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Chip Industry Technical Paper Roundup: June 10
10. Červen 2024 v 09:01
New technical papers added to Semiconductor Engineering’s library this week.
| Technical Paper | Research Organizations |
|---|---|
| NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors | Carnegie Mellon University |
| Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core | University of Southampton |
| High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C | MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology |
| Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration | Rochester Institute of Technology and Lux Semiconductors |
| Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin | Delft University of Technology and NXP Semiconductors |
| On the quality of commercial chemical vapour deposited hexagonal boron nitride | KAUST and the National Institute for Materials Science in Japan |
| CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications | STMicroelectronics and University of Catania |
| Imperceptible augmentation of living systems with organic bioelectronic fibres | University of Cambridge and University of Macau |
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