JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it’s not possible to choose the best chiplet for a particular application or workload. The guidelines are a prerequisite for a multi-vendor chiplet marketplace.

AMD, Broadcom, Cisco, Google, HPE, Intel, Meta, and Microsoft proposed a new high-speed, low-latency interconnect specification, Ultra Accelerator Link (UALink), between accelerators and switches in AI computing pods. The 1.0 specification will enable the connection of up to 1,024 accelerators within a pod and allow for direct loads and stores between the memory attached to accelerators.

Arm debuted a range of new CPUs, including the Cortex-X925 for on-device generative AI, and the Cortex-A725 with improved efficiency for AI and mobile gaming. It also announced the Immortalis-G925 GPU for flagship smartphones, and the Mali-G725/625 GPUs for consumer devices. Additionally, Arm announced Compute Subsystems (CSS) for Client to provide foundational computing elements for AI smartphone and PC SoCs, and it introduced KleidiAI, a set of compute kernels for developers of AI frameworks. The Armv9-A architecture also added support for the Scalable Matrix Extension to accelerate AI workloads.

TSMC said its 2nm process is on target to begin mass production in 2025. Meanwhile, Samsung is expected to release its 1nm plan next month, targeting mass production for 2026 — a year ahead of schedule, reports Business Korea.

CHIPs for America and NATCAST released a 2024 roadmap for the U.S. National Semiconductor Technology Center (NSTC), identifying priorities for facilities, research, workforce development, and membership.

China is investing CNY 344 billion (~$47.5 billion) into the third phase of its National Integrated Circuit Industry Investment Fund, also known as the Big Fund, to support its semiconductor sector and supply chain, according to numerous reports.

Malaysia plans to invest $5.3 billion in seed capital and support for semiconductor manufacturing in an effort to attract more than $100 billion in foreign investments, reports Reuters. Prime Minister Anwar Ibrahim announced the effort to create at least 10 companies focused on IC design, advanced packaging, and equipment manufacturing.

imec demonstrated a die-to-wafer hybrid bonding flow for Cu-Cu and SiCN-SiCN at pitches down to 2µm at the IEEE’s ECTC conference. This breakthrough could enable die and wafer-level optical interconnects.

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve.

Quick links to more news:

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In-Depth

Semiconductor Engineering published its Systems & Design newsletter featuring these top stories:

• RISC-V Heralds New Era Of Cooperation
• AI For Data Management
• Trouble Ahead For IC Verification

Global

STMicroelectronics is building a fully integrated SiC facility in Catania, Italy.  The high-volume 200mm facility is projected to cost over $5 billion.

Siliconware Precision Industries Co. Ltd.(SPIL) broke ground on an RM 6 billion (~$1.3 billion) advanced packaging and testing facility in Malaysia. Also, Google will invest $2 billion in Malaysia for its first data center, and a Google Cloud hub to meet growing demand for cloud services and AI literacy programs, reports AP.

In an SEC filing, Applied Materials received additional subpoenas from the U.S. Department of Commerce’s (DoC) Bureau of Industry and Security related to shipments of advanced semiconductor equipment to China. This comes on the heels of similar subpoenas issued last year.

A Chinese contractor working for SK hynix was arrested in South Korea and is being charged with funneling more than 3,000 copies of a paper on solving process failure issues to Huawei, reports South Korea’s Union News.

VSORA, CEA-Grenoble, and Valeo were awarded $7 million from the French government to build low-latency, low-power AI inference co-processors for autonomous driving and other applications.

In the U.S., the National Highway Traffic Safety Administration (NHTSA) is investigating unexpected driving behaviors of vehicles equipped with Waymo‘s 5th Generation automated driving system (ADS), with details of nine new incidents on top of the first 22.

Product News

ASE introduced powerSIP, a power delivery platform designed to reduce signal and transmission loss while addressing current density challenges.

Infineon announced a roadmap for energy-efficient power supply units based on Si, SiC, and GaN to address the energy needs of AI data centers, featuring new 8 kW and 12 kW PSUs, in addition to the 3 kW and 3.3 kW units available today. The company also released its CoolSiC MOSFET 400 V family, specially developed for use in the AC/DC stage of AI servers, complementing the PSU roadmap.

Fig. 1: Infineon’s 8kW PSU. Source: Infineon

Infineon also introduced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN TM devices, enabling customers to use GaN in voltage classes from 40 V to 700 V. The devices are built using Infineon’s 8-inch foundry processes.

Ansys launched Ansys Access on Microsoft Azure to provide pre-configured simulation products optimized for HPC on Azure infrastructure.

Foxconn Industrial Internet used Keysight Technology’s Open RAN Studio solution to certify an outdoor Open Radio Unit (O-RU).

Andes Technology announced an SoC and development board for the development and porting of large RISC-V applications.

MediaTek uncorked a pair of mobile chipsets built on a 4nm process that use an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores.

The NVIDIA H200 Blackwell platform is expected to begin shipping in Q3 of 2024 and will be available to data centers by Q4, according to TrendForce.

A room-temperature direct fusion hybrid bonding system from Be Semiconductor has shipped to the NHanced advanced packaging facility in North Carolina. The new system offers faster throughput for copper interconnects with submicron pad sizes, greater accuracy and reduced warpage.

Markets and Money

Frore Systems raised $80 million for its solid-state active cooling module, which removes heat from the top of a chip without fans. The device in systems ranging from notebooks and network edge gateways to data centers.

Axus Technology received $12.5 million in capital equity funding to make its chemical mechanical planarization (CMP) equipment for semiconductor wafer polishing, thinning, and cleaning, including of silicon carbide (SiC) wafers.

Elon Musk’s xAI announced a series B funding round of $6 billion.

Micron was ordered to pay $445 million in damages to Netlist for patent infringement of the company’s DDR4 memory module technology between 2021 and 2024.

Global revenue from AI semiconductors is predicted to total $71 billion in 2024, up 33% from 2023, according to Gartner. In 2025, it is expected to jump to $91.9 billion. The value of AI accelerators used in servers is expected to total $21 billion in 2024 and reach $33 billion by 2028.

NAND flash revenue was $14.71 billion in Q1 2024, an increase of 28.1%, according to TrendForce.

The optical transceiver market dipped from $11 billion in 2022 to $10.9 billion in 2023, but it is predicted to reach $22.4 billion by 2029, driven by AI, 800G applications, and the transition to 200G/lane ecosystem technologies, reports Yole.

Yole also found that ultra-wideband technical choices and packaging types used by NXP, Apple, and Qorvo vary considerably, ranging from 7nm to 90nm, with both CMOS and finFET transistors.

The global market share of GenAI-capable smartphones increased to 6% in Q1 2024 from 1.3% in the previous quarter, reports Counterpoint. The premium segment accounted for over 70% of sales with Samsung on top and contributing 58%. Meanwhile, global foldable smartphone shipments were up 49% YoY in Q1 2024, led by Huawei, HONOR, and Motorola.

Security

The National Science Foundation awarded Worcester Polytechnic Institute researcher Shahin Tajik almost $0.6 million to develop new technologies to address hardware security vulnerabilities.

The Hyperform consortium was formed to develop European sovereignty in post-quantum cryptography, funded by the French government and EU credits. Members include IDEMIA Secure Transactions, CEA Leti, and the French cybersecurity agency (ANSSI).

In security research:

• University of California Davis and University of Arizona researchers proposed a framework leveraging generative pre-trained transformer (GPT) models to automate the obfuscation process.
• Columbia University and Intel researchers presented a secure digital low dropout regulator that integrates an attack detector and a detection-driven protection scheme to mitigate correlation power analysis.
• Pohang University of Science and Technology (POSTECH) researchers analyzed threshold switch devices and their performance in hardware security.

The U.S. Defense Advanced Research Projects Agency (DARPA) seeks proposals for its AI Quantified program to develop technology to help deploy generative AI safely and effectively across the Department of Defense (DoD) and society.

Vanderbilt University and Oak Ridge National Laboratory (ORNL) partnered to develop dependable AI for national security applications.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Research and Training

New York continues to amp up their semiconductor offerings. NY CREATES and Raytheon unveiled a semiconductor workforce training program. And Syracuse  University is hosting a free virtual course focused on the semiconductor industry this summer.

In research news:

• A team of researchers at MIT and other universities found that extreme temperatures up to 500°C did not significantly degrade GaN materials or contacts.
• University of Cambridge researchers developed adaptive and eco-friendly sensors that can be directly and imperceptibly printed onto biological surfaces, such as a finger or flower petal.
• Researchers at Rice University and Hanyang University developed an elastic material that moves like skin and can adjust its dielectric frequency to stabilize RF communications and counter disruptive frequency shifts that interfere with electronics when a substrate is twisted or stretched, with potential for stretchable wearable electronic devices.

The National Science Foundation (NSF) awarded $36 million to three projects chosen for their potential to revolutionize computing. The University of Texas at Austin-led project aims to create a next-gen open-source intelligent and adaptive OS. The Harvard University-led project targets sustainable computing. The University of Massachusetts Amherst-led project will develop computational decarbonization.

Quantum

Singapore will invest close to S$300 million (~$222 million) into its National Quantum Strategy to support the development and deployment of quantum technologies, including an initiative to design and build a quantum processor within the country.

Several quantum partnerships were announced:

• Riverlane and Alice & Bob will integrate Riverlane’s quantum error correction stack within Alice & Bob’s larger quantum computing system based on cat qubit technology.
• New York University and the University of Copenhagen will collaborate to explore the viability of hybrid superconductor-semiconductor quantum materials for the production of quantum chips and integration with CMOS processes.
• NXP, eleQtron, and ParityQC showed off a full-stack, ion-trap based quantum computer demonstrator for Germany’s DLR Quantum Computing Initiative.
• Photonic says it demonstrated distributed entanglement between quantum modules using optically-linked silicon spin qubits with a native telecom networking interface as part of a quantum internet effort with Microsoft.
• Classiq and HPE say they developed a rapid method for solving large-scale combinatorial optimization problems by combining quantum and classical HPC approaches.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here, including integrated SLM analytics solution, prototyping and validation of perception sensor systems, and improving PCB designs for performance and reliability.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used.

Intel is in advanced talks with Apollo Global Management for the equity firm to provide more than $11 billion to build a fab in Ireland, reported the Wall Street Journal. Also, Intel’s Foundry Services appointed Kevin O’Buckley as the senior vice president and general manager.

Polar is slated to receive up to $120 million in CHIPS Act funding to establish an independent American foundry in Minnesota. The company expects to invest about $525 million in the expansion of the facility over the next two years, with a $75 million investment from the State of Minnesota.

Arm plans to develop AI chips for launch next year, reports Nikkei Asia.

South Korea is planning a support package worth more than 10 trillion won ($7.3 billion) aimed at chip materials, equipment makers, and fabless companies throughout the semiconductor supply chain, according to Reuters.

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Global

Edwards opened a new facility in Asan City, South Korea. The 15,000m² factory provides a key production site for abatement systems, and integrated vacuum and abatement systems for semiconductor manufacturing.

France’s courtship with mega-tech is paying off.  Microsoft is investing more than US $4 billion to expand its cloud computing and AI infrastructure, including bringing up to 25,000 advanced GPUs to the country by the end of 2025. The “Choose France” campaign also snagged US $1.3 billion from Amazon for cloud infrastructure expansion, genAI and more.

Toyota, Nissan, and Honda are teaming up on AI and chips for next-gen cars with support from Japan’s Ministry of Economy, Trade and Industry, (METI), reports Nikkei Asia.

Meanwhile, IBM and Honda are collaborating on long-term R&D of next-gen technologies for software-defined vehicles (SDV), including chiplets, brain-inspired computing, and hardware-software co-optimization.

Siemens and Foxconn plan to collaborate on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV).

TSMC confirmed a Q424 construction start date for its first European plant in Dresden, Germany.

Amazon Web Services (AWS) plans to invest €7.8 billion (~$8.4B) in the AWS European Sovereign Cloud in Germany through 2040. The system is designed to serve public sector organizations and customers in highly regulated industries.

In-Depth

Semiconductor Engineering published its Low Power-High Performance newsletter this week, featuring these stories:

• • Will Domain-Specific ICs Become Ubiquitous?
  • Running More Efficient AI/ML Code With Neuromorphic Engines
  • Power/Performance Costs In Chip Security

And this week’s Test, Measurement & Analytics newsletter featured these stories:

• Using Predictive Maintenance To Boost IC Manufacturing Efficiency
• The Future Of Fault Coverage In Chips
• Doing More At Functional Test

Markets and Money

The U.S. National Institute of Standards and Technology (NIST) awarded more than $1.2 million to 12 businesses in 8 states under the Small Business Innovation Research (SBIR) Program to fund R&D of products relating to cybersecurity, quantum computing, health care, semiconductor manufacturing, and other critical areas.

Engineering services and consulting company Infosys completed the acquisition of InSemi Technology, a provider of semiconductor design and embedded software development services.

The quantum market, which includes quantum networking and sensors alongside computing, is predicted to grow from $838 million in 2024 to $1.8 billion in 2029, reports Yole.

Shipments of OLED monitors reached about 200,000 units in Q1 2024, a year over year growth of 121%, reports TrendForce.

Global EV sales grew 18% in Q1 2024 with plug-in hybrid electric vehicles (PHEV) sales seeing 46% YoY growth and battery electric vehicle (BEV) sales growing just 7%, according to Counterpoint. China leads global EV sales with 28% YoY growth, while the US grew just 2%. Tesla saw a 9% YoY drop, but topped BEV sales with a 19% market share. BYD grew 13% YoY and exported about 100,000 EVs with 152% YoY growth, mainly in Southeast Asia.

DeepX raised $80.5 million in Series C funding for its on-device NPU IP and AI SoCs tailored for applications including physical security, robotics, and mobility.

MetisX raised $44 million in Series A funding for its memory solutions built on Compute Express Link (CXL) for accelerating large-scale data processing applications.

Security

While security experts have been warning of a growing threat in electronics for decades, there have been several recent fundamental changes that elevate the risk.

Synopsys and the Ponemon Institute released a report showing 54% of surveyed organizations suffered a software supply chain attack in the past year and 20% were not effective in their response. And 52% said their development teams use AI tools to generate code, but only 32% have processes to evaluate it for license, security, and quality risks.

Researchers at Ruhr University Bochum and TU Darmstadt presented a solution for the automated generation of fault-resistant circuits (AGEFA) and assessed the security of examples generated by AGEFA against side-channel analysis and fault injection.

TXOne reported on operational technology security and the most effective method for preventing production interruptions caused by cyber-attacks.

CrowdStrike and NVIDIA are collaborating to accelerate the use of analytics and AI in cybersecurity to help security teams combat modern cyberattacks, including AI-powered threats.

The National Institute of Standards and Technology (NIST) finalized its guidelines for protecting sensitive data, known as controlled unclassified information, aimed at organizations that do business with the federal government.

The Defense Advanced Research Projects Agency (DARPA) awarded BAE Systems a $12 million contract to solve thermal challenges limiting electronic warfare systems, particularly in GaN transistors.

Sigma Defense won a $4.7 million contract from the U.S. Army for an AI-powered virtual training environment, partnering with Brightline Interactive on a system that uses spatial computing and augmented intelligence workflows.

SkyWater’s advanced packaging operation in Florida has been accredited as a Category 1A Trusted Supplier by the Defense Microelectronics Activity (DMEA) of the U.S. Department of Defense (DoD).

Videos of two CWE-focused sessions from CVE/FIRST VulnCon 2024 were made available on the CWE YouTube Channel.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Supercomputing

Supercomputers are battling for top dog.

The Frontier supercomputer at Oak Ridge National Laboratory (ORNL) retained the top spot on the Top500 list of the world’s fastest systems with an HPL score of 1.206 EFlop/s. The as-yet incomplete Aurora system at Argonne took second place, becoming the world’s second exascale system at 1.012 EFlop/s. The Green500 list, which tracks energy efficiency of compute, saw three new entrants take the top places.

Cerebras Systems, Sandia National Laboratory, Lawrence Livermore National Laboratory, and Los Alamos National Laboratory used Cerebras’ second generation Wafer Scale Engine to perform atomic scale molecular dynamics simulations at the millisecond scale, which they claim is 179X faster than the Frontier supercomputer.

UT Austin‘s Stampede3 Supercomputer is now in full production, serving the open science community through 2029.

Education and Training

SEMI announced the SEMI University Semiconductor Certification Programs to help alleviate the workforce skills gap. Its first two online courses are designed for new talent seeking careers in the industry, and experienced workers looking to keep their skills current.  Also, SEMI and other partners launched a European Chip Skills Academy Summer School in Italy.

Siemens created an industry credential program for engineering students that supplements a formal degree by validating industry knowledge and skills. Nonprofit agency ABET will provide accreditation. The first two courses are live at the University of Colorado Boulder (CU Boulder) and a series is planned with Pennsylvania State University (Penn State).

Syracuse University launched a $20 million Center for Advanced Semiconductor Manufacturing, with co-funding from Onondaga County.

Starting young is a good thing.  An Arizona school district, along with the University Of Arizona,  is creating a semiconductor program for high schoolers.

Product News

Siemens and Sony partnered to enable immersive engineering via a spatial content creation system, NX Immersive Designer, which includes Sony’s XR head-mounted display. The integration of hardware and software gives designers and engineers natural ways to interact with a digital twin. Siemens also extended its Xcelerator as a Service portfolio with solutions for product engineering and lifecycle management, cloud-based high-performance simulation, and manufacturing operations management. It will be available on Microsoft Azure, as well.

Advantest announced the newest addition to its portfolio of power supplies for the V93000 EXA Scale SoC test platform. The DC Scale XHC32 power supply offers 32 channels with single-instrument total current of up to 640A.

Fig. 1: Advantest’s DC Scale XHC32. Source: Advantest

Infineon released its XENSIV TLE49SR angle sensors, which can withstand stray magnetic fields of up to 8 mT, ideal for applications of safety-critical automotive chassis systems.

Google debuted its sixth generation Cloud TPU, 4.7X faster and 67% more energy-efficient than the previous generation, with double the high-bandwidth memory.

X-Silicon uncorked a RISC-V vector CPU, coupled with a Vulkan-enabled GPU ISA and AI/ML acceleration in a single processor core, aimed at embedded and IoT applications.

IBM expanded its Qiskit quantum software stack, including the stable release of its SDK for building, optimizing, and visualizing quantum circuits.

Northeastern University announced the general availability of testing and integration solutions for Open RAN through the Open6G Open Testing and Integration Center (Open 6G OTIC).

Research

The University of Glasgow received £3 million (~$3.8M) from the Engineering and Physical Sciences Research Council (EPSRC)’s Strategic Equipment Grant scheme to help establish “Analogue,” an Automated Nano Analysing, Characterisation and Additive Packaging Suite to research silicon chip integration and packaging.

EPFL researchers developed scalable photonic ICs, based on lithium tantalate.

DISCO developed a way to increase the diameter of diamond wafers that uses the KABRA process, a laser ingot slicing method.

CEA-Leti developed two complementary approaches for high performance photon detectors — a mercury cadmium telluride-based avalanche photodetector and a superconducting single photon detector.

Toshiba demonstrated storage capacities of over 30TB with two next-gen large capacity recording technologies for hard disk drives (HDDs): Heat Assisted Magnetic Recording (HAMR) and Microwave Assisted Magnetic Recording (MAMR).

Caltech neuroscientists reported that their brain-machine interface (BMI) worked successfully in a second human patient, following 2022’s first instance, proving the device is not dependent on one particular brain or one location in a brain.

Linköping University researchers developed a cheap, sustainable battery made from zinc and lignin, while ORNL researchers developed carbon-capture batteries.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at the base of the HBM stack.

Intel assembled the industry’s first high-NA EUV lithography system. “Compared to 0.33NA EUV, high-NA EUV (or 0.55NA EUV) can deliver higher imaging contrast for similar features, which enables less light per exposure, thereby reducing the time required to print each layer and increasing wafer output,” Intel said.

Fig. 1: Bigger iron — Intel’s brand new high-NA EUV machinery. Source: Intel

Samsung is slated to receive $6.4 billion in CHIPS ACT funding from the U.S. Department of Commerce (DoC) as part of a $40 billion expansion of its Austin, Texas, manufacturing facility, along with an R&D fab, a pair of leading-edge logic fabs, and an advanced packaging plant in nearby Taylor, Texas.

Micron and the U.S. government next week will announce $6.1 billion in CHIPS Act funding for the development of advanced memory chips in New York and Idaho, according to AP News.

Cadence unveiled its Palladium Z3 Emulation and Protium X3 FPGA Prototyping systems, targeted at multi-billion-gate designs with 2X increase in capacity and a 1.5X performance increase compared to previous-generation systems. Cadence also teamed up with MemVerge to enable seamless support for AWS Spot instances for long-running high-memory EDA jobs, and extended its hybrid cloud environment solutions through a collaboration with NetApp.

Fig. 2: At CadenceLive Silicon Valley, NVIDIA CEO Jensen Huang (r.) discussed accelerated computing and generative AI with Cadence CEO Anirudh Devgan. Source: Semiconductor Engineering

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Global

After Taiwan’s recent 7.2 magnitude earthquake, TSMC reached more the 70% tool recovery in its fabs within the first 10 hours and full recovery by the end of the third day, according to this week’s earnings call. Some wafers in process were scrapped but the company expects the lost production to be recovered in the second quarter.  Also in the call, TSMC said they expect their “customers to share some of the higher cost” of the overseas fabs and higher electricity costs.

Advantest‘s regional headquarters in Taiwan donated $2.2 million New Taiwan dollars ($680,000 US) for aid to victims and reconstruction efforts related to the Taiwan earthquake that struck on April 3.

Japan’s exports grew by more than 7% YoY in March, driven by an 11.3% increase in shipments of electronics and semiconductor manufacturing equipment, much of it to China, according to NikkeiAsia.

China‘s IC output grew 40% in the first quarter, primarily driven by EVs and smartphones, according to the South China Morning Post.

In the U.S., the Biden Administration released a notice of funding opportunity of $50 million targeted at small businesses pursuing advances in metrology research and technology. Also, the U.S. Department of Energy announced a $33 million funding opportunity for smart manufacturing technologies.

Germany‘s Fraunhofer IIS launched its On-Board Processor (FOBP) for the German Space Agency’s Heinrich Hertz communication satellite. FOBP can be controlled and reprogrammed from Earth and will be used to investigate creation of hybrid communication networks.

Markets and Money

RISC-V startup Rivos raised more than $250 million in capital investments to tape out its first power-optimized chips for data analytics and generative AI applications.

Silvaco filed to go public on Nasdaq. The company also received a $5 million convertible note investment from Microchip.

Microchip acquired Neuronix AI Labs to provide AI-enabled FPGA solutions for large-scale, high-performance edge applications.

The advanced packaging market saw a modest 4% increase in revenues in Q4 2023 versus the previous quarter, with a projected decline of 13% QoQ in the first quarter of 2024, reports Yole. Overall, the market is expected to increase from $38 billion in 2023 to $69.5 billion in 2029 with a CAGR of 10.7%.

TSMC’s CoWoS total capacity will increase by 150% in 2024 due to demand for NVIDIA’s Blackwell Platform, reports TrendForce.

ASML saw a nearly 40% drop in new litho equipment sales QoQ in Q1 2024 and a 61% drop in net bookings as manufacturers reduced investments in new capital equipment during the recent semiconductor market slump.

Global PC shipments rose about 3% YoY in Q1 2024, and that same growth is expected for full year 2024, reports Counterpoint. Manufacturers are predicted to promote AI PCs as semiconductor companies prepare to launch SoCs featuring higher TOPS.

The GenAI smartphone market share is predicted to reach 11% by 2024 and 43% by 2027, reports Counterpoint. Samsung likely will lead in 2024, but Apple may overtake it in 2025.

The RF GaN market is expected to exceed $2 billion by 2029, fueled by the defense and telecom infrastructure sectors, reports Yole.

In-Depth

Semiconductor Engineering published its Manufacturing, Packaging & Materials newsletter this week. Top articles include:

• Electromigration Concerns Grow In Advanced Packages
• What Works Best For Chiplets
• Enabling Advanced Devices With Atomic Layer Processes

Plus, check out these new stories and tech talks:

• Architecting Chips For High-Performance Computing
• Future-Proofing Automotive V2X
• Secure Movement Of Data In Test
• Challenges With Chiplets and Power Delivery

Security

In security research:

• Seoul National University, Sandia National Laboratories, Texas A&M University, and Applied Materials demonstrated a memristor crossbar architecture for encryption and decryption.
• Robert Bosch, Forschungszentrum Julich, and Newcastle University investigated techniques for error detection and correction in in-memory computing.
• The University of Florida introduced an automated framework that can help identify security assets for a design at the register-transfer level (RTL).

DARPA conducted successful in-air tests of AI flying an F-16 autonomously versus a human-piloted F-16 in visual-range combat scenarios.

The National Security Agency’s Artificial Intelligence Security Center (NSA AISC) published joint guidance on deploying AI systems securely with the Cybersecurity and Infrastructure Security Agency (CISA), the Federal Bureau of Investigation (FBI), and international partners. CISA also issued other alerts.

Products and Standards

Samsung uncorked LPDDR5X DRAM built on a 12nm process that supports up to 10.7 Gbps and expands the single package capacity of mobile DRAM up to 32 GB.

Keysight revealed its next-generation RF circuit simulation tool that supports multi-physics co-design of circuit, electromagnetic, and electrothermal simulations across Cadence, Synopsys, and Keysight platforms.

Renesas released its FemtoClock family of ultra-low jitter clock generators and jitter attenuators with 8 and 12 outputs, enabling clock tree designs for high-speed interconnect systems in telecom and data center switches, routers, medical imaging, and more.

Movellus expanded its droop response solutions with Aeonic Generate AWM3, which responds to voltage droops within 1 to 2 clock cycles while providing enhanced observability for droop profiling and enabling fine-grained dynamic frequency scaling.

Efabless announced the second version of its Python-based open-source EDA software for construction of customizable flows using proprietary or open-source tools.

Faraday Technology licensed Arm’s Cortex-A720AE IP to use in the development of AI-enabled vehicle ASICs. Also, Untether AI teamed up with Arm to enable its inference acceleration technology to be implemented alongside the latest-generation Automotive Enhanced technology from Arm for ADAS and autonomous vehicle applications.

FOXESS used Infineon’s 1,200V CoolSiC MOSFETs and EiceDRIVER gate drivers for industrial energy storage applications, aiming to promote green energy.

Emotors adopted Siemens’ Simcenter solutions for NVH testing of next-gen automotive e-drives.

SiTime debuted a family of clock generators for AI datacenter applications with clock, oscillator, and resonator in an integrated chip.

JEDEC published the JESD79-5C DDR5 SDRAM standard, which includes a DRAM data integrity improvement called Per-Row Activation Counting (PRAC) that precisely counts DRAM activations on a wordline granularity and alerts the system to pause traffic and designate time for mitigation measures when an excessive number of activations are detected.

The LoRa Alliance launched its roadmap for the development of the LoRaWAN open standard for IoT communications, referring to long-range radio (LoRa) low-power wide-area networks (LPWANs).

Education and Workforce

Texas A&M introduced a new Master of Science program for microelectronics and semiconductors, which will begin in fall 2025.

The Cornell NanoScale Science and Technology Facility (CNF) is partnering with Tompkins Cortland Community College and Penn State to offer a free Microelectronics and Nanomanufacturing Certificate Program to veterans and their dependents.

Eindhoven University of Technology (TU/e) has more than 700 researchers and 25 research group focused on the chip industry, but the number is projected to grow significantly due to the Dutch government’s recent investment.

Research

Intel announced a large-scale neuromorphic system based on its Loihi 2 processor. Initially deployed at Sandia National Laboratories, it aims to support research for future brain-inspired AI. Intel is also collaborating with Seekr on next-gen LLM and foundation models.

Los Alamos National Lab, HPE, and NVIDIA collaborated on the design and installation of Venado, the Lab’s new supercomputer. “Venado adds to our cutting-edge supercomputing that advances national security and basic research, and it will accelerate how we integrate artificial intelligence into meeting those challenges,” said Thom Mason, director of Los Alamos National Laboratory in a release.

Penn State is partnering with Morgan Advanced Materials on a five-year, multi-million-dollar research project to advance silicon carbide (SiC) technology. Morgan will become a founding member of the Penn State Silicon Carbide Innovation Alliance. Also, Coherent secured CHIPS Act funding of $15 million for research into high-voltage, high-power silicon carbide and single-crystal diamond semiconductors.

Oak Ridge National Laboratory (ORNL) researchers found a more efficient way to extract lithium from waste liquids leached from mining sites, oil fields, and used batteries.

Quantum

Quantinuum said it reached an inherent 99.9% 2-qubit gate fidelity in its commercial quantum computer, a point at which quantum error correction protocols can be used to greatly reduce error rates.

D-Wave Quantum uncorked a fast-anneal feature to speed up computations on its quantum processing units, which reduces the impact of external disturbances.

MIT researchers outlined a new conceptual model for a quantum computer that aims to make writing code for them easier.

SLAC National Accelerator Laboratory, Stanford University, Max Planck Institute of Quantum Optics, Ludwig-Maximilians-Universitat Munich, and Instituto de Ciencia de Materiales de Madrid researchers proposed a method that harnesses the structure of light to tweak the properties of quantum materials.

Events

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Further Reading

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at the base of the HBM stack.

Intel assembled the industry’s first high-NA EUV lithography system. “Compared to 0.33NA EUV, high-NA EUV (or 0.55NA EUV) can deliver higher imaging contrast for similar features, which enables less light per exposure, thereby reducing the time required to print each layer and increasing wafer output,” Intel said.

Fig. 1: Bigger iron — Intel’s brand new high-NA EUV machinery. Source: Intel

Samsung is slated to receive $6.4 billion in CHIPS ACT funding from the U.S. Department of Commerce (DoC) as part of a $40 billion expansion of its Austin, Texas, manufacturing facility, along with an R&D fab, a pair of leading-edge logic fabs, and an advanced packaging plant in nearby Taylor, Texas.

Micron and the U.S. government next week will announce $6.1 billion in CHIPS Act funding for the development of advanced memory chips in New York and Idaho, according to AP News.

Cadence unveiled its Palladium Z3 Emulation and Protium X3 FPGA Prototyping systems, targeted at multi-billion-gate designs with 2X increase in capacity and a 1.5X performance increase compared to previous-generation systems. Cadence also teamed up with MemVerge to enable seamless support for AWS Spot instances for long-running high-memory EDA jobs, and extended its hybrid cloud environment solutions through a collaboration with NetApp.

Fig. 2: At CadenceLive Silicon Valley, NVIDIA CEO Jensen Huang (r.) discussed accelerated computing and generative AI with Cadence CEO Anirudh Devgan. Source: Semiconductor Engineering

Quick links to more news:

Global
Markets and Money
In-Depth
Security
Education and Workforce
Product and Standards
Research
Quantum
Events
Further Reading

Global

After Taiwan’s recent 7.2 magnitude earthquake, TSMC reached more the 70% tool recovery in its fabs within the first 10 hours and full recovery by the end of the third day, according to this week’s earnings call. Some wafers in process were scrapped but the company expects the lost production to be recovered in the second quarter.  Also in the call, TSMC said they expect their “customers to share some of the higher cost” of the overseas fabs and higher electricity costs.

Advantest‘s regional headquarters in Taiwan donated $2.2 million New Taiwan dollars ($680,000 US) for aid to victims and reconstruction efforts related to the Taiwan earthquake that struck on April 3.

Japan’s exports grew by more than 7% YoY in March, driven by an 11.3% increase in shipments of electronics and semiconductor manufacturing equipment, much of it to China, according to NikkeiAsia.

China‘s IC output grew 40% in the first quarter, primarily driven by EVs and smartphones, according to the South China Morning Post.

In the U.S., the Biden Administration released a notice of funding opportunity of $50 million targeted at small businesses pursuing advances in metrology research and technology. Also, the U.S. Department of Energy announced a $33 million funding opportunity for smart manufacturing technologies.

Germany‘s Fraunhofer IIS launched its On-Board Processor (FOBP) for the German Space Agency’s Heinrich Hertz communication satellite. FOBP can be controlled and reprogrammed from Earth and will be used to investigate creation of hybrid communication networks.

Markets and Money

RISC-V startup Rivos raised more than $250 million in capital investments to tape out its first power-optimized chips for data analytics and generative AI applications.

Silvaco filed to go public on Nasdaq. The company also received a $5 million convertible note investment from Microchip.

Microchip acquired Neuronix AI Labs to provide AI-enabled FPGA solutions for large-scale, high-performance edge applications.

The advanced packaging market saw a modest 4% increase in revenues in Q4 2023 versus the previous quarter, with a projected decline of 13% QoQ in the first quarter of 2024, reports Yole. Overall, the market is expected to increase from $38 billion in 2023 to $69.5 billion in 2029 with a CAGR of 10.7%.

TSMC’s CoWoS total capacity will increase by 150% in 2024 due to demand for NVIDIA’s Blackwell Platform, reports TrendForce.

ASML saw a nearly 40% drop in new litho equipment sales QoQ in Q1 2024 and a 61% drop in net bookings as manufacturers reduced investments in new capital equipment during the recent semiconductor market slump.

Global PC shipments rose about 3% YoY in Q1 2024, and that same growth is expected for full year 2024, reports Counterpoint. Manufacturers are predicted to promote AI PCs as semiconductor companies prepare to launch SoCs featuring higher TOPS.

The GenAI smartphone market share is predicted to reach 11% by 2024 and 43% by 2027, reports Counterpoint. Samsung likely will lead in 2024, but Apple may overtake it in 2025.

The RF GaN market is expected to exceed $2 billion by 2029, fueled by the defense and telecom infrastructure sectors, reports Yole.

In-Depth

Semiconductor Engineering published its Manufacturing, Packaging & Materials newsletter this week. Top articles include:

• Electromigration Concerns Grow In Advanced Packages
• What Works Best For Chiplets
• Enabling Advanced Devices With Atomic Layer Processes

Plus, check out these new stories and tech talks:

• Architecting Chips For High-Performance Computing
• Future-Proofing Automotive V2X
• Secure Movement Of Data In Test
• Challenges With Chiplets and Power Delivery

Security

In security research:

• Seoul National University, Sandia National Laboratories, Texas A&M University, and Applied Materials demonstrated a memristor crossbar architecture for encryption and decryption.
• Robert Bosch, Forschungszentrum Julich, and Newcastle University investigated techniques for error detection and correction in in-memory computing.
• The University of Florida introduced an automated framework that can help identify security assets for a design at the register-transfer level (RTL).

DARPA conducted successful in-air tests of AI flying an F-16 autonomously versus a human-piloted F-16 in visual-range combat scenarios.

The National Security Agency’s Artificial Intelligence Security Center (NSA AISC) published joint guidance on deploying AI systems securely with the Cybersecurity and Infrastructure Security Agency (CISA), the Federal Bureau of Investigation (FBI), and international partners. CISA also issued other alerts.

Products and Standards

Samsung uncorked LPDDR5X DRAM built on a 12nm process that supports up to 10.7 Gbps and expands the single package capacity of mobile DRAM up to 32 GB.

Keysight revealed its next-generation RF circuit simulation tool that supports multi-physics co-design of circuit, electromagnetic, and electrothermal simulations across Cadence, Synopsys, and Keysight platforms.

Renesas released its FemtoClock family of ultra-low jitter clock generators and jitter attenuators with 8 and 12 outputs, enabling clock tree designs for high-speed interconnect systems in telecom and data center switches, routers, medical imaging, and more.

Movellus expanded its droop response solutions with Aeonic Generate AWM3, which responds to voltage droops within 1 to 2 clock cycles while providing enhanced observability for droop profiling and enabling fine-grained dynamic frequency scaling.

Efabless announced the second version of its Python-based open-source EDA software for construction of customizable flows using proprietary or open-source tools.

Faraday Technology licensed Arm’s Cortex-A720AE IP to use in the development of AI-enabled vehicle ASICs. Also, Untether AI teamed up with Arm to enable its inference acceleration technology to be implemented alongside the latest-generation Automotive Enhanced technology from Arm for ADAS and autonomous vehicle applications.

FOXESS used Infineon’s 1,200V CoolSiC MOSFETs and EiceDRIVER gate drivers for industrial energy storage applications, aiming to promote green energy.

Emotors adopted Siemens’ Simcenter solutions for NVH testing of next-gen automotive e-drives.

SiTime debuted a family of clock generators for AI datacenter applications with clock, oscillator, and resonator in an integrated chip.

JEDEC published the JESD79-5C DDR5 SDRAM standard, which includes a DRAM data integrity improvement called Per-Row Activation Counting (PRAC) that precisely counts DRAM activations on a wordline granularity and alerts the system to pause traffic and designate time for mitigation measures when an excessive number of activations are detected.

The LoRa Alliance launched its roadmap for the development of the LoRaWAN open standard for IoT communications, referring to long-range radio (LoRa) low-power wide-area networks (LPWANs).

Education and Workforce

Texas A&M introduced a new Master of Science program for microelectronics and semiconductors, which will begin in fall 2025.

The Cornell NanoScale Science and Technology Facility (CNF) is partnering with Tompkins Cortland Community College and Penn State to offer a free Microelectronics and Nanomanufacturing Certificate Program to veterans and their dependents.

Eindhoven University of Technology (TU/e) has more than 700 researchers and 25 research group focused on the chip industry, but the number is projected to grow significantly due to the Dutch government’s recent investment.

Research

Intel announced a large-scale neuromorphic system based on its Loihi 2 processor. Initially deployed at Sandia National Laboratories, it aims to support research for future brain-inspired AI. Intel is also collaborating with Seekr on next-gen LLM and foundation models.

Los Alamos National Lab, HPE, and NVIDIA collaborated on the design and installation of Venado, the Lab’s new supercomputer. “Venado adds to our cutting-edge supercomputing that advances national security and basic research, and it will accelerate how we integrate artificial intelligence into meeting those challenges,” said Thom Mason, director of Los Alamos National Laboratory in a release.

Penn State is partnering with Morgan Advanced Materials on a five-year, multi-million-dollar research project to advance silicon carbide (SiC) technology. Morgan will become a founding member of the Penn State Silicon Carbide Innovation Alliance. Also, Coherent secured CHIPS Act funding of $15 million for research into high-voltage, high-power silicon carbide and single-crystal diamond semiconductors.

Oak Ridge National Laboratory (ORNL) researchers found a more efficient way to extract lithium from waste liquids leached from mining sites, oil fields, and used batteries.

Quantum

Quantinuum said it reached an inherent 99.9% 2-qubit gate fidelity in its commercial quantum computer, a point at which quantum error correction protocols can be used to greatly reduce error rates.

D-Wave Quantum uncorked a fast-anneal feature to speed up computations on its quantum processing units, which reduces the impact of external disturbances.

MIT researchers outlined a new conceptual model for a quantum computer that aims to make writing code for them easier.

SLAC National Accelerator Laboratory, Stanford University, Max Planck Institute of Quantum Optics, Ludwig-Maximilians-Universitat Munich, and Instituto de Ciencia de Materiales de Madrid researchers proposed a method that harnesses the structure of light to tweak the properties of quantum materials.

Events

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Further Reading

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Enlarge / The X-62A VISTA Aircraft flying above Edwards Air Force Base, California. (credit: Kyle Brasier, U.S. Air Force)

An AI test pilot has successfully flown a jet fighter in dogfights against human opponents. It's the latest development for DARPA's Air Combat Evaluation program, which is trying to develop aerospace AI agents that can be trusted to perform safely.

Human test pilots have a bit of a reputation thanks to popular culture—from The Right Stuff to Top Gun: Maverick, the profession has been portrayed as a place for loose cannons with a desire to go fast and break the rules. The reality is pretty far from that these days, especially where DARPA is concerned.

The agency instead wants a machine-learning agent that can safely fly a real aircraft autonomously, with no violations of training rules. After all, neural networks have their own reputation—at this point well-earned—for finding ways to exploit situations that hadn't occurred to humans. And the consequences when controlling a real jet fighter can be a lot more severe than just testing in silico.

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