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  • ✇Semiconductor Engineering
  • Chip Industry Technical Paper Roundup: June 10Linda Christensen
    New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State U
     
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Chip Industry Technical Paper Roundup: June 10

✇Semiconductor Engineering
Od: Linda Christensen
10. Červen 2024 v 09:01

New technical papers added to Semiconductor Engineering’s library this week.

Technical Paper Research Organizations
NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University
Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton
High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration Rochester Institute of Technology and Lux Semiconductors
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin Delft University of Technology and NXP Semiconductors
On the quality of commercial chemical vapour deposited hexagonal boron nitride KAUST and the National Institute for Materials Science in Japan
CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications STMicroelectronics and University of Catania
Imperceptible augmentation of living systems with organic bioelectronic fibres University of Cambridge and University of Macau

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Technical Paper Library home

The post Chip Industry Technical Paper Roundup: June 10 appeared first on Semiconductor Engineering.

Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)

✇Semiconductor Engineering
Od: Technical Paper Link
31. Květen 2024 v 18:39

A technical paper titled “Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” was published by researchers at Rochester Institute of Technology and Lux Semiconductors.

Abstract:

“Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packaging techniques are currently being considered, including organic, glass, and semiconductor-based substrates that allow for 2.5D or 3D integration of chips and devices. Metal-core substrates are a new alternative with similar properties to those of semiconductor-based substrates but with the added benefits of higher flexibility and metal ductility. This work comprehensively compares the thermal properties of a novel metal-based substrate, molybdenum, and silicon and fused silica glass substrates in the context of system-on-foil (SoF) integration. A simple electronic technique is used to simulate the heat generated by a typical CPU and to measure the heat dissipation properties of the substrates. The results indicate that molybdenum and silicon are able to effectively dissipate a continuous power density of 2.3 W/mm2 as the surface temperature only increases by ~15°C. In contrast, the surface temperature of fused silica glass substrates increases by >140°C for the same applied power. These simple techniques and measurements were validated with infrared camera measurements as well as through finite element analysis via COMSOL simulation. The results validate the use of molybdenum as an advanced packaging substrate and can be used to characterize new substrates and approaches for advanced packaging.”

Find the technical paper here. Published May 2024.

Huang, Tzu-Jung, Tobias Kiebala, Paul Suflita, Chad Moore, Graeme Housser, Shane McMahon, and Ivan Puchades. 2024. “Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” Electronics 13, no. 10: 1818. https://doi.org/10.3390/electronics13101818

Related Reading
The Race To Glass Substrates
Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

 

The post Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux) appeared first on Semiconductor Engineering.

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