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  • ✇IEEE Spectrum
  • How Vannevar Bush Engineered the 20th CenturyG. Pascal Zachary
    In the summer of 1945, Robert J. Oppenheimer and other key members of the Manhattan Project gathered in New Mexico to witness the first atomic bomb test. Among the observers was Vannevar Bush, who had overseen the Manhattan Project and served as the sole liaison to U.S. President Franklin D. Roosevelt on progress toward the bomb. Remarkably, given his intense wartime responsibilities, Bush continued to develop his own ideas about computing and information. Just days before the Trinity test, h
     

How Vannevar Bush Engineered the 20th Century

18. Červen 2024 v 12:00


In the summer of 1945, Robert J. Oppenheimer and other key members of the Manhattan Project gathered in New Mexico to witness the first atomic bomb test. Among the observers was Vannevar Bush, who had overseen the Manhattan Project and served as the sole liaison to U.S. President Franklin D. Roosevelt on progress toward the bomb.

Remarkably, given his intense wartime responsibilities, Bush continued to develop his own ideas about computing and information. Just days before the Trinity test, he had published in The Atlantic Monthly a futuristic account of networks of information knitted together via “associative trails”—which we would now call hypertext or hyperlinks. To this day, Bush’s article—titled “As We May Think”—and his subsequent elaborations of networked information appliances are credited with shaping what would become the personal computer and the World Wide Web. And during his lifetime, Bush was celebrated as one of the nation’s leading prophets of technological change and the most influential proponent of government funding of science and engineering.

Illustration of the upper half of a man\u2019s face with text below the illustration. He\u2019s wearing an apparatus with a small camera lens strapped around his forehead. Vannevar Bush’s influential 1945 essay “As We May Think” shaped the subsequent development of the personal computer and the World Wide Web. The Atlantic Monthly

And yet, if you watched this year’s Oscar-winning Oppenheimer, Bush is only a minor character. Played by actor Matthew Modine, he testifies before a secret government panel that will decide whether Oppenheimer, scientific director of the Manhattan Project, should be stripped of his security clearance and banished from participating in future government decisions on sensitive technological issues.

“Try me, if you want to try him,” Bush defiantly tells the panel. Alas, tragedy unfolds when the panel punishes Oppenheimer for his opposition to testing the nation’s first hydrogen bomb. No more is said about Bush, even though he also opposed the first H-bomb test, on the grounds that the test, held on 1 November 1952, would help the Soviet Union build its own superweapon and accelerate a nuclear arms race. Bush was spared sanction and continued to serve in government, while Oppenheimer became a pariah.

Today, though, Oppenheimer is lionized while Bush is little known outside a small circle of historians, computer scientists, and policy thinkers. And yet, Bush’s legacy is without a doubt the more significant one for engineers and scientists, entrepreneurs, and public policymakers. He died at the age of 84 on 28 June 1974, and the 50th anniversary of his death seems like a good time to reflect on all that Vannevar Bush did to harness technological innovation as the chief source of economic, political, and military power for the United States and other leading nations.

Vannevar Bush and the Funding of Science & Engineering

Beginning in 1940, and with the ear of the president and leading scientific and engineering organizations, Vannevar Bush promoted the importance of supporting all aspects of research, including in universities, the military, and industry. Bush’s vision was shaped by World War II and America’s need to rapidly mobilize scientists and engineers for war fighting and defense. And it deepened during the long Cold War.

Bush’s pivotal contribution was his creation of the “research contract,” whereby public funds are awarded to civilian scientists and engineers based on effort, not just outcomes (as had been normal before World War II). This freedom to try new things and take risks transformed relations between government, business, and academia. By the end of the war, Bush’s research organization was spending US $3 million a week (about $52 million in today’s dollars) on some 6,000 researchers, most of them university professors and corporate engineers.

Illustrated portrait of a man with gray hair and eyeglasses next to a contraption that looks like a vacuum tube projecting a bullet. On its 3 April 1944 cover, Time called Vannevar Bush the “General of Physics,” for his role in accelerating wartime R&D.Ernest Hamlin Baker/TIME

Celebrated as the “general of physics” on the cover of Time magazine in 1944, Bush served as the first research chief of the newly created Department of Defense in 1947. Three years later, he successfully advocated for the creation of a national science foundation, to nourish and sustain civilian R&D. In launching his campaign for the foundation, Bush issued a report, entitled Science, The Endless Frontier, in which he argued that the nation’s future prosperity and the American spirit of “frontier” exploration depended on advances in science and engineering.

Bush’s influence went well beyond the politics of research and the mobilization of technology for national security. He was also a business innovator. In the 1920s, he cofounded Raytheon, and the company competed with behemoth RCA in the design and manufacture of vacuum tubes. As a professor and later dean of engineering at the Massachusetts Institute of Technology, he crafted incentives for professors to consult part time for business, setting in motion in the 1920s and 1930s practices now considered essential to science-based industry.

Bush’s beliefs influenced Frederick Terman, a doctoral student of his, to join Stanford University, where Terman played a decisive role in the birth of Silicon Valley. Another Bush doctoral student, Claude Shannon, joined Bell Labs and founded information theory. As a friend and trusted adviser to Georges Doriot, Bush helped launch one of the first venture capital firms, American Research and Development Corp.

Vannevar Bush’s Contributions to Computing

Black and white photo of a man in a suit leaning over a table-length machine with many rows of metal gears, shafts, and cranks. Starting in the 1920s, Bush began designing analog computing machines, known as differential analyzers. This version was at Aberdeen Proving Ground, in Maryland.MIT Museum

But wait, there’s more! Bush was a major figure in the early history of modern computing. In the 1930s, he gained prestige as the designer of a room-size analog computing machine known as the “differential analyzer,” then considered the most powerful calculating machine on the planet. It was visually impressive enough that UCLA’s differential analyzer had a major cameo in the 1951 sci-fi movie When Worlds Collide.

In the 1940s, despite his busy schedule with the Manhattan Project, Bush set aside time to envision and build working models of a desktop “memory extender,” or memex, to assist professionals in managing information and making decisions. And, as mentioned, he published that pivotal Atlantic article.

For engineers, Bush carries a special significance because of his passionate arguments throughout his life that all engineers—especially electrical engineers—deserve the same professional status as doctors, lawyers, and judges. Before World War II, engineers were viewed chiefly as workers for hire who did what they were told by their employers, but Bush eloquently insisted that engineers possessed professional rights and obligations and that they delivered their expert judgments independently and, when feasible, with the public interest in mind.

Black and white photo of an older white man in a three-piece suit. Vannevar Bush considered engineering not just a job but a calling. John Lent/AP

From the distance of a half century, Bush’s record as a futurist was mixed. He failed to envision the enormous expansion of both digital processing power and storage. He loudly proclaimed that miniaturized analog images stored on microfilm would long provide ample storage. (To be fair, many old microfilm and microfiche archives remain readable, unlike, say, digital video disks and old floppies.)

And yet, Bush’s ideas about the future of information have proved prescient. He believed, for example, that human consciousness could be enhanced through computational aids and that the automation of routine cognitive tasks could liberate human minds to concentrate and solve more difficult problems.

In this regard, Bush prefigures later computing pioneers like Douglas Engelbart (inventor of the mouse) and Larry Page (cofounder of Google), who promoted the concept of human “augmentation” through innovative digital means, such as hypertext and search, and enhancing the speed, accuracy, and depth of purposeful thought. Indeed, today’s debate over the harm to humans from generative AI could benefit from Bush’s own calm assessment about the creative, intellectual, and artistic benefits to be gained from “the revolution in machines to reduce mental drudgery.” The subject of human enhancement through digital systems was “almost constantly” on his mind, he wrote in his 1970 memoir, Pieces of the Action, four years before his death. Bush cautioned against hysteria in the face of digitally mediated cognitive enhancements. And he insisted that our technological systems should maintain the proverbial “human in the loop,” in order to honor and safeguard our values in the tricky management of digital information systems.

The fate of human culture and values was not Bush’s only worry. In his later life, he fretted about the spread of nuclear weapons and the risk of their use. Fittingly, as the titular head of the Manhattan Project and, in the 1950s, an opponent of testing the first H-bomb, he saw nuclear weapons as an existential threat to all life on the planet.

Bush identified no ultimate solutions to these problems. Having done so much to enhance and solidify the role of scientists and engineers in the advancement of society, he nevertheless foresaw an uncertain world, where scientific and technological outcomes would also continue to challenge us.

  • ✇Semiconductor Engineering
  • Chip Industry Week In ReviewThe SE Staff
    JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it’s not possible to choose the best chiplet for a particular application or workload. The guidelines are a prerequisite for a multi-vendor chiplet marketplace. AMD, Broadcom, Cisco, Google, HPE, Intel, Me
     

Chip Industry Week In Review

31. Květen 2024 v 09:01

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it’s not possible to choose the best chiplet for a particular application or workload. The guidelines are a prerequisite for a multi-vendor chiplet marketplace.

AMD, Broadcom, Cisco, Google, HPE, Intel, Meta, and Microsoft proposed a new high-speed, low-latency interconnect specification, Ultra Accelerator Link (UALink), between accelerators and switches in AI computing pods. The 1.0 specification will enable the connection of up to 1,024 accelerators within a pod and allow for direct loads and stores between the memory attached to accelerators.

Arm debuted a range of new CPUs, including the Cortex-X925 for on-device generative AI, and the Cortex-A725 with improved efficiency for AI and mobile gaming. It also announced the Immortalis-G925 GPU for flagship smartphones, and the Mali-G725/625 GPUs for consumer devices. Additionally, Arm announced Compute Subsystems (CSS) for Client to provide foundational computing elements for AI smartphone and PC SoCs, and it introduced KleidiAI, a set of compute kernels for developers of AI frameworks. The Armv9-A architecture also added support for the Scalable Matrix Extension to accelerate AI workloads.

TSMC said its 2nm process is on target to begin mass production in 2025. Meanwhile, Samsung is expected to release its 1nm plan next month, targeting mass production for 2026 — a year ahead of schedule, reports Business Korea.

CHIPs for America and NATCAST released a 2024 roadmap for the U.S. National Semiconductor Technology Center (NSTC), identifying priorities for facilities, research, workforce development, and membership.

China is investing CNY 344 billion (~$47.5 billion) into the third phase of its National Integrated Circuit Industry Investment Fund, also known as the Big Fund, to support its semiconductor sector and supply chain, according to numerous reports.

Malaysia plans to invest $5.3 billion in seed capital and support for semiconductor manufacturing in an effort to attract more than $100 billion in foreign investments, reports Reuters. Prime Minister Anwar Ibrahim announced the effort to create at least 10 companies focused on IC design, advanced packaging, and equipment manufacturing.

imec demonstrated a die-to-wafer hybrid bonding flow for Cu-Cu and SiCN-SiCN at pitches down to 2µm at the IEEE’s ECTC conference. This breakthrough could enable die and wafer-level optical interconnects.

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve.

Quick links to more news:

In-Depth
Global
Product News
Markets and Money
Security
Research and Training
Quantum
Events and Further Reading


In-Depth

Semiconductor Engineering published its Systems & Design newsletter featuring these top stories:


Global

STMicroelectronics is building a fully integrated SiC facility in Catania, Italy.  The high-volume 200mm facility is projected to cost over $5 billion.

Siliconware Precision Industries Co. Ltd.(SPIL) broke ground on an RM 6 billion (~$1.3 billion) advanced packaging and testing facility in Malaysia. Also, Google will invest $2 billion in Malaysia for its first data center, and a Google Cloud hub to meet growing demand for cloud services and AI literacy programs, reports AP.

In an SEC filing, Applied Materials received additional subpoenas from the U.S. Department of Commerce’s (DoC) Bureau of Industry and Security related to shipments of advanced semiconductor equipment to China. This comes on the heels of similar subpoenas issued last year.

A Chinese contractor working for SK hynix was arrested in South Korea and is being charged with funneling more than 3,000 copies of a paper on solving process failure issues to Huawei, reports South Korea’s Union News.

VSORA, CEA-Grenoble, and Valeo were awarded $7 million from the French government to build low-latency, low-power AI inference co-processors for autonomous driving and other applications.

In the U.S., the National Highway Traffic Safety Administration (NHTSA) is investigating unexpected driving behaviors of vehicles equipped with Waymo‘s 5th Generation automated driving system (ADS), with details of nine new incidents on top of the first 22.


Product News

ASE introduced powerSIP, a power delivery platform designed to reduce signal and transmission loss while addressing current density challenges.

Infineon announced a roadmap for energy-efficient power supply units based on Si, SiC, and GaN to address the energy needs of AI data centers, featuring new 8 kW and 12 kW PSUs, in addition to the 3 kW and 3.3 kW units available today. The company also released its CoolSiC MOSFET 400 V family, specially developed for use in the AC/DC stage of AI servers, complementing the PSU roadmap.

Fig. 1: Infineon’s 8kW PSU. Source: Infineon

Infineon also introduced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN TM devices, enabling customers to use GaN in voltage classes from 40 V to 700 V. The devices are built using Infineon’s 8-inch foundry processes.

Ansys launched Ansys Access on Microsoft Azure to provide pre-configured simulation products optimized for HPC on Azure infrastructure.

Foxconn Industrial Internet used Keysight Technology’s Open RAN Studio solution to certify an outdoor Open Radio Unit (O-RU).

Andes Technology announced an SoC and development board for the development and porting of large RISC-V applications.

MediaTek uncorked a pair of mobile chipsets built on a 4nm process that use an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores.

The NVIDIA H200 Blackwell platform is expected to begin shipping in Q3 of 2024 and will be available to data centers by Q4, according to TrendForce.

A room-temperature direct fusion hybrid bonding system from Be Semiconductor has shipped to the NHanced advanced packaging facility in North Carolina. The new system offers faster throughput for copper interconnects with submicron pad sizes, greater accuracy and reduced warpage.


Markets and Money

Frore Systems raised $80 million for its solid-state active cooling module, which removes heat from the top of a chip without fans. The device in systems ranging from notebooks and network edge gateways to data centers.

Axus Technology received $12.5 million in capital equity funding to make its chemical mechanical planarization (CMP) equipment for semiconductor wafer polishing, thinning, and cleaning, including of silicon carbide (SiC) wafers.

Elon Musk’s xAI announced a series B funding round of $6 billion.

Micron was ordered to pay $445 million in damages to Netlist for patent infringement of the company’s DDR4 memory module technology between 2021 and 2024.

Global revenue from AI semiconductors is predicted to total $71 billion in 2024, up 33% from 2023, according to Gartner. In 2025, it is expected to jump to $91.9 billion. The value of AI accelerators used in servers is expected to total $21 billion in 2024 and reach $33 billion by 2028.

NAND flash revenue was $14.71 billion in Q1 2024, an increase of 28.1%, according to TrendForce.

The optical transceiver market dipped from $11 billion in 2022 to $10.9 billion in 2023, but it is predicted to reach $22.4 billion by 2029, driven by AI, 800G applications, and the transition to 200G/lane ecosystem technologies, reports Yole.

Yole also found that ultra-wideband technical choices and packaging types used by NXP, Apple, and Qorvo vary considerably, ranging from 7nm to 90nm, with both CMOS and finFET transistors.

The global market share of GenAI-capable smartphones increased to 6% in Q1 2024 from 1.3% in the previous quarter, reports Counterpoint. The premium segment accounted for over 70% of sales with Samsung on top and contributing 58%. Meanwhile, global foldable smartphone shipments were up 49% YoY in Q1 2024, led by Huawei, HONOR, and Motorola.


Security

The National Science Foundation awarded Worcester Polytechnic Institute researcher Shahin Tajik almost $0.6 million to develop new technologies to address hardware security vulnerabilities.

The Hyperform consortium was formed to develop European sovereignty in post-quantum cryptography, funded by the French government and EU credits. Members include IDEMIA Secure Transactions, CEA Leti, and the French cybersecurity agency (ANSSI).

In security research:

  • University of California Davis and University of Arizona researchers proposed a framework leveraging generative pre-trained transformer (GPT) models to automate the obfuscation process.
  • Columbia University and Intel researchers presented a secure digital low dropout regulator that integrates an attack detector and a detection-driven protection scheme to mitigate correlation power analysis.
  • Pohang University of Science and Technology (POSTECH) researchers analyzed threshold switch devices and their performance in hardware security.

The U.S. Defense Advanced Research Projects Agency (DARPA) seeks proposals for its AI Quantified program to develop technology to help deploy generative AI safely and effectively across the Department of Defense (DoD) and society.

Vanderbilt University and Oak Ridge National Laboratory (ORNL) partnered to develop dependable AI for national security applications.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.


Research and Training

New York continues to amp up their semiconductor offerings. NY CREATES and Raytheon unveiled a semiconductor workforce training program. And Syracuse  University is hosting a free virtual course focused on the semiconductor industry this summer.

In research news:

  • A team of researchers at MIT and other universities found that extreme temperatures up to 500°C did not significantly degrade GaN materials or contacts.
  • University of Cambridge researchers developed adaptive and eco-friendly sensors that can be directly and imperceptibly printed onto biological surfaces, such as a finger or flower petal.
  • Researchers at Rice University and Hanyang University developed an elastic material that moves like skin and can adjust its dielectric frequency to stabilize RF communications and counter disruptive frequency shifts that interfere with electronics when a substrate is twisted or stretched, with potential for stretchable wearable electronic devices.

The National Science Foundation (NSF) awarded $36 million to three projects chosen for their potential to revolutionize computing. The University of Texas at Austin-led project aims to create a next-gen open-source intelligent and adaptive OS. The Harvard University-led project targets sustainable computing. The University of Massachusetts Amherst-led project will develop computational decarbonization.


Quantum

Singapore will invest close to S$300 million (~$222 million) into its National Quantum Strategy to support the development and deployment of quantum technologies, including an initiative to design and build a quantum processor within the country.

Several quantum partnerships were announced:

  • Riverlane and Alice & Bob will integrate Riverlane’s quantum error correction stack within Alice & Bob’s larger quantum computing system based on cat qubit technology.
  • New York University and the University of Copenhagen will collaborate to explore the viability of hybrid superconductor-semiconductor quantum materials for the production of quantum chips and integration with CMOS processes.
  • NXP, eleQtron, and ParityQC showed off a full-stack, ion-trap based quantum computer demonstrator for Germany’s DLR Quantum Computing Initiative.
  • Photonic says it demonstrated distributed entanglement between quantum modules using optically-linked silicon spin qubits with a native telecom networking interface as part of a quantum internet effort with Microsoft.
  • Classiq and HPE say they developed a rapid method for solving large-scale combinatorial optimization problems by combining quantum and classical HPC approaches.

Events and Further Reading

Find upcoming chip industry events here, including:

Event Date Location
Hardwear.io Security Trainings and Conference USA 2024 May 28 – Jun 1 Santa Clara, CA
SWTest Jun 3 – 5 Carlsbad, CA
IITC2024: Interconnect Technology Conference Jun 3 – 6 San Jose, CA
VOICE Developer Conference Jun 3 – 5 La Jolla, CA
CHIPS R&D Standardization Readiness Level Workshop Jun 4 – 5 Online and Boulder, CO
SNUG Europe: Synopsys User Group Jun 10 – 11 Munich
IEEE RAS in Data Centers Summit: Reliability, Availability and Serviceability Jun 11 – 12 Santa Clara, CA
3D & Systems Summit Jun 12 – 14 Dresden, Germany
PCI-SIG Developers Conference Jun 12 – 13 Santa Clara, CA
AI Hardware and Edge AI Summit: Europe Jun 18 – 19 London, UK
DAC 2024 Jun 23 – 27 San Francisco
Find All Upcoming Events Here

Upcoming webinars are here, including integrated SLM analytics solution, prototyping and validation of perception sensor systems, and improving PCB designs for performance and reliability.


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