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  • ✇Semiconductor Engineering
  • Chip Industry Technical Paper Roundup: August 20Linda Christensen
    New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Design Technology Co-Optimization and Time-Efficient Verification for Enhanced Pin Accessibility in the Post-3-nm Node Samsung Electronics and Kyungpook National University (KNU) Search-in-Memory (SiM): Reliable, Versatile, and Efficient Data Matching in SSD’s NAND Flash Memory Chip for Data Indexing Acceleration TU Dortmund, Academia Sinica, and National Taiwan Univers
     
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Chip Industry Technical Paper Roundup: August 20

✇Semiconductor Engineering
Od: Linda Christensen
20. Srpen 2024 v 09:01

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Design Technology Co-Optimization and Time-Efficient Verification for Enhanced Pin Accessibility in the Post-3-nm Node Samsung Electronics and Kyungpook National University (KNU)
Search-in-Memory (SiM): Reliable, Versatile, and Efficient Data Matching in SSD’s NAND Flash Memory Chip for Data Indexing Acceleration TU Dortmund, Academia Sinica, and National Taiwan University
Achieving Sustainability in the Semiconductor Industry: The Impact of Simulation and AI Lam Research
HMComp: Extending Near-Memory Capacity using Compression in Hybrid Memory Chalmers University of Technology and ZeroPoint Technologies
Retention-aware zero-shifting technique for Tiki-Taka algorithm-based analog deep learning accelerator Pohang University of Science and Technology, Korea University, and Kyungpook National University
Improvement of Contact Resistance and 3D Integration of 2D Material Field-Effect Transistors Using Semi-Metallic PtSe2 Contacts Yonsei University, Korea Advanced Institute of Science and Technology (KAIST), Lincoln University College, Korea Institute of Science and Technology (KIST), and Ewha Womans University
Ultra-steep slope cryogenic FETs based on bilayer graphene RWTH Aachen University, Forschungszentrum Julich, National Institute for Materials Science (Japan), and AMO GmbH

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Technical Paper Library home

The post Chip Industry Technical Paper Roundup: August 20 appeared first on Semiconductor Engineering.

  • ✇Semiconductor Engineering
  • Chip Industry Technical Paper Roundup: June 10Linda Christensen
    New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State U
     
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Chip Industry Technical Paper Roundup: June 10

✇Semiconductor Engineering
Od: Linda Christensen
10. Červen 2024 v 09:01

New technical papers added to Semiconductor Engineering’s library this week.

Technical Paper Research Organizations
NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University
Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton
High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration Rochester Institute of Technology and Lux Semiconductors
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin Delft University of Technology and NXP Semiconductors
On the quality of commercial chemical vapour deposited hexagonal boron nitride KAUST and the National Institute for Materials Science in Japan
CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications STMicroelectronics and University of Catania
Imperceptible augmentation of living systems with organic bioelectronic fibres University of Cambridge and University of Macau

More Reading
Technical Paper Library home

The post Chip Industry Technical Paper Roundup: June 10 appeared first on Semiconductor Engineering.

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