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  • ✇Semiconductor Engineering
  • Chip Industry Technical Paper Roundup: June 10Linda Christensen
    New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State U
     

Chip Industry Technical Paper Roundup: June 10

10. Červen 2024 v 09:01

New technical papers added to Semiconductor Engineering’s library this week.

Technical Paper Research Organizations
NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University
Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton
High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration Rochester Institute of Technology and Lux Semiconductors
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin Delft University of Technology and NXP Semiconductors
On the quality of commercial chemical vapour deposited hexagonal boron nitride KAUST and the National Institute for Materials Science in Japan
CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications STMicroelectronics and University of Catania
Imperceptible augmentation of living systems with organic bioelectronic fibres University of Cambridge and University of Macau

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Technical Paper Library home

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  • ✇Semiconductor Engineering
  • Framework For Early Anomaly Detection In AMS Components Of Automotive SoCsTechnical Paper Link
    A technical paper titled “Enhancing Functional Safety in Automotive AMS Circuits through Unsupervised Machine Learning” was published by researchers at University of Texas at Dallas, Intel Corporation, NXP Semiconductors, and Texas Instruments. Abstract: “Given the widespread use of safety-critical applications in the automotive field, it is crucial to ensure the Functional Safety (FuSa) of circuits and components within automotive systems. The Analog and Mixed-Signal (AMS) circuits prevalent in
     

Framework For Early Anomaly Detection In AMS Components Of Automotive SoCs

A technical paper titled “Enhancing Functional Safety in Automotive AMS Circuits through Unsupervised Machine Learning” was published by researchers at University of Texas at Dallas, Intel Corporation, NXP Semiconductors, and Texas Instruments.

Abstract:

“Given the widespread use of safety-critical applications in the automotive field, it is crucial to ensure the Functional Safety (FuSa) of circuits and components within automotive systems. The Analog and Mixed-Signal (AMS) circuits prevalent in these systems are more vulnerable to faults induced by parametric perturbations, noise, environmental stress, and other factors, in comparison to their digital counterparts. However, their continuous signal characteristics present an opportunity for early anomaly detection, enabling the implementation of safety mechanisms to prevent system failure. To address this need, we propose a novel framework based on unsupervised machine learning for early anomaly detection in AMS circuits. The proposed approach involves injecting anomalies at various circuit locations and individual components to create a diverse and comprehensive anomaly dataset, followed by the extraction of features from the observed circuit signals. Subsequently, we employ clustering algorithms to facilitate anomaly detection. Finally, we propose a time series framework to enhance and expedite anomaly detection performance. Our approach encompasses a systematic analysis of anomaly abstraction at multiple levels pertaining to the automotive domain, from hardware- to block-level, where anomalies are injected to create diverse fault scenarios. By monitoring the system behavior under these anomalous conditions, we capture the propagation of anomalies and their effects at different abstraction levels, thereby potentially paving the way for the implementation of reliable safety mechanisms to ensure the FuSa of automotive SoCs. Our experimental findings indicate that our approach achieves 100% anomaly detection accuracy and significantly optimizes the associated latency by 5X, underscoring the effectiveness of our devised solution.”

Find the technical paper here. Published April 2024 (preprint).

Arunachalam, Ayush, Ian Kintz, Suvadeep Banerjee, Arnab Raha, Xiankun Jin, Fei Su, Viswanathan Pillai Prasanth, Rubin A. Parekhji, Suriyaprakash Natarajan, and Kanad Basu. “Enhancing Functional Safety in Automotive AMS Circuits through Unsupervised Machine Learning.” arXiv preprint arXiv:2404.01632 (2024).

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Creating IP In The Shadow Of ISO 26262
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Shifting Left Using Model-Based Engineering
MBSE becomes useful for identifying potential problems earlier in the design flow, but it’s not perfect.

 

The post Framework For Early Anomaly Detection In AMS Components Of Automotive SoCs appeared first on Semiconductor Engineering.

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