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  • ✇Semiconductor Engineering
  • Chip Industry Technical Paper Roundup: August 20Linda Christensen
    New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Design Technology Co-Optimization and Time-Efficient Verification for Enhanced Pin Accessibility in the Post-3-nm Node Samsung Electronics and Kyungpook National University (KNU) Search-in-Memory (SiM): Reliable, Versatile, and Efficient Data Matching in SSD’s NAND Flash Memory Chip for Data Indexing Acceleration TU Dortmund, Academia Sinica, and National Taiwan Univers
     

Chip Industry Technical Paper Roundup: August 20

20. Srpen 2024 v 09:01

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Design Technology Co-Optimization and Time-Efficient Verification for Enhanced Pin Accessibility in the Post-3-nm Node Samsung Electronics and Kyungpook National University (KNU)
Search-in-Memory (SiM): Reliable, Versatile, and Efficient Data Matching in SSD’s NAND Flash Memory Chip for Data Indexing Acceleration TU Dortmund, Academia Sinica, and National Taiwan University
Achieving Sustainability in the Semiconductor Industry: The Impact of Simulation and AI Lam Research
HMComp: Extending Near-Memory Capacity using Compression in Hybrid Memory Chalmers University of Technology and ZeroPoint Technologies
Retention-aware zero-shifting technique for Tiki-Taka algorithm-based analog deep learning accelerator Pohang University of Science and Technology, Korea University, and Kyungpook National University
Improvement of Contact Resistance and 3D Integration of 2D Material Field-Effect Transistors Using Semi-Metallic PtSe2 Contacts Yonsei University, Korea Advanced Institute of Science and Technology (KAIST), Lincoln University College, Korea Institute of Science and Technology (KIST), and Ewha Womans University
Ultra-steep slope cryogenic FETs based on bilayer graphene RWTH Aachen University, Forschungszentrum Julich, National Institute for Materials Science (Japan), and AMO GmbH

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The post Chip Industry Technical Paper Roundup: August 20 appeared first on Semiconductor Engineering.

  • ✇Ars Technica - All content
  • Silicon plus perovskite solar reaches 34 percent efficiencyJohn Timmer
    Enlarge / Some solar panels, along with a diagram of a perovskite's crystal structure. (credit: Subhakitnibhat Kewiko) As the price of silicon panels has continued to come down, we've reached the point where they're a small and shrinking cost of building a solar farm. That means that it might be worth spending more to get a panel that converts more of the incoming sunlight to electricity, since it allows you to get more out of the price paid to get each panel installed. But s
     

Silicon plus perovskite solar reaches 34 percent efficiency

2. Srpen 2024 v 20:36
Solar panels with green foliage behind them, and a diagram of a chemical's structure in the foreground.

Enlarge / Some solar panels, along with a diagram of a perovskite's crystal structure. (credit: Subhakitnibhat Kewiko)

As the price of silicon panels has continued to come down, we've reached the point where they're a small and shrinking cost of building a solar farm. That means that it might be worth spending more to get a panel that converts more of the incoming sunlight to electricity, since it allows you to get more out of the price paid to get each panel installed. But silicon panels are already pushing up against physical limits on efficiency. Which means our best chance for a major boost in panel efficiency may be to combine silicon with an additional photovoltaic material.

Right now, most of the focus is on pairing silicon with a class of materials called perovskites. Perovskite crystals can be layered on top of silicon, creating a panel with two materials that absorb different areas of the spectrum—plus, perovskites can be made from relatively cheap raw materials. Unfortunately, it has been difficult to make perovskites that are both high-efficiency and last for the decades that the silicon portion will.

Lots of labs are attempting to change that, though. And two of them reported some progress this week, including a perovskite/silicon system that achieved 34 percent efficiency.

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  • ✇Semiconductor Engineering
  • Chip Industry Technical Paper Roundup: June 10Linda Christensen
    New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State U
     

Chip Industry Technical Paper Roundup: June 10

10. Červen 2024 v 09:01

New technical papers added to Semiconductor Engineering’s library this week.

Technical Paper Research Organizations
NeRTCAM: CAM-Based CMOS Implementation of Reference Frames for Neuromorphic Processors Carnegie Mellon University
Using Formal Verification to Evaluate Single Event Upsets in a RISC-V Core University of Southampton
High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration Rochester Institute of Technology and Lux Semiconductors
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin Delft University of Technology and NXP Semiconductors
On the quality of commercial chemical vapour deposited hexagonal boron nitride KAUST and the National Institute for Materials Science in Japan
CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications STMicroelectronics and University of Catania
Imperceptible augmentation of living systems with organic bioelectronic fibres University of Cambridge and University of Macau

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The post Chip Industry Technical Paper Roundup: June 10 appeared first on Semiconductor Engineering.

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