Research

Intel researchers developed a 300-millimeter cryogenic probing process to collect high-volume data on the performance of silicon spin qubit devices across whole wafers using CMOS manufacturing techniques.

EPFL researchers used a form of ML called deep reinforcement learning (DRL) to train a four-legged robot to avoid falls by switching between walking, trotting, and pronking.=

The University of Cambridge researchers developed tiny, flexible nerve cuff devices that can wrap around individual nerve fibers without damaging them, useful to treat a range of neurological disorders.

Argonne National Laboratory and Toyota are exploring a direct recycling approach that carefully extracts components from spent batteries. Argonne is also working with Talon Metals on a process that could increase the number of EV batteries produced from mined nickel ore.

Events

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Further Reading

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Last weekend, it was revealed that Samsung is launching the 128GB version of the Galaxy S24 in India. The company sent a press note to all its retailers about this new storage variant, along with its pricing. Now, the 128GB version of Galaxy S24 is available for purchase in India.

Galaxy S24 128GB now available in India

The 128GB version of the Galaxy S24 is now listed on Samsung India's website. It is priced at INR 74,999, but buyers can get an instant discount of INR 5,000 through HDFC Bank credit and debit cards. So, the effective price of the phone would be INR 69,999. The device is available in Amber Yellow, Cobalt Violet, Onyx Black, and Marble Gray colors.

The phone was originally launched in India with two storage options: 256GB and 512 GB. Pre-order benefits included an instant discount of INR 8,000. The 256GB version of the Galaxy S24 costs INR 79,999, while the 512GB version costs INR 89,999. You can watch our in-depth review of the Galaxy S24 in the video below.

The Galaxy S24 has a 6.2-inch Dynamic AMOLED 2x screen with Full HD+ resolution, a 120Hz refresh rate, 2,600 nits peak brightness, HDR10+, and Gorilla Glass Victus 2 protection. It has an ultrasonic fingerprint reader, an IP68 rating, stereo speakers, and Dolby Audio. It is equipped with the Exynos 2400 processor, 8GB RAM, and a 4,000mAh battery. Additional features include the Samsung Wallet and Galaxy AI features.

It has a 12MP selfie camera with autofocus and 4K 60fps video recording. On the rear, it has a 50MP primary rear camera with dual-pixel autofocus and OIS, a 12MP ultrawide camera, and a 10MP telephoto camera (AF, OIS) with 3x optical zoom. The phone runs Android 14 out of the box and will get seven Android OS updates.

The post 128GB version of Galaxy S24 is now available for purchase in India appeared first on SamMobile.

Samsung has recently launched a new storage variant of its flagship smartphone, the Galaxy S24, in India. The new variant features 128GB of internal storage ...

The post Samsung Galaxy S24 128GB version launched in India appeared first on Gizchina.com.

Reports about green lines appearing on the display of some Samsung devices have been going around since last year. This is a big enough issue that the company has officially responded in some markets with the offer of providing a free one-time display replacement for out of warranty devices.

Samsung has been offering these display replacements for select models in India since last year, and the company has now expanded the list of supported models to include the Galaxy S21 and the Galaxy S22 series as well.

There's now a deadline to avail this replacement offer

This green line issue has primarily been reported on devices with Super AMOLED displays. Reports about the issue have reemerged over the past couple of weeks, highlighting the fact that even more devices suffer from it now, requiring Samsung to expand the free replacement offer to additional models.

Samsung India has been providing a free display replacement for affected devices since July last year. The eligible devices included the Galaxy S20 series and the Galaxy Note 20 series. The company has now expanded this list to include the Galaxy S21 series and the Galaxy S22 series.

Just like last year, all devices will also be offered a free battery and kit replacement, but it appears that there's now a deadline to avail this offer. Appointments must be booked at a Samsung Service Center until 30th April, 2024 to get a free replacement from the company.

Customers are effectively getting their entire device refurbished with this offer. Getting a new lease on life for a device like the Galaxy S22 that's still relatively modern and will have software support for some time as well is a deal too good to pass up.

The post Galaxy S21 and S22 with green line issue in India get free display replacement appeared first on SamMobile.

Despite challenging market conditions globally, Samsung has been quite resilient in India over the past year. While Apple stole Samsung's crown in 2023 worldwide, it isn't even close in the Indian market. In Q1 2024, Samsung was India's biggest smartphone manufacturer, and it achieved growth compared to Q1 2023.

Samsung performed well in the Indian smartphone market during Q1 2024

According to the latest figures released by market research firm Canalys, Samsung was India's biggest smartphone brand with a 19% market share. The South Korean firm shipped 6.7 million smartphones during the quarter, a 6% growth compared to Q1 2023. Canalys said that Samsung's strong performance came from stronger sales of the Galaxy S24 than its predecessor, thanks to attractive pre-booking offers, Samsung Finance+, and AI features.

Xiaomi ranked second in the market during Q1 2024, shipping 6.4 million smartphones and capturing an 18% market share. Samsung needs to be wary of Xiaomi, as there is just one percentage point difference between the two. Xiaomi's impressive 29% annual growth came on the back of great sales of affordable phones like the Redmi 13C 5G, Redmi Note 13 5G, and the POCO X6.

Vivo ranked third with 6.2 million smartphone shipments and 18% market share. That's a 14% rise compared to sales from Q1 2023. OPPO was the only brand among the top five OEMs with declining sales. It shipped 3.7 million smartphones, a 4% drop compared to sales from Q1 2023.

Realme shipped 3.4 million smartphones, 17% higher than last year's performance. It ranked fifth in the Indian smartphone market during Q1 2024. Overall, over 35.3 million smartphones were shipped in India in Q1 2023. That's 15% higher than smartphone sales in the country during the first quarter of last year.

Watch our review of the Galaxy S24+ below and click on the link below the video to buy the phone at a great price.

The post Samsung grew its smartphone market share in India, ranked first again appeared first on SamMobile.

In 2018, Samsung opened the company’s first Premium Experience Store in Bengaluru, India, the Samsung Opera House, which is also the company's flagship store in the country. Today, Samsung has opened the second Premium Experience Store in Bengaluru. This one is located in the Mall of Asia, which is situated in the Northern part of the city.

The new store is spread across 1,200 square feet of area. It has a “SmartThings station, Gaming zone, an audio-visual zone, and a smartphone and wearables section.” Samsung says that it will host a variety of events at the store, including the ‘Learn@Samsung’ program, which is designed for “tech-savvy consumers, especially Gen Z and millennials.” It will include “workshops around AI education focusing on consumer passion points.”

Inaugural offers

Samsung says that people coming to the store will get assured gifts, 2x loyalty points on all transactions above INR 15,000, and Galaxy Buds FE at INR 2,999 with select Galaxy devices for a limited period. The first 200 customers will also get early bird giveaways on the purchase of Samsung products worth INR 20,000 or more. Along with these offers, people can available a 10% student discount on smartphones, laptops, and smartwatches, “up to 22.5% cashback, and INR 22,000 in additional benefits on select items.”

In the press release, the Vice President of Samsung India’s D2C Business, Sumit Walia, says “Following six years of fantastic response to our flagship experience center in the city, the Samsung Opera House, we are delighted to introduce another Premium Experience Store in the Mall of Asia, Bengaluru. We aim to captivate local shoppers with immersive and uniquely tailored premium product experiences.”

“Our newest store is dedicated to engaging Bengaluru’s diverse consumer base by hosting ‘Learn @ Samsung’ workshops including productivity masterclass, portrait photography, nightography, and photo editing sessions that cater to various passion points. The dynamic retail market of the city provides an ideal backdrop for us to connect with our consumers and create memorable engagements,” he further added.

The post Samsung expands its lineup of Premium Experience Stores in India with Bengaluru store appeared first on SamMobile.

The government of India has approved a major investment in semiconductor and electronics production that will include the country’s first state-of-the-art semiconductor fab. It announced that three plants—one semiconductor fab and two packaging and test facilities—will break ground within 100 days. The government has approved 1.26 trillion Indian rupees (US $15.2 billion) for the projects.

India’s is the latest in a string of efforts to boost domestic chip manufacturing in the hope of making nations and regions more independent in what’s seen as a strategically critical industry. “On one end India has a large and growing domestic demand and on the other end global customers are looking at India for supply-chain resilience,” Frank Hong, chairman of Taiwan-based foundry Powerchip Semiconductor (PSMC), a partner in the new fab, said in a press release. “There could not have been a better time for India to make its entry into the semiconductor manufacturing industry.”

The country’s first fab will be an $11 billion joint venture between PSMC and Tata Electronics, a branch of the $370 billion Indian conglomerate. Through the partnership, it will be capable of 28-, 40-, 55-, and 110-nanometer chip production, with a capacity of 50,000 wafers per month. Far from the cutting edge, these technology nodes nevertheless are used in the bulk of chipmaking, with 28 nm being the most advanced node using planar CMOS transistors instead of the more advanced FinFET devices.

“The announcement is clear progress toward creating a semiconductor manufacturing presence in India,” says Rakesh Kumar, a professor of electrical and computer engineering at University of Illinois Urbana-Champaign and author of Reluctant Technophiles: India’s Complicated Relationship with Technology. “The choice of 28-nm, 40-nm, 55-nm, 90-nm, and 110-nm also seems sensible, since it limits the cost to the government and the players, who are taking a clear risk.”

According to Tata, the fab will make chips for applications such as power management, display drivers, microcontrollers, as well as and high-performance computing logic. Both the fab’s technological capability and target applications point toward products that were at the heart of the pandemic-era chip shortage.

The fab is in a new industrial zone in Dholera, in Gujarat, Prime Minister Narendra Modhi’s home state. Tata projects it will directly or indirectly lead to more than 20,000 skilled jobs in the region.

Chip Packaging Push

In addition to the chip fab, the government approved investments in two assembly, test, and packaging facilities, a sector of the semiconductor industry currently concentrated in Southeast Asia.

Tata Electronics will build a $3.25 billion plant at Jagiroad, in the eastern state of Assam. The company says it will offer a range of packaging technologies: wire bond and flip-chip, as well as system-in-package. It plans to expand into advanced packaging tech “in the future.” Advanced packaging, such as 3D integration, has emerged as a critical technology as the traditional transistor scaling of Moore’s Law has slowed and become increasingly expensive. Tata plans to start production at Jagiroad in 2025, and it predicts the plant will add 27,000 direct and indirect jobs to the local economy.

A joint venture between Japanese microcontroller giant Renesas, Thai chip packaging company Stars Microelectronics, and India’s CG Power and Industrial Solutions will build a $900 million packaging plant in Sanand, Gujarat. The plant will offer wire-bond and flip-chip technologies. CG, which will own 92 percent of the venture, is a Mumbai-based appliances and industrial motors and electronics firm.

There’s already a chip-packaging plant in the works in Sanand from a previous agreement. U.S.-based memory and storage maker Micron agreed last June to build a packaging and test facility there. Micron plans to spend $825 million in two phases on the plant. Gujarat and the Indian federal government is set to cover a further $1.925 billion. Micron expects the first phase to be operational by the end of 2024.

Generous Incentives

After an initial overture failed to attract chip companies, the government upped its ante. According to Stephen Ezzell at the Washington, D.C.–based policy-research organization the Information Technology and Innovation Foundation (IT&IF), India’s semiconductor incentives are now among the most attractive in the world.

In a report issued two weeks before the India fab announcement, Ezzell explained that for an approved silicon fab worth at least $2.5 billion and making 40,000 wafer starts per month the federal government will reimburse 50 percent of the fab cost with a state partner expected to add 20 percent. For a chip fab making smaller-volume products, such as sensors, silicon photonics, or compound semiconductors, the same formula holds, except that the minimum investment is $13 million. For a test and packaging facility, it’s just $6.5 million.

India is a rapidly growing consumer of semiconductors. Its market was worth $22 billion in 2019 and is expected to nearly triple to $64 billion by 2026, according to Counterpoint Technology Market Research. The country’s minister of state for IT and electronics, Rajeev Chandrasekhar projects further growth to $110 billion by 2030. At that point, it would account for 10 percent of global consumption, according to the IT&IF report.

About 20 percent of the world’s semiconductor design engineers are in India, according to the IT&IF report. And between March 2019 and 2023 semiconductor job openings in the country increased 7 percent. The hope is that the investment will be a draw for new engineering students.

By Adam Kovac, Karen Heyman, and Liz Allan.

India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan’s Powerchip. The second fab will be a joint investment between CG Power, Japan’s Renesas Electronics, and Thailand’s Stars Microelectronics. Tata will run the packaging facility, as well. India expects these efforts will add 20,000 advanced technology jobs and 60,000 indirect jobs, according to the Times of India. The country has been talking about building a fab for at least the past couple of decades, but funding never materialized.

The U.S. Department of Commerce (DoC) issued a CHIPS Act-based Notice of Funding Opportunity for R&D to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. The U.S. Secretary of Commerce said the government is prioritizing CHIPS Act funding for projects that will be operational by 2030 and anticipates America will produce 20% of the world’s leading-edge logic chips by the end of the decade.

The top three foundries plan to implement backside power delivery as soon as the 2nm node, setting the stage for faster and more efficient switching in chips, reduced routing congestion, and lower noise across multiple metal layers. But this novel approach to optimizing logic performance depends on advances in lithography, etching, polishing, and bonding processes.

Intel spun out Altera as a standalone FPGA company, the culmination of a rebranding and reorganization of its former Programmable Solutions Group. The move follows Intel’s decision to keep Intel Foundry at arm’s length, with a clean line between the foundry and the company’s processor business.

Multiple new hardware micro-architecture vulnerabilities were published in the latest Common Weakness Enumeration release this week, all related to transient execution (CWE 1420-1423).

The U.S. Office of the National Cyber Director (ONCD) published a technical report calling for the adoption of memory safe programming languages, aiming to reduce the attack surface in cyberspace and anticipate systemic security risk with better diagnostics. The DoC also is seeking information ahead of an inquiry into Chinese-made connected vehicles “to understand the extent of the technology in these cars that can capture wide swaths of data or remotely disable or manipulate connected vehicles.”

Quick links to more news:

Design and Power
Manufacturing and Test
Automotive
Security
Pervasive Computing and AI
Events

Design and Power

Micron began mass production of a new high-bandwidth chip for AI. The company said the HBM3E will be a key component in NVIDIA’s H2000 Tensor Core GPUs, set to begin shipping in the second quarter of 2024. HBM is a key component of 2.5D advanced packages.

Samsung developed a 36GB HBM3E 12H DRAM, saying it sets new records for bandwidth. The company achieved this by using advanced thermal compression non-conductive film, which allowed it to cram 12 layers into the area normally taken up by 8. This is a novel way of increasing DRAM density.

Keysight introduced QuantumPro, a design and simulation tool, plus workflow, for quantum computers. It combines five functionalities into the Advanced Design System (ADS) 2024 platform. Keysight also introduced its AI Data Center Test Platform, which includes pre-packaged benchmarking apps and dataset analysis tools.

Synopsys announced a 1.6T Ethernet IP solution, including 1.6T MAC and PCS Ethernet controllers, 224G Ethernet PHY IP, and verification IP.

Tenstorrent, Japan’s Leading-Edge Semiconductor Technology Center (LSTC) , and Rapidus are co-designing AI chips. LSTC will use Tenstorrent’s RISC-V and Chiplet IP for its forthcoming edge 2nm AI accelerator.

This week’s Systems and Design newsletter features these top stories:

• 2.5D Integration: Big Chip Or Small PCB: Defining whether a 5D device is a PCB shrunk to fit into a package or a chip that extends beyond the limits of a single die can have significant design consequences.
• Commercial Chiplets: Challenges of establishing a commercial chiplet.
• Accellera Preps New Standard For Clock-Domain Crossing: New standard aims to streamline the clock-domain crossing flow.
• Thinking Big: From Chips To Systems: Aart de Geus discusses the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices.
• Integration challenges for RISC-V: Modifying the source code allows for democratization of design, but it adds some hurdles for design teams (video).

Demand for high-end AI servers is driven by four American companies, which will account for 60% of global demand in 2024, according to Trendforce. NVIDIA is projected to continue leading the market, with AMD closing the gap due its lower cost model.

The EU consortium PREVAIL is accepting design proposals as it seeks to develop next-gen edge-AI technologies. Anchors include CEA-Leti, Fraunhofer-Gesellschaft, imec, and VTT, which will use their 300mm fabrication, design, and test facilities to validate prototypes.

Siemens joined an initiative to expand educational opportunities in the semiconductor space around the world. The Semiconductor Education Alliance was launched by Arm in 2023 and focuses on helping teach skills in IC design and EDA.

Q-CTRL announced partnerships with six firms that it says will expand access to its performance-management software and quantum technologies. Wolfram, Aqarios, and qBraid will integrate Q-CTRL’s Fire Opal technology into their products, while Qblox, Keysight, and Quantware will utilize Q-CTRL’s Boulder Opal hardware system.

NTT, Red Hat, NVIDIA, and Fujitsu teamed up to provide data pipeline acceleration and contain orchestration technologies targeted at real-time AI analysis of massive data sets at the edge.

Manufacturing and Test

The U.S. Department of Energy (DOE)’s Office of Electricity launched the American-Made Silicon Carbide (SiC)  Packaging Prize. This $2.25 million contest invites competitors to propose, design, build, and test state-of-the-art SiC semiconductor packaging prototypes.

Applied Materials introduced products and solutions for patterning issues in the “angstrom era,” including line edge roughness, tip-to-tip spacing limitations, bridge defects, and edge placement errors.

imec reported progress made in EUV processes, masks and metrology in preparation for high-NA EUV. It also identified advanced node lithography and etch related processes that contribute the most to direct emissions of CO2, along with proposed solutions.

proteanTecs will participate in the Arm Total Design ecosystem, which now includes more than 20 companies united around a charter to accelerate and simplify the development of custom SoCs based on Arm Neoverse compute subsystems.

NikkeiAsia took an in-depth look at Japan’s semiconductor ecosystem and concluded it is ripe for revival with investments from TSMC, Samsung, and Micron, among others. TrendForce came to a similar conclusion, pointing to the fast pace of Japan’s resurgence, including the opening of TSMC’s fab.

‍FormFactor closed its sale of its Suzhou and Shanghai companies to Grand Junction Semiconductor for $25M in cash.

The eBeam Initiative celebrated its 15th anniversary and welcomed a new member, FUJIFILM. The group also uncorked its fourth survey of its members technology using deep learning in the photomask-to-wafer manufacturing flow.

Automotive

Apple shuttered its electric car project after 10 years of development. The chaotic effort cost the company billions of dollars, according to The New York Times.

Infineon released new automotive programmable SoCs with fifth-gen human machine interface (HMI) technology, offering improved sensitivity in three packages. The MCU offers up to 84 GPIOs and 384 KB of flash memory. The company also released automotive and industrial-grade 750V G1 discrete SiC MOSFETs aimed at applications such as EV charging, onboard chargers, DC-DC converters, energy, solid state circuit breakers, and data centers.

Cadence expanded its Tensilica IP portfolio to boost computation for automotive sensor fusion applications. Vision, radar, lidar, and AI processing are combined in a single DSP for multi-modal, sensor-based system designs.

Ansys will continue translating fast computing into fast cars, as the company’s partnership with Oracle Red Bull Racing was renewed. The Formula 1 team uses Ansys technology to improve car aerodynamics and ensure the safety of its vehicles.

Lazer Sport adopted Siemens’ Xcelerator portfolio to connect 3D design with 3D printing for prototyping and digital simulation of its sustainable KinetiCore cycling helmet.

The chair of the U.S. Federal Communications Commission (FCC) suggested automakers that sell internet-connected cars should be subject to a telecommunications law aiming to protect domestic violence survivors, reports CNBC. This is due to emerging cases of stalking through vehicle location tracking technology and remote control of functions like locking doors or honking the horn.

BYD‘s CEO said the company does not plan to enter the U.S. market because it is complicated and electrification has slowed down, reports Yahoo Finance. Meanwhile, the first shipment of BYD vehicles arrived in Europe, according to DW News.

Ascent Solar Technologies’ solar module products will fly on NASA’s upcoming Lightweight Integrated Solar Array and AnTenna (LISA-T) mission.

Security

Researchers at Texas A&M University and the University of Delaware proposed the first red-team attack on graph neural network (GNN)-based techniques in hardware security.

A panel of four experts discuss mounting concerns over quantum security, auto architectures, and supply chain resiliency.

Synopsys released its ninth annual Open Source Security and Risk Analysis report, finding that 74% of code bases contained high-risk open-source vulnerabilities, up 54% since last year.

President Biden issued an executive order to prevent the large-scale transfer of Americans’ personal data to countries of concern. Types of data include genomic, biometric, personal health, geolocation, financial, and other personally identifiable information, which bad actors can use to track and scam Americans.

The National Institute of Standards and Technology (NIST) released Cybersecurity Framework (CSF) 2.0 to provide a comprehensive view for managing cybersecurity risk.

The EU Agency for Cybersecurity (ENISA) published a study on best practices for cyber crisis management, saying the geopolitical situation continues to impact the cyber threat landscape and planning for threats and incidents is vital for crisis management.

The U.S. Department of Energy (DOE) announced $45 million to protect the energy sector from cyberattacks.

The National Security Agency (NSA), the Federal Bureau of Investigation (FBI), and others published an advisory on Russian cyber actors using compromised routers.  Also the Cybersecurity and Infrastructure Security Agency (CISA), the UK National Cyber Security Centre (NCSC), and partners advised of tactics used by Russian Foreign Intelligence Service cyber actors to gain initial access into a cloud environment.

CISA, the FBI, and the Department of Health and Human Services (HHS) updated an advisory concerning the ALPHV Blackcat ransomware as a service (RaaS), which primarily targets the healthcare sector.

CISA also published a guide to support university cybersecurity clinics and issued other alerts.

Pervasive Computing and AI

Renesas expanded its RZ family of MPUs with a single-chip AI accelerator that offers 10 TOPS per watt power efficiency and delivers AI inference performance of up to 80 TOPS without a cooling fan. The chip is aimed at next-gen robotics with vision AI and real-time control.

Infineon launched dual-phase power modules to help data centers meet the power demands of AI GPU platforms. The company also released a family of solid-state isolators to deliver faster switching with up to 70% lower power dissipation.

Fig. 1: Infineon’s dual phase power modules: Source: Infineon

Amber Semiconductor announced a reference design for brushless motor applications using its AC to DC conversion semiconductor system to power ST‘s STM32 MCUs.

Micron released its universal flash storage (UFS) 4.0 package at just 9×13 mm, built on 232-layer 3D NAND and offering up to 1 terabyte capacity to enable next-gen phone designs and larger batteries.

LG and Meta teamed up to develop extended reality (XR) products, content, services, and platforms within the virtual space.

Microsoft and Mistral AI partnered to accelerate AI innovation and to develop and deploy Mistral’s next-gen large language models (LLMs).

Microsoft’s vice chair and president announced the company’s AI access principles, governing how it will operate AI datacenter infrastructure and other AI assets around the world.

Singtel and VMware partnered to enable enterprises to manage their connectivity and cloud infrastructure through the Singtel Paragon platform for 5G and edge cloud.

Keysight was selected as the Test Partner for the Deutsche Telekom Satellite NB-IoT Early Adopter Program, providing an end-to-end NB-IoT NTN testbed that allows designers and developers to validate reference designs for solutions using 3GPP Release 17 (Rel-17) NTN standards.

Global server shipments are predicted to increase by 2.05% in 2024, with AI servers accounting for about 12%, reports TrendForce. Also, the smartphone camera lens market is expected to rebound in 2024 with 3.8% growth driven by AI-smartphones, to reach about 4.22 billion units, reports TrendForce.

Yole released a smartphone camera comparison report with a focus on iPhone evolution and analysis of the structure, design, and teardown of each camera module, along with the CIS dimensions, technology node, and manufacturing processes.

Counterpoint released a number of 2023 reports on smartphone shipments by country and operator migrations to 5G.

Events

Find upcoming chip industry events here, including:

Upcoming webinars are here, including topics such as digital twins, power challenges in data centers, and designing for 112G interface compliance.

Further Reading and Newsletters

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

In our series of community stories, we celebrate some of the wonderful things young people and educators around the world are achieving through the power of technology. 

In our latest story, we’re heading to Vivek High School in Mohali, India, to meet Sahibjot, a 14-year-old coding enthusiast who has taken his hobby to the next level thanks to mentorship, Code Club, and the exciting opportunity to take part in the Coolest Projects 2023 global online showcase.

Introducing Sahibjot

When he was younger, Sahibjot loved playing video games. His interest in gaming led him to discover the world of game development, and he was inspired to find out more and try it out himself. He began to learn to code in his spare time, using tutorials to help him develop his skills.

Keen to share the joy he had experienced from gaming, Sahibjot set himself the challenge of creating a game for his cousin. This project cemented his enthusiasm for coding and developing games of his own.

“I always felt that I have played so many games in my life, why not make one and others will enjoy the same experience that I had as a child.

For my cousin, I made a personal game for him, and he played it and he liked it very much, so once he played it, I felt that, yes, this is what I want to do with my life.” – Sahibjot

Mentorship and collaboration

While continuing to hone his computing skills at home, Sahibjot heard that his school had started a Code Club. After initially feeling nervous about joining, his enthusiasm was bolstered by the club mentor, Rajan, talking about artificial intelligence and other interesting topics during the session, and he soon settled in. 

At Code Club, with support and encouragement from Rajan, Sahibjot continued to develop and grow his coding skills. Alongside his technical skills, he also learned about teamwork and working collaboratively. He embraced the opportunity to help his peers, sharing his knowledge with others and becoming a mentor for younger club members. 

“Last year, we joined this coding club together and we became friends. He’s a very friendly person. Whenever we need him, he just quickly helps us. He helps us to troubleshoot, find any bugs, or even fix our codes.” – Akshat, fellow Code Club member

A global opportunity

The next step for Sahibjot came when Rajan introduced him and his fellow Code Club members to Coolest Projects. Coolest Projects is a celebration of young digital creators and the amazing things they make with technology. It offers participants the opportunity to share their tech creations in a global, online showcase, and local in-person events celebrating young creators are also held in several countries.

Sahibjot was eager to take part and showcase what he had made. He submitted a Python project, a ping-pong game, to the online showcase, and was very excited to then see his creation receive a special shout-out during the Coolest Projects global livestream event. He was delighted to share this achievement with his friends and family, and he felt proud to be representing his school and his country on a global stage.

“I told everyone around me that there was going to be a livestream and I possibly might be featured in that, so that was really exciting. I learned a lot about just not representing my school and myself as an individual, I learned about representing my whole nation.” — Sahibjot

Sahibjot’s passion for computing has helped shape his aspirations and ambitions. Looking to the future, he hopes to use his technology skills to benefit others and make an impact.

“Using code and technology and all of the things like that, I aspire to make effort to do something with the world, like help out people with technology.” — Sahibjot

Inspire young creators like Sahibjot

To find out how you and young creators you know can get involved in Coolest Projects, visit coolestprojects.org. If the young people in your community are just starting out on their computing journey, visit our projects site for free, fun beginner coding projects.

For more information to help you set up a Code Club in your school, visit codeclub.org.

Join us in celebrating Sahibjot’s inspiring journey by sharing his story on X (formerly Twitter), LinkedIn, and Facebook.

The post Celebrating the community: Sahibjot appeared first on Raspberry Pi Foundation.