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  • ✇Semiconductor Engineering
  • Chip Industry Technical Paper Roundup: June 10Linda Christensen
    New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State U
     
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Chip Industry Technical Paper Roundup: June 10

✇Semiconductor Engineering
Od: Linda Christensen
10. Červen 2024 v 09:01

New technical papers added to Semiconductor Engineering’s library this week.

Technical Paper Research Organizations
NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University
Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton
High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration Rochester Institute of Technology and Lux Semiconductors
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin Delft University of Technology and NXP Semiconductors
On the quality of commercial chemical vapour deposited hexagonal boron nitride KAUST and the National Institute for Materials Science in Japan
CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications STMicroelectronics and University of Catania
Imperceptible augmentation of living systems with organic bioelectronic fibres University of Cambridge and University of Macau

More Reading
Technical Paper Library home

The post Chip Industry Technical Paper Roundup: June 10 appeared first on Semiconductor Engineering.

  • ✇Semiconductor Engineering
  • Voltage Reference Architectures For Harsh Environments: Quantum Computing And SpaceTechnical Paper Link
    A technical paper titled “Cryo-CMOS Voltage References for the Ultrawide Temperature Range From 300 K Down to 4.2 K” was published by researchers at Delft University of Technology, QuTech, Kavli Institute of Nanoscience Delft, and École Polytechnique Fédérale de Lausanne (EPFL). Abstract: “This article presents a family of sub-1-V, fully-CMOS voltage references adopting MOS devices in weak inversion to achieve continuous operation from room temperature (RT) down to cryogenic temperatures. Their
     
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Voltage Reference Architectures For Harsh Environments: Quantum Computing And Space

✇Semiconductor Engineering
Od: Technical Paper Link
2. Květen 2024 v 16:18

A technical paper titled “Cryo-CMOS Voltage References for the Ultrawide Temperature Range From 300 K Down to 4.2 K” was published by researchers at Delft University of Technology, QuTech, Kavli Institute of Nanoscience Delft, and École Polytechnique Fédérale de Lausanne (EPFL).

Abstract:

“This article presents a family of sub-1-V, fully-CMOS voltage references adopting MOS devices in weak inversion to achieve continuous operation from room temperature (RT) down to cryogenic temperatures. Their accuracy limitations due to curvature, body effect, and mismatch are investigated and experimentally validated. Implemented in 40-nm CMOS, the references show a line regulation better than 2.7%/V from a supply as low as 0.99 V. By applying dynamic element matching (DEM) techniques, a spread of 1.2% (3 σ ) from 4.2 to 300 K can be achieved, resulting in a temperature coefficient (TC) of 111 ppm/K. As the first significant statistical characterization extending down to cryogenic temperatures, the results demonstrate the ability of the proposed architectures to work under cryogenic harsh environments, such as space-and quantum-computing applications.”

Find the technical paper here. Published April 2024.

J. van Staveren et al., “Cryo-CMOS Voltage References for the Ultrawide Temperature Range From 300 K Down to 4.2 K,” in IEEE Journal of Solid-State Circuits, doi: 10.1109/JSSC.2024.3378768.

Further Reading
The Race Toward Quantum Advantage
Enormous amounts of money have been invested into quantum computing, but so far it has not surpassed conventional computers. When will that change?
Managing P/P Tradeoffs With Voltage Droop Gets Trickier
Higher current densities set against lower power envelopes makes meeting specs more challenging, especially at advanced nodes.

The post Voltage Reference Architectures For Harsh Environments: Quantum Computing And Space appeared first on Semiconductor Engineering.

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