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  • ✇Semiconductor Engineering
  • RISC-V Heralds New Era Of CooperationBrian Bailey
    RISC-V is paving the way for open source to become accepted within the hardware community, creating a level of industry collaboration never seen in the past, while revitalizing the connection between academia and industry. The big question is whether this arrangement is just a placeholder while the industry re-learns how to develop processors, or whether this processor architecture is something very different. In either case, there is a clear and pressing need for more flexible processor archite
     

RISC-V Heralds New Era Of Cooperation

30. Květen 2024 v 09:05

RISC-V is paving the way for open source to become accepted within the hardware community, creating a level of industry collaboration never seen in the past, while revitalizing the connection between academia and industry.

The big question is whether this arrangement is just a placeholder while the industry re-learns how to develop processors, or whether this processor architecture is something very different. In either case, there is a clear and pressing need for more flexible processor architectures, and at least for now, RISC-V has filled a void.

“RISC-V was born out of academia and has had strong collaboration within universities from day one,” says Loren Hobbs, vice president of product and business development at Bluespec. “This collaboration continues today, with many of the most popular open-source RISC-V processors having come from universities. Organizations such as OpenHW Group and CHIPS Alliance serve a central and critical role in driving the collaboration, which is bi-directional between the academic community and industry.”

Collaboration of this type has not existed with the industrial community in the past. “We are learning from each other,” says Florian Wohlrab, CEO at OpenHW. “We are learning best practices for verification. At the same time, we are learning what things to avoid. It is growing where people say, ‘Yes, I really get benefit from sharing ideas.'”

The need for processor flexibility exists within industry as well as academia. “There is a need within the industry for diversification on the processor front,” says Neil Hand, director of marketing at Siemens EDA. “In the past, this led to a fragmented set of companies that couldn’t work together. They didn’t see the value of working together. But RISC-V has a cohesive central organization where anyone who wants to get into the processor space can collaborate. They don’t have to expose their secret sauce, but they get to benefit from each other. A rising tide lifts all boats, and that’s really the situation we’re at with RISC-V.”

Longevity
Whether the industry can build upon this success, or whether it fizzles out over time, remains to be seen. But at least for now, RISC-V’s momentum is growing. “We are at the beginning of a revolution in hardware design,” says OpenHW’s Wohlrab. “We saw the same thing for software when Linux came out 20 or so years ago. No one was really thinking about sharing software or collaboratively developing software. There were some small open-source ventures, but working together on a big project took a long time to develop. Now we are all sharing software, all co-working. But for hardware, we’re just at the beginning of this new concept, and a lot of people need to understand that we can do the same for hardware as we did for software.”

Underlying RISC-V’s success is widespread collaboration. “One of the pillars sustaining the success of RISC-V is customization that works with the ecosystem and leverages a well-defined process,” says Sergio Marchese, vice president of application engineering at SmartDV. “RISC-V vendors face the challenge of showing how their processor customization capabilities serve an application and demonstrating the complete process on real hardware. Without strategic partnerships, RISC-V vendors must walk a much more challenging, time-consuming, and resource-intensive road.”

That framework is what makes it unique. “RISC-V has formed this framework for collaboration, and it fixes everything,” says Siemens’ Hand. “Now, when a university has a really cool idea for memory tagging in a processor design, they don’t have to build the compilers, they don’t have to build the reference platform. They already exist. Maybe a compiler optimization startup has this great idea for handling code optimization. They don’t have to build the rest of the ecosystem. When a processor IP company has this great idea, they can become focused within this bigger picture. That’s the unique nature of it. It’s not just a processor specification.”

Historically, one of the problems associated with open-source hardware was quality, because finding bugs in silicon is expensive. OpenHW is an important piece of the puzzle. “Why should everyone reinvent the wheel by themselves?” asks Wohlrab. “Why can’t we get the basic building blocks, some basic chips, take some design from academia, which has reasonably good quality, and build on them, verify them together. We are verifying with different tools, making sure we get a high coverage, and then everyone can go off and use them in their own chips for mass production, for volume shipment.”

This benefits companies both large and small. “There are several processor vendors that have switched to RISC-V,” says Hand. “Synopsys has moved to RISC-V. Andes has moved to RISC-V. MIPS has moved to RISC-V. Why? Because they can leverage the whole ecosystem. The downside of it is commoditization, which as a customer is really beneficial because you can delay choosing a processor till later in the design flow. Your early decision is to use the Arm ecosystem or RISC-V, and then you can work through it. That creates an interesting set of dynamics. You can start to create new opportunities for companies that develop and deliver IP, because you can benchmark them, swap them in and out, and see which one works. On the flip side, it makes it awful from a lock-in perspective once you’re in that socket.”

Fragmentation
Of course, there will be some friction in the system. “In the early days of RISC-V there was nearly a 1:1 balance between contributors and consumers of the technology,” says Geir Eide, director, product management for Siemens EDA. “Today there are thousands of RISC-V consumers, but only a small percentage of those will be contributors. There is a risk that there will be a disconnect between them. If, for instance, a particular market or regional segment is growing at a higher pace than others, or other market segments and regions are more conservative, they tend to stick to established solutions longer. That increases the risk that it could lead to fragmentation.”

Is that likely to impact development long term? “We do not believe that RISC-V will become regionally concentrated, although though there may be regional concentrations of focus within the broad set of implementation choices provided by RISC-V,” says Bluespec’s Hobbs. “A prime example of this is the Barcelona Supercomputer Center, creating a regional focus area for high-performance computing using RISC-V. However, while there may be regional focus areas, this does not mean that the RISC-V standard is, or will become, fragmented. In fact, one of the key tenets of the creation and foundation of RISC-V was preventing fragmentation of the ISA, and it continues to be a key function of RISC-V international.”

China may be a different story. “A lot of companies in China are creating RISC-V cores for internal consumption — for political reasons mostly,” says John Min, vice president of customer service at Arteris. “I think China will go 100% RISC-V for embedded, but it’s a one-way street. They will keep leveraging what the Western companies do and enhance it. China will continue sucking all advancements, such as vectorization, or the special domain-specific acceleration enhancements. They will create their own and make it their own internally, but they will give nothing back.”

Such splits have occurred in the past. “Design languages are the most recent example of that,” says Hand. “There was a regional split, and you had Europe focus on VHDL while America went with Verilog. With RISC-V, there will be that regional split where people will go off and do their things regionally. Europe has focused projects, India has theirs, but they’re still doing it within this framework. It’s this realization that everyone benefits. They’re not doing it to benefit the other people. They’re doing it ultimately to save themselves effort, to save themselves cost, but they realize that by doing it in that framework it is a net benefit to everyone.”

Bi-directionality
An important element is that everyone benefits, and that has to stretch across the academic/commercial boundary. “RISC-V has propelled a new degree of collaboration between academia and commercial organizations,” says Dave Kelf, CEO at Breker. “It’s noticeable that institutions such as Harvey Mudd College in Claremont, California, and ETH in Zurich, Switzerland, to name two, have produced advanced processor designs as a teaching aid, and have collaborated with multiple companies on their verification and design. This has been further advanced by OpenHW Group, which has made these designs accessible to the industry. This bi-directional collaboration benefits the tool providers to further enhance their offerings working on advanced, open devices, while also enabling academia to improve their designs to a commercial quality level. The virtuous circle created is essential if we are to see RISC-V established as a mainstream, industry-wide capability.”

Academia has a lot to offer in hardware advancement. “Researchers in universities are developing innovative new software and hardware to push the limits of RISC-V innovation,” says Dave Miller, head of corporate communications at SiFive. “Many of the RISC-V projects in academia are focused on optimizing performance and energy efficiency for AI workloads, and are open source so the entire ecosystem can benefit. Researchers are also actively contributing to RISC-V working groups to share their knowledge and collaborate with industry participants. These working groups are split evenly between representatives from APAC, Europe, and North America, all working together towards common goals.”

In many cases, industry is willing to fund such projects. “It makes it easy to have research topics that don’t need to boil the ocean,” says Hand. “If you’re a PhD student and you have a great idea, you can go do it. It’s easy for an industry partner to say, ‘I’ll sponsor that. That’s an interesting thing, and I am not required to allocate ridiculous amounts of money into an open-ended project. It’s like I can see the connection of how that research will go into a commercial product later.'”

This feeds back into academia. “The academics have been jumping on board with OpenHW,” says Wohlrab. “By taking their cores and productizing them, they get a chip back that could be shipped in high volume. Then they can do their research on a real commercial product and can see if their idea would fly in real life. They get real numbers and can see real figures for the benefits of a new branch predictor.”

It can also have a long-term benefit for tools. “There are areas where they want to collaborate with us, especially around security,” says Kiran Vittal, executive director for alliances marketing management at Synopsys. “They are building RISC-V based sub-systems using open-source RISC-V processors, and then academia wants to look at not only the AI part, but the security part. There are post-doc students or PhD students looking into using our tools to verify or to implement whatever they’re doing on security.”

That provides an incentive for EDA to offer better tools for use in universities. “Although there has always been collaboration between universities and the industry, where industry provides the universities with access to EDA tools, IP cores, etc., there’s often a bit of a lag,” says Siemens’ Eide. “In many situations (especially outside of the core area of a particular project), universities have access to older versions of the commercial solutions. If you for instance look at a new grad’s resume, where you in the past would see references to old tech, now you see a lot of references to relatively sophisticated use of RISC-V.”

Moving Forward
This collaboration needs to keep pushing forward. “We had an initiative to create a standardized interface for accelerators,” says Wohlrab. “RISC-V International standardized how to add custom instructions in the ISA, but there was no standard for the hardware interface. So we built this. It was a cool discussion. There were people from Silicon Labs, people from NXP, people from Thales, plus several startups. They all came together and asked, ‘How can we make it future proof and put the accelerators inside?'”

The application space for RISC-V is changing. “The big inflection point is Linux and Android,” says Arteris’ Min. “Android already has some support, but when both Android and Linux are really supported, it will change the mobile apps processor game. The number of designs will proliferate. The number of high-end designs will explode. It will take the whole industry to enable that because RISC-V companies are not big enough to create this by themselves. All the RISC-V companies are partners, because we enable this high-end design at the processor levels.”

That would deepen the software community’s engagement. “An embedded software developer needs to understand the underlying hardware if they want to run Linux on a RISC-V processor that uses custom instructions/ accelerators,” says Bluespec’s Hobbs. “To develop complex embedded hardware/software systems, both embedded software developers and embedded hardware developments must possess contextual understanding of the interoperability of hardware and software. The developer must understand how the customized processor is leveraging the custom instructions in hardware for Linux to efficiently manage and execute the accelerated workloads.”

This collaboration could reinvigorate research into EDA, as well. “With AI you can build predictive models,” says Hand. “Could that be used to identify the change effects from making an extension? What does that mean? There’s a cloud of influence — not directly gate-wise, because that immediately explodes — but perhaps based on test suites. ‘I know that something that touches that logic touches this downstream, which touches the rest of the design.’ That’s where AI plays a big role, and it is one of the interesting areas because in verification there are so many unknowns. When AI comes along, any guidance or any visibility that you can give is incredibly powerful. Even if it is not right 100% of the time, that’s okay, as long as it generates false negatives and not false positives.”

There is a great opportunity for EDA companies. “We collaborate with many of the open-source providers, with OpenHW group, with ETH in Zurich,” says Synopsys’ Vittal. “We want to promote our solutions when it comes to any processor design and you need standard tools like synthesis, place and route, simulation. But then there are also other kinds of unique solutions because RISC-V is so customizable, you can build your own custom instructions. You need something specific to verify these custom instructions and that’s why the Imperas golden models are important. We also collaborated with Bluespec to develop a verification methodology to take you through functional verification and debug.”

There are still some wrinkles to be worked out for customizations. “RISC-V gives us predictability,” says Hand. “We can create a compliance test suite, give you a processor optimization package if you’re on the implementation side. We can create analytics and testing solutions because we know what it’s going to look like. But for non-standard processors, it is effectively as a service, because everyone’s processor is a little bit different. The reason you see a lot of focus on the verification, from platform architecture exploration all the way through, is because if you change one little thing, such as an addressing mode, it impacts pretty much 100% of your processor verification. You’ve got to retest the whole processor. Most people aren’t set up like an Arm or an Intel with huge processor verification teams and the infrastructure, and so they need automation to do it for them.”

Conclusion
RISC-V has enabled the industry to create a framework for collaboration, which enables everyone to work together for selfish reasons. It is a symbiotic relationship that continues to build, and it is creating a wider sphere of influence over time.

“It’s unique in the modern era of semiconductor,” says Hand. “You have such a wide degree of collaboration, where you have processor manufacturers, the software industry leaders, EDA companies, all working on a common infrastructure.”

Related Reading
RISC-V Micro-Architectural Verification
Verifying a processor is much more than making sure the instructions work, but the industry is building from a limited knowledge base and few dedicated tools.
RISC-V Wants All Your Cores
It is not enough to want to dominate the world of CPUs. RISC-V has every core in its sights, and it’s starting to take steps to get there.

The post RISC-V Heralds New Era Of Cooperation appeared first on Semiconductor Engineering.

K-Fault Resistant Partitioning To Assess Redundancy-Based HW Countermeasures To Fault Injections

A technical paper titled “Fault-Resistant Partitioning of Secure CPUs for System Co-Verification against Faults” was published by researchers at Université Paris-Saclay, Graz University of Technology, lowRISC, University Grenoble Alpes, Thales, and Sorbonne University.

Abstract:

“To assess the robustness of CPU-based systems against fault injection attacks, it is necessary to analyze the consequences of the fault propagation resulting from the intricate interaction between the software and the processor. However, current formal methodologies that combine both hardware and software aspects experience scalability issues, primarily due to the use of bounded verification techniques. This work formalizes the notion of k-fault resistant partitioning as an inductive solution to this fault propagation problem when assessing redundancy-based hardware countermeasures to fault injections. Proven security guarantees can then reduce the remaining hardware attack surface to consider in a combined analysis with the software, enabling a full co-verification methodology. As a result, we formally verify the robustness of the hardware lockstep countermeasure of the OpenTitan secure element to single bit-flip injections. Besides that, we demonstrate that previously intractable problems, such as analyzing the robustness of OpenTitan running a secure boot process, can now be solved by a co-verification methodology that leverages a k-fault resistant partitioning. We also report a potential exploitation of the register file vulnerability in two other software use cases. Finally, we provide a security fix for the register file, verify its robustness, and integrate it into the OpenTitan project.”

Find the technical paper here. Published 2024 (preprint).

Tollec, Simon, Vedad Hadžić, Pascal Nasahl, Mihail Asavoae, Roderick Bloem, Damien Couroussé, Karine Heydemann, Mathieu Jan, and Stefan Mangard. “Fault-Resistant Partitioning of Secure CPUs for System Co-Verification against Faults.” Cryptology ePrint Archive (2024).

Related Reading
RISC-V Micro-Architectural Verification
Verifying a processor is much more than making sure the instructions work, but the industry is building from a limited knowledge base and few dedicated tools.
New Concepts Required For Security Verification
Why it’s so difficult to ensure that hardware works correctly and is capable of detecting vulnerabilities that may show up in the field.

The post K-Fault Resistant Partitioning To Assess Redundancy-Based HW Countermeasures To Fault Injections appeared first on Semiconductor Engineering.

  • ✇Semiconductor Engineering
  • Chip Industry Week In ReviewThe SE Staff
    By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan’s Powerchip. The second fab will be a joint investment between CG Power, Japan’s Renesas Electronics, and Thailand’s Stars Microelectronics. Tata will run the packaging facility, as well. India expects these efforts will add 20,000 advanced technology jobs and 6
     

Chip Industry Week In Review

1. Březen 2024 v 09:01

By Adam Kovac, Karen Heyman, and Liz Allan.

India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan’s Powerchip. The second fab will be a joint investment between CG Power, Japan’s Renesas Electronics, and Thailand’s Stars Microelectronics. Tata will run the packaging facility, as well. India expects these efforts will add 20,000 advanced technology jobs and 60,000 indirect jobs, according to the Times of India. The country has been talking about building a fab for at least the past couple of decades, but funding never materialized.

The U.S. Department of Commerce (DoC) issued a CHIPS Act-based Notice of Funding Opportunity for R&D to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. The U.S. Secretary of Commerce said the government is prioritizing CHIPS Act funding for projects that will be operational by 2030 and anticipates America will produce 20% of the world’s leading-edge logic chips by the end of the decade.

The top three foundries plan to implement backside power delivery as soon as the 2nm node, setting the stage for faster and more efficient switching in chips, reduced routing congestion, and lower noise across multiple metal layers. But this novel approach to optimizing logic performance depends on advances in lithography, etching, polishing, and bonding processes.

Intel spun out Altera as a standalone FPGA company, the culmination of a rebranding and reorganization of its former Programmable Solutions Group. The move follows Intel’s decision to keep Intel Foundry at arm’s length, with a clean line between the foundry and the company’s processor business.

Multiple new hardware micro-architecture vulnerabilities were published in the latest Common Weakness Enumeration release this week, all related to transient execution (CWE 1420-1423).

The U.S. Office of the National Cyber Director (ONCD) published a technical report calling for the adoption of memory safe programming languages, aiming to reduce the attack surface in cyberspace and anticipate systemic security risk with better diagnostics. The DoC also is seeking information ahead of an inquiry into Chinese-made connected vehicles “to understand the extent of the technology in these cars that can capture wide swaths of data or remotely disable or manipulate connected vehicles.”

Quick links to more news:

Design and Power
Manufacturing and Test
Automotive
Security
Pervasive Computing and AI
Events

Design and Power

Micron began mass production of a new high-bandwidth chip for AI. The company said the HBM3E will be a key component in NVIDIA’s H2000 Tensor Core GPUs, set to begin shipping in the second quarter of 2024. HBM is a key component of 2.5D advanced packages.

Samsung developed a 36GB HBM3E 12H DRAM, saying it sets new records for bandwidth. The company achieved this by using advanced thermal compression non-conductive film, which allowed it to cram 12 layers into the area normally taken up by 8. This is a novel way of increasing DRAM density.

Keysight introduced QuantumPro, a design and simulation tool, plus workflow, for quantum computers. It combines five functionalities into the Advanced Design System (ADS) 2024 platform. Keysight also introduced its AI Data Center Test Platform, which includes pre-packaged benchmarking apps and dataset analysis tools.

Synopsys announced a 1.6T Ethernet IP solution, including 1.6T MAC and PCS Ethernet controllers, 224G Ethernet PHY IP, and verification IP.

Tenstorrent, Japan’s Leading-Edge Semiconductor Technology Center (LSTC) , and Rapidus are co-designing AI chips. LSTC will use Tenstorrent’s RISC-V and Chiplet IP for its forthcoming edge 2nm AI accelerator.

This week’s Systems and Design newsletter features these top stories:

  • 2.5D Integration: Big Chip Or Small PCB: Defining whether a 5D device is a PCB shrunk to fit into a package or a chip that extends beyond the limits of a single die can have significant design consequences.
  • Commercial Chiplets: Challenges of establishing a commercial chiplet.
  • Accellera Preps New Standard For Clock-Domain Crossing: New standard aims to streamline the clock-domain crossing flow.
  • Thinking Big: From Chips To Systems: Aart de Geus discusses the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices.
  • Integration challenges for RISC-V: Modifying the source code allows for democratization of design, but it adds some hurdles for design teams (video).

Demand for high-end AI servers is driven by four American companies, which will account for 60% of global demand in 2024, according to Trendforce. NVIDIA is projected to continue leading the market, with AMD closing the gap due its lower cost model.

The EU consortium PREVAIL is accepting design proposals as it seeks to develop next-gen edge-AI technologies. Anchors include CEA-Leti, Fraunhofer-Gesellschaft, imec, and VTT, which will use their 300mm fabrication, design, and test facilities to validate prototypes.

Siemens joined an initiative to expand educational opportunities in the semiconductor space around the world. The Semiconductor Education Alliance was launched by Arm in 2023 and focuses on helping teach skills in IC design and EDA.

Q-CTRL announced partnerships with six firms that it says will expand access to its performance-management software and quantum technologies. Wolfram, Aqarios, and qBraid will integrate Q-CTRL’s Fire Opal technology into their products, while Qblox, Keysight, and Quantware will utilize Q-CTRL’s Boulder Opal hardware system.

NTT, Red Hat, NVIDIA, and Fujitsu teamed up to provide data pipeline acceleration and contain orchestration technologies targeted at real-time AI analysis of massive data sets at the edge.

Manufacturing and Test

The U.S. Department of Energy (DOE)’s Office of Electricity launched the American-Made Silicon Carbide (SiC)  Packaging Prize. This $2.25 million contest invites competitors to propose, design, build, and test state-of-the-art SiC semiconductor packaging prototypes.

Applied Materials introduced products and solutions for patterning issues in the “angstrom era,” including line edge roughness, tip-to-tip spacing limitations, bridge defects, and edge placement errors.

imec reported progress made in EUV processes, masks and metrology in preparation for high-NA EUV. It also identified advanced node lithography and etch related processes that contribute the most to direct emissions of CO2, along with proposed solutions.

proteanTecs will participate in the Arm Total Design ecosystem, which now includes more than 20 companies united around a charter to accelerate and simplify the development of custom SoCs based on Arm Neoverse compute subsystems.

NikkeiAsia took an in-depth look at Japan’s semiconductor ecosystem and concluded it is ripe for revival with investments from TSMC, Samsung, and Micron, among others. TrendForce came to a similar conclusion, pointing to the fast pace of Japan’s resurgence, including the opening of TSMC’s fab.

FormFactor closed its sale of its Suzhou and Shanghai companies to Grand Junction Semiconductor for $25M in cash.

The eBeam Initiative celebrated its 15th anniversary and welcomed a new member, FUJIFILM. The group also uncorked its fourth survey of its members technology using deep learning in the photomask-to-wafer manufacturing flow.

Automotive

Apple shuttered its electric car project after 10 years of development. The chaotic effort cost the company billions of dollars, according to The New York Times.

Infineon released new automotive programmable SoCs with fifth-gen human machine interface (HMI) technology, offering improved sensitivity in three packages. The MCU offers up to 84 GPIOs and 384 KB of flash memory. The company also released automotive and industrial-grade 750V G1 discrete SiC MOSFETs aimed at applications such as EV charging, onboard chargers, DC-DC converters, energy, solid state circuit breakers, and data centers.

Cadence expanded its Tensilica IP portfolio to boost computation for automotive sensor fusion applications. Vision, radar, lidar, and AI processing are combined in a single DSP for multi-modal, sensor-based system designs.

Ansys will continue translating fast computing into fast cars, as the company’s partnership with Oracle Red Bull Racing was renewed. The Formula 1 team uses Ansys technology to improve car aerodynamics and ensure the safety of its vehicles.

Lazer Sport adopted Siemens’ Xcelerator portfolio to connect 3D design with 3D printing for prototyping and digital simulation of its sustainable KinetiCore cycling helmet.

The chair of the U.S. Federal Communications Commission (FCC) suggested automakers that sell internet-connected cars should be subject to a telecommunications law aiming to protect domestic violence survivors, reports CNBC. This is due to emerging cases of stalking through vehicle location tracking technology and remote control of functions like locking doors or honking the horn.

BYD‘s CEO said the company does not plan to enter the U.S. market because it is complicated and electrification has slowed down, reports Yahoo Finance. Meanwhile, the first shipment of BYD vehicles arrived in Europe, according to DW News.

Ascent Solar Technologiessolar module products will fly on NASA’s upcoming Lightweight Integrated Solar Array and AnTenna (LISA-T) mission.

Security

Researchers at Texas A&M University and the University of Delaware proposed the first red-team attack on graph neural network (GNN)-based techniques in hardware security.

A panel of four experts discuss mounting concerns over quantum security, auto architectures, and supply chain resiliency.

Synopsys released its ninth annual Open Source Security and Risk Analysis report, finding that 74% of code bases contained high-risk open-source vulnerabilities, up 54% since last year.

President Biden issued an executive order to prevent the large-scale transfer of Americans’ personal data to countries of concern. Types of data include genomic, biometric, personal health, geolocation, financial, and other personally identifiable information, which bad actors can use to track and scam Americans.

The National Institute of Standards and Technology (NIST) released Cybersecurity Framework (CSF) 2.0 to provide a comprehensive view for managing cybersecurity risk.

The EU Agency for Cybersecurity (ENISA) published a study on best practices for cyber crisis management, saying the geopolitical situation continues to impact the cyber threat landscape and planning for threats and incidents is vital for crisis management.

The U.S. Department of Energy (DOE) announced $45 million to protect the energy sector from cyberattacks.

The National Security Agency (NSA), the Federal Bureau of Investigation (FBI), and others published an advisory on Russian cyber actors using compromised routers.  Also the Cybersecurity and Infrastructure Security Agency (CISA), the UK National Cyber Security Centre (NCSC), and partners advised of tactics used by Russian Foreign Intelligence Service cyber actors to gain initial access into a cloud environment.

CISA, the FBI, and the Department of Health and Human Services (HHS) updated an advisory concerning the ALPHV Blackcat ransomware as a service (RaaS), which primarily targets the healthcare sector.

CISA also published a guide to support university cybersecurity clinics and issued other alerts.

Pervasive Computing and AI

Renesas expanded its RZ family of MPUs with a single-chip AI accelerator that offers 10 TOPS per watt power efficiency and delivers AI inference performance of up to 80 TOPS without a cooling fan. The chip is aimed at next-gen robotics with vision AI and real-time control.

Infineon launched dual-phase power modules to help data centers meet the power demands of AI GPU platforms. The company also released a family of solid-state isolators to deliver faster switching with up to 70% lower power dissipation.

Fig. 1: Infineon’s dual phase power modules: Source: Infineon

Amber Semiconductor announced a reference design for brushless motor applications using its AC to DC conversion semiconductor system to power ST‘s STM32 MCUs.

Micron released its universal flash storage (UFS) 4.0 package at just 9×13 mm, built on 232-layer 3D NAND and offering up to 1 terabyte capacity to enable next-gen phone designs and larger batteries.

LG and Meta teamed up to develop extended reality (XR) products, content, services, and platforms within the virtual space.

Microsoft and Mistral AI partnered to accelerate AI innovation and to develop and deploy Mistral’s next-gen large language models (LLMs).

Microsoft’s vice chair and president announced the company’s AI access principles, governing how it will operate AI datacenter infrastructure and other AI assets around the world.

Singtel and VMware partnered to enable enterprises to manage their connectivity and cloud infrastructure through the Singtel Paragon platform for 5G and edge cloud.

Keysight was selected as the Test Partner for the Deutsche Telekom Satellite NB-IoT Early Adopter Program, providing an end-to-end NB-IoT NTN testbed that allows designers and developers to validate reference designs for solutions using 3GPP Release 17 (Rel-17) NTN standards.

Global server shipments are predicted to increase by 2.05% in 2024, with AI servers accounting for about 12%, reports TrendForce. Also, the smartphone camera lens market is expected to rebound in 2024 with 3.8% growth driven by AI-smartphones, to reach about 4.22 billion units, reports TrendForce.

Yole released a smartphone camera comparison report with a focus on iPhone evolution and analysis of the structure, design, and teardown of each camera module, along with the CIS dimensions, technology node, and manufacturing processes.

Counterpoint released a number of 2023 reports on smartphone shipments by country and operator migrations to 5G.

Events

Find upcoming chip industry events here, including:

Event Date Location
International Symposium on FPGAs Mar 3 – 5 Monterey, CA
DVCON: Design & Verification Mar 4 – 7 San Jose, CA
ISES Japan 2024: International Semiconductor Executive Summit Mar 5 – 6 Tokyo, Japan
ISS Industry Strategy Symposium Europe Mar 6 – 8 Vienna, Austria
GSA International Semiconductor Conference Mar 13 – 14 London
Device Packaging Conference (DPC 2024) Mar 18 – 21 Fountain Hills, AZ
GOMACTech Mar 18 – 21 Charleston, South Carolina
SNUG Silicon Valley Mar 20 – 21 Santa Clara, CA
All Upcoming Events

Upcoming webinars are here, including topics such as digital twins, power challenges in data centers, and designing for 112G interface compliance.

Further Reading and Newsletters

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

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