Opening cases in CS2 is one of the most exciting aspects of the game, offering players the chance to snag rare and valuable skins. But with the rise of third-party sites, many players wonder: is it really worth it to open cases in CS2, or should you turn to these alternative platforms? Let’s dive into the pros and cons of both, and see how they stack up.

Opening Cases in CS2

First, let’s talk about the experience of opening cases directly in CS2. There’s something undeniably exciting about the anticipation as you watch the spinning wheel, hoping for that rare drop. It’s a core part of the game, deeply embedded in the CS2 culture.

Pros of Opening Cases in CS2:

1. Official and Secure: When you open cases in CS2, you’re dealing directly with the game developers. This means there’s no risk of scams or losing your hard-earned skins.
2. Game Integration: Skins obtained from CS2 cases are immediately available in your inventory, ready for you to show off in your next match.
3. Authenticity: There’s a certain pride in knowing your skins came directly from the game itself.

However, while the official route offers security and authenticity, it also has its downsides.

Cons of Opening Cases in CS2:

1. Cost: CS2 cases and keys can be pricey, especially if you’re chasing after rare skins.
2. Limited Bonuses: Unlike third-party sites, CS2 doesn’t offer many promotions, bonuses, or gifts.
3. No Extras: The experience is pretty straightforward, lacking the added excitement of case battles or other fun features offered by third-party sites.

Exploring Third-Party Case Opening Sites

Now, let’s examine what third-party case-opening sites offer. These platforms have gained popularity due to their enticing bonuses, promotions, and unique features that spice up the case-opening experience.

Advantages of Third-Party Sites:

1. Bonuses and Promotions: One of the biggest draws of third-party sites is the variety of bonuses and promotions they offer. Many sites give you extra credits, free cases, or significant discounts, making your money go further. Whether it’s a welcome bonus for new users or regular promotions for loyal customers, these perks can make a huge difference in your case opening journey.
2. Gifts and Rewards: Beyond bonuses, many third-party sites offer gifts and rewards. This could be anything from free skins to exclusive items not available in CS2. It’s like a constant stream of surprises that keeps the experience fresh and exciting.
3. Case Battles: If you’re looking for extra fun, case battles are a feature you won’t find in CS2. These battles pit players against each other to see who can pull the best skins from their cases. It’s a competitive twist that adds another layer of fun and can lead to some impressive wins.
4. Diverse Case Selection: Third-party sites often have a wider variety of cases to choose from, including custom cases created by the community. This means you can find cases tailored to your specific preferences, whether you’re hunting for a particular type of skin or just looking for something new and different.

Risks and Considerations:

While third-party sites offer many advantages, they also come with their own set of risks and considerations.

1. Security Concerns: Not all third-party sites are created equal. It’s crucial to choose reputable sites to avoid scams or losing your items. Look for sites with strong user reviews, secure payment options, and transparent policies.
2. Withdraw and Deposit Issues: Some sites may have complicated processes for withdrawing your skins or require you to deposit items before you can start opening cases. Make sure you understand these procedures before diving in.
3. Fairness and Transparency: Ensure the site you’re using has transparent odds and fair gameplay. Some less reputable sites might manipulate odds, making it harder to get valuable skins.

Is It Worth Opening Cases in CS2?

The answer ultimately depends on what you’re looking for in your case opening experience.

If you value security and authenticity, stick with opening cases directly in CS2. The official route guarantees that your skins are legitimate and safely stored in your Steam inventory. It’s a straightforward, no-frills experience that’s integrated seamlessly into the game.

If you want more excitement and value for your money, give third-party sites a try. With their generous bonuses, diverse case selection, and unique features, CS2 case battle sites can make your case-opening journey much more interesting and rewarding. Just be sure to do your research and choose a reputable site to avoid potential pitfalls.

Conclusion

As much as opening cases in CS2 can be a very enjoyable game, third-party sites offer compelling alternatives thanks to their bonuses, promotions, and added features they provide. When you weigh the pros and cons of both options, you will be able to determine which route is best. It is always important to approach each case opening with a sense of fun and adventure, regardless of whether you stick with CS2 or venture into the world of third-party websites. Have a great case opening, and may your next spin lead to the skin of your dreams.

The Screen Actors Guild - American Federation of Television and Radio Artists (SAG-AFTRA) is set to hold its second picket tomorrow.

The picket will take place from 9am until noon on Thursday August 15 at Disney Character Voices in Burbank, California, USA.

SAG-AFTRA will be represented by members of the Interactive Media Agreement Negotiating (IMA) Committee alongside other SAG-AFTRA members, labour allies, and video game fans."

Read more

The Screen Actors Guild - American Federation of Television and Radio Artists (SAG-AFTRA) has called a strike, effective at 12.01am tomorrow (July 26).

The strikes comes after the SAG-AFTRA National Board unanimously agreed earlier this week to permit its chief negotiator to call an immediate strike at will in a bid to protect voice actors fighting for job security as more and more studios explore generative AI.

National executive director and chief negotiator Duncan Crabtree-Ireland, acting under the authority delegated by SAG-AFTRA, says the strike comes "after more than a year and a half of negotiations [about the Interactive Media Agreement] without a deal."

Read more

US workers body SAG-AFTRA says its voice actors strike could still impact projects that have been in development for over a year, including games like GTA 6, despite the terms of its agreement stating they should be safe.

Initially, last week's shock announcement of strike action by video game actors over AI concerns was thought to have minimal impact on games expected to release later this year, as it did not include games that commenced production before August 2023.

Now, however, SAG-AFTRA says all "members who want to show solidarity with the union can elect voluntarily not to work", intimating that it believed the strike could be more disruptive than previously suspected and impact "non-struck" games.

Read more

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML.

Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government disagreements over how to fund chip R&D, according to Bloomberg.

SEMI published a position paper this week cautioning the European Union against imposing additional export controls to allow companies, encouraging them to  be “as free as possible in their investment decisions to avoid losing their agility and relevance across global markets.” SEMI’s recommendations on outbound investments are in response to the European Economic Security Strategy and emphasize the need for a transparent and predictable regulatory framework.

The U.S. may restrict China’s access to HBM chips and the equipment needed to make them, reports Bloomberg. Today those chips are manufactured by two Korean-based companies, Samsung and SK hynix, but U.S.-based Micron expects to begin shipping 12-high stacks of HBM3E in 2025, and is currently working on HBM4.

Synopsys executive chair and founder Dr. Aart de Geus was named the winner of the Semiconductor Industry Association’s Robert N. Noyce Award. De Geus was selected due to his contributions to EDA technology over a career spanning more than four decades.

The top three foundries plan to implement high-NA EUV lithography as early as 2025 for the 18 angstrom generation, but the replacement of single exposure high-NA (0.55) over double patterning with standard EUV (NA = 0.33) depends on whether it provides better results at a reasonable cost per wafer.

Quick links to more news:

Global
In-Depth
Market Reports and Earnings
Education and Training
Security
Product News
Research
Events and Further Reading

Global

Belgium-based Imec released part 2 of its chiplets series, addressing testing strategies and standardization efforts, as well as guidelines and research “towards efficient ESD protection strategies for advanced 3D systems-on-chip.”

Also in Belgium, BelGan, maker of GaN chips, filed for bankruptcy according to the Brussels Times.

TSMC‘s Dresden, Germany, plant will break ground this month.

The UK will dole out more than £100 million (~US $128 million) in funding to develop five new quantum research hubs in Glasgow, Edinburgh, Birmingham, Oxford, and London.

MassPhoton is opening Hong Kong‘s first ultra-high vacuum GaN epitaxial wafer pilot line and will establish a GaN research center.

Infineon completed the sale of its manufacturing sites in the Philippines and South Korea to ASE.

Israel-based RAAAM Memory Technologies received a €5.25 million grant from the European Innovation Council (EIC) to support the development and commercialization of its innovative memory solutions. This funding will enable RAAAM to advance its research in high-performance and energy-efficient memory technologies, accelerating their integration into various applications and markets.

In-Depth

Semiconductor Engineering published its Automotive, Security and Pervasive Computing newsletter this week, featuring these top stories and video:

• Chip Security Now Depends On Widening Supply Chain
• Defining Chip Threat Models To Determining Security Risks
• Post-Quantum Computing Threatens Fundamental Transport Protocols

And:

• Where Power Savings Really Count
• Making Electronics More Efficient (video)

Market Reports and Earnings

The semiconductor equipment industry is on a positive trajectory in 2024, with moderate revenue growth observed in Q2 after a subdued Q1, according to a new report from Yole Group. Wafer Fab Equipment revenue is projected to grow by 1.3% year-on-year, despite a 12% drop in Q1. Test equipment lead times are normalizing, improving order conditions. Key areas driving growth include memory and logic capital expenditures and high-bandwidth memory demand.

Worldwide silicon wafer shipments increased by 7% in Q2 2024, according to SEMI‘s latest report. This growth is attributed to robust demand from multiple semiconductor sectors, driven by advancements in AI, 5G, and automotive technologies.

The RF GaN market is projected to grow to US $2 billion by 2029, a 10% CAGR, according to Yole Group.

Counterpoint released their Q2 smartphone top 10 report.

Renesas completed their acquisition of EDA firm Altium, best known for its EDA platform and freeware CircuitMaker package.

It’s earnings season and here are recently released financials in the chip industry:

AMD  Advantest   Amkor   Ansys  Arteris   Arm   ASE   ASM   ASML
Cadence  IBM   Intel   Lam Research   Lattice   Nordson   NXP   Onsemi 
Qualcomm   Rambus  Samsung    SK Hynix   STMicro   Teradyne    TI  
Tower  TSMC    UMC  Western Digital

Industry stock price impacts are here.

Education and Training

Rochester Institute of Technology is leading a new pilot program to prepare community college students in areas such as cleanroom operations, new materials, simulation, and testing processes, with the intent of eventual transfer into RIT’s microelectronic engineering program.

Purdue University inked a deal with three research institutions — University of Piraeus, Technical University of Crete, and King’s College London —to develop joint research programs for semiconductors, AI and other critical technology fields.

The European Chips Skills Academy formed the Educational Leaders Board to help bridge the talent gap in Europe’s microelectronics sector.  The Board includes representatives from universities, vocational training providers, educators and research institutions who collaborate on strategic initiatives to strengthen university networks and build academic expertise through ECSA training programs.

Security

The Cybersecurity and Infrastructure Security Agency (CISA) is encouraging Apple users to review and apply this week’s recent security updates.

Microsoft Azure experienced a nearly 10 hour DDoS attack this week, leading to global service disruption for many customers.  “While the initial trigger event was a Distributed Denial-of-Service (DDoS) attack, which activated our DDoS protection mechanisms, initial investigations suggest that an error in the implementation of our defenses amplified the impact of the attack rather than mitigating it,” stated Microsoft in a release.

NIST published:

• “Recommendations For Increasing U.S. Participation and Leadership in Standards Development,” a report outlining cybersecurity recommendations and mitigation strategies.
• Final guidance documents and software to help improve the “safety, security and trustworthiness of AI systems.”
• Cloud Computing Forensic Reference Architecture guide.

Delta Air Lines plans to seek damages after losing $500 million in lost revenue due to security company CrowdStrike‘s software update debacle.  And shareholders are also angry.

Recent security research:

• Physically Secure Logic Locking With Nanomagnet Logic (UT Dallas)
• WBP: Training-time Backdoor Attacks through HW-based Weight Bit Poisoning (UCF)
• S-Tune: SOT-MTJ Manufacturing Parameters Tuning for Secure Next Generation of Computing ( U. of Arizona, UCF)
• Diffie Hellman Picture Show: Key Exchange Stories from Commercial VoWiFi Deployments (CISPA, SBA Research, U. of Vienna)

Product News

Lam Research introduced a new version of its cryogenic etch technology designed to enhance the manufacturing of 3D NAND for AI applications. This technology allows for the precise etching of high aspect ratio features, crucial for creating 1,000-layer 3D NAND.

Fig.1: 3D NAND etch. Source: Lam Research

Alphawave Semi launched its Universal Chiplet Interconnect Express Die-to-Die IP. The subsystem offers 8 Tbps/mm bandwidth density and supports operation at 24 Gbps for D2D connectivity.

Infineon introduced a new MCU series for industrial and consumer motor controls, as well as power conversion system applications. The company also unveiled its new GoolGaN Drive product family of integrated single switches and half-bridges with integrated drivers.

Rambus released its DDR5 Client Clock Driver for next-gen, high-performance desktops and notebooks. The chips include Gen1 to Gen4 RCDs, power management ICs, Serial Presence Detect Hubs, and temperature sensors for leading-edge servers.

SK hynix introduced its new GDDR7 graphics DRAM. The product has an operating speed of 32Gbps, can process 1.5TB of data per second and has a 50% power efficiency improvement compared to the previous generation.

Intel launched its new Lunar Lake Ultra processors. The long awaited chips will be included in more than 80 laptop designs and has more than 40 NPU tera operations per second as well as over 60 GPU TOPS delivering more than 100 platform TOPS.

Brewer Science achieved recertification as a Certified B Corporation, reaffirming its commitment to sustainable and ethical business practices.

Panasonic adopted Siemens’ Teamcenter X cloud product lifecycle management solution, citing Teamcenter X’s Mendix low-code platform, improved operational efficiency and flexibility for its choice.

Keysight validated its 5G NR FR1 1024-QAM demodulation test cases for the first time. The 5G NR radio access technology supports eMBB and was validated on the 3GPP TS 38.521-4 test specification.

Research

In a 47-page deep-dive report, the Center for Security and Emerging Technology delved into all of the scientific breakthroughs from 1980 to present that brought EUV lithography to commercialization, including lessons learned for the next emerging technologies.

Researchers at the Paul Scherrer Institute developed a high-performance X-ray tomography technique using burst ptychography, achieving a resolution of 4nm. This method allows for non-destructive imaging of integrated circuits, providing detailed views of nanostructures in materials like silicon and metals.

MIT signed a four-year agreement with the Novo Nordisk Foundation Quantum Computing Programme at University of Copenhagen, focused on accelerating quantum computing hardware research.

MIT’s Research Laboratory of Electronics (RLE) developed a mechanically flexible wafer-scale integrated photonics fabrication platform. This enables the creation of flexible photonic circuits that maintain high performance while being bendable and stretchable. It offers significant potential for integrating photonic circuits into various flexible substrate applications in wearable technology, medical devices, and flexible electronics.

The Naval Research Lab identified a new class of semiconductor nanocrystals with bright ground-state excitons, emphasizing an important advancement in optoelectronics.

Researchers from National University of Singapore developed a novel method, known as tension-driven CHARM3D,  to fabricate 3D self-healing circuits, enabling the 3D printing of free-standing metallic structures without the need for support materials and external pressure.

Find more research in our Technical Papers library.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here, including topics such as quantum safe cryptography, analytics for high-volume manufacturing, and mastering EMC simulations for electronic design.

Find Semiconductor Engineering’s latest newsletters here:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week in Review appeared first on Semiconductor Engineering.

Enlarge / LOS ANGELES, CALIFORNIA - JULY 23: Travelers from France wait on their delayed flight on the check-in floor of the Delta Air Lines terminal at Los Angeles International Airport (LAX) on July 23, 2024 in Los Angeles, California. (credit: Mario Tama/Getty Images)

CrowdStrike has hit back at Delta Air Lines’ threat of litigation against the cyber security company over a botched software update that grounded thousands of flights, denying it was responsible for the carrier’s own IT decisions and days-long disruption.

In a letter on Sunday, lawyers for CrowdStrike argued that the US carrier had created a “misleading narrative” that the cyber security firm was “grossly negligent” in an incident that the US airline has said will cost it $500 million.

Delta took days longer than its rivals to recover when CrowdStrike’s update brought down millions of Windows computers around the world last month. The airline has alerted the cyber security company that it plans to seek damages for the disruptions and hired litigation firm Boies Schiller Flexner.

Read 12 remaining paragraphs | Comments

US workers body SAG-AFTRA says its voice actors strike could still impact projects that have been in development for over a year, including games like GTA 6, despite the terms of its agreement stating they should be safe.

Initially, last week's shock announcement of strike action by video game actors over AI concerns was thought to have minimal impact on games expected to release later this year, as it did not include games that commenced production before August 2023.

Now, however, SAG-AFTRA says all "members who want to show solidarity with the union can elect voluntarily not to work", intimating that it believed the strike could be more disruptive than previously suspected and impact "non-struck" games.

Read more

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML.

Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government disagreements over how to fund chip R&D, according to Bloomberg.

SEMI published a position paper this week cautioning the European Union against imposing additional export controls to allow companies, encouraging them to  be “as free as possible in their investment decisions to avoid losing their agility and relevance across global markets.” SEMI’s recommendations on outbound investments are in response to the European Economic Security Strategy and emphasize the need for a transparent and predictable regulatory framework.

The U.S. may restrict China’s access to HBM chips and the equipment needed to make them, reports Bloomberg. Today those chips are manufactured by two Korean-based companies, Samsung and SK hynix, but U.S.-based Micron expects to begin shipping 12-high stacks of HBM3E in 2025, and is currently working on HBM4.

Synopsys executive chair and founder Dr. Aart de Geus was named the winner of the Semiconductor Industry Association’s Robert N. Noyce Award. De Geus was selected due to his contributions to EDA technology over a career spanning more than four decades.

The top three foundries plan to implement high-NA EUV lithography as early as 2025 for the 18 angstrom generation, but the replacement of single exposure high-NA (0.55) over double patterning with standard EUV (NA = 0.33) depends on whether it provides better results at a reasonable cost per wafer.

Quick links to more news:

Global
In-Depth
Market Reports and Earnings
Education and Training
Security
Product News
Research
Events and Further Reading

Global

Belgium-based Imec released part 2 of its chiplets series, addressing testing strategies and standardization efforts, as well as guidelines and research “towards efficient ESD protection strategies for advanced 3D systems-on-chip.”

Also in Belgium, BelGan, maker of GaN chips, filed for bankruptcy according to the Brussels Times.

TSMC‘s Dresden, Germany, plant will break ground this month.

The UK will dole out more than £100 million (~US $128 million) in funding to develop five new quantum research hubs in Glasgow, Edinburgh, Birmingham, Oxford, and London.

MassPhoton is opening Hong Kong‘s first ultra-high vacuum GaN epitaxial wafer pilot line and will establish a GaN research center.

Infineon completed the sale of its manufacturing sites in the Philippines and South Korea to ASE.

Israel-based RAAAM Memory Technologies received a €5.25 million grant from the European Innovation Council (EIC) to support the development and commercialization of its innovative memory solutions. This funding will enable RAAAM to advance its research in high-performance and energy-efficient memory technologies, accelerating their integration into various applications and markets.

In-Depth

Semiconductor Engineering published its Automotive, Security and Pervasive Computing newsletter this week, featuring these top stories and video:

• Chip Security Now Depends On Widening Supply Chain
• Defining Chip Threat Models To Determining Security Risks
• Post-Quantum Computing Threatens Fundamental Transport Protocols

And:

• Where Power Savings Really Count
• Making Electronics More Efficient (video)

Market Reports and Earnings

The semiconductor equipment industry is on a positive trajectory in 2024, with moderate revenue growth observed in Q2 after a subdued Q1, according to a new report from Yole Group. Wafer Fab Equipment revenue is projected to grow by 1.3% year-on-year, despite a 12% drop in Q1. Test equipment lead times are normalizing, improving order conditions. Key areas driving growth include memory and logic capital expenditures and high-bandwidth memory demand.

Worldwide silicon wafer shipments increased by 7% in Q2 2024, according to SEMI‘s latest report. This growth is attributed to robust demand from multiple semiconductor sectors, driven by advancements in AI, 5G, and automotive technologies.

The RF GaN market is projected to grow to US $2 billion by 2029, a 10% CAGR, according to Yole Group.

Counterpoint released their Q2 smartphone top 10 report.

Renesas completed their acquisition of EDA firm Altium, best known for its EDA platform and freeware CircuitMaker package.

It’s earnings season and here are recently released financials in the chip industry:

AMD  Advantest   Amkor   Ansys  Arteris   Arm   ASE   ASM   ASML
Cadence  IBM   Intel   Lam Research   Lattice   Nordson   NXP   Onsemi 
Qualcomm   Rambus  Samsung    SK Hynix   STMicro   Teradyne    TI  
Tower  TSMC    UMC  Western Digital

Industry stock price impacts are here.

Education and Training

Rochester Institute of Technology is leading a new pilot program to prepare community college students in areas such as cleanroom operations, new materials, simulation, and testing processes, with the intent of eventual transfer into RIT’s microelectronic engineering program.

Purdue University inked a deal with three research institutions — University of Piraeus, Technical University of Crete, and King’s College London —to develop joint research programs for semiconductors, AI and other critical technology fields.

The European Chips Skills Academy formed the Educational Leaders Board to help bridge the talent gap in Europe’s microelectronics sector.  The Board includes representatives from universities, vocational training providers, educators and research institutions who collaborate on strategic initiatives to strengthen university networks and build academic expertise through ECSA training programs.

Security

The Cybersecurity and Infrastructure Security Agency (CISA) is encouraging Apple users to review and apply this week’s recent security updates.

Microsoft Azure experienced a nearly 10 hour DDoS attack this week, leading to global service disruption for many customers.  “While the initial trigger event was a Distributed Denial-of-Service (DDoS) attack, which activated our DDoS protection mechanisms, initial investigations suggest that an error in the implementation of our defenses amplified the impact of the attack rather than mitigating it,” stated Microsoft in a release.

NIST published:

• “Recommendations For Increasing U.S. Participation and Leadership in Standards Development,” a report outlining cybersecurity recommendations and mitigation strategies.
• Final guidance documents and software to help improve the “safety, security and trustworthiness of AI systems.”
• Cloud Computing Forensic Reference Architecture guide.

Delta Air Lines plans to seek damages after losing $500 million in lost revenue due to security company CrowdStrike‘s software update debacle.  And shareholders are also angry.

Recent security research:

• Physically Secure Logic Locking With Nanomagnet Logic (UT Dallas)
• WBP: Training-time Backdoor Attacks through HW-based Weight Bit Poisoning (UCF)
• S-Tune: SOT-MTJ Manufacturing Parameters Tuning for Secure Next Generation of Computing ( U. of Arizona, UCF)
• Diffie Hellman Picture Show: Key Exchange Stories from Commercial VoWiFi Deployments (CISPA, SBA Research, U. of Vienna)

Product News

Lam Research introduced a new version of its cryogenic etch technology designed to enhance the manufacturing of 3D NAND for AI applications. This technology allows for the precise etching of high aspect ratio features, crucial for creating 1,000-layer 3D NAND.

Fig.1: 3D NAND etch. Source: Lam Research

Alphawave Semi launched its Universal Chiplet Interconnect Express Die-toDie IP. The subsystem offers 8 Tbps/mm bandwidth density and supports operation at 24 Gbps for D2D connectivity.

Infineon introduced a new MCU series for industrial and consumer motor controls, as well as power conversion system applications. The company also unveiled its new GoolGaN Drive product family of integrated single switches and half-bridges with integrated drivers.

Rambus released its DDR5 Client Clock Driver for next-gen, high-performance desktops and notebooks. The chips include Gen1 to Gen4 RCDs, power management ICs, Serial Presence Detect Hubs, and temperature sensors for leading-edge servers.

SK hynix introduced its new GDDR7 graphics DRAM. The product has an operating speed of 32Gbps, can process 1.5TB of data per second and has a 50% power efficiency improvement compared to the previous generation.

Intel launched its new Lunar Lake Ultra processors. The long awaited chips will be included in more than 80 laptop designs and has more than 40 NPU tera operations per second as well as over 60 GPU TOPS delivering more than 100 platform TOPS.

Brewer Science achieved recertification as a Certified B Corporation, reaffirming its commitment to sustainable and ethical business practices.

Panasonic adopted Siemens’ Teamcenter X cloud product lifecycle management solution, citing Teamcenter X’s Mendix low-code platform, improved operational efficiency and flexibility for its choice.

Keysight validated its 5G NR FR1 1024-QAM demodulation test cases for the first time. The 5G NR radio access technology supports eMBB and was validated on the 3GPP TS 38.521-4 test specification.

Research

In a 47-page deep-dive report, the Center for Security and Emerging Technology delved into all of the scientific breakthroughs from 1980 to present that brought EUV lithography to commercialization, including lessons learned for the next emerging technologies.

Researchers at the Paul Scherrer Institute developed a high-performance X-ray tomography technique using burst ptychography, achieving a resolution of 4nm. This method allows for non-destructive imaging of integrated circuits, providing detailed views of nanostructures in materials like silicon and metals.

MIT signed a four-year agreement with the Novo Nordisk Foundation Quantum Computing Programme at University of Copenhagen, focused on accelerating quantum computing hardware research.

MIT’s Research Laboratory of Electronics (RLE) developed a mechanically flexible wafer-scale integrated photonics fabrication platform. This enables the creation of flexible photonic circuits that maintain high performance while being bendable and stretchable. It offers significant potential for integrating photonic circuits into various flexible substrate applications in wearable technology, medical devices, and flexible electronics.

The Naval Research Lab identified a new class of semiconductor nanocrystals with bright ground-state excitons, emphasizing an important advancement in optoelectronics.

Researchers from National University of Singapore developed a novel method, known as tension-driven CHARM3D,  to fabricate 3D self-healing circuits, enabling the 3D printing of free-standing metallic structures without the need for support materials and external pressure.

Find more research in our Technical Papers library.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here, including topics such as quantum safe cryptography, analytics for high-volume manufacturing, and mastering EMC simulations for electronic design.

Find Semiconductor Engineering’s latest newsletters here:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week in Review appeared first on Semiconductor Engineering.

MrBeast, one of the most popular content creators in the world, is seen by many as a family-friendly and mostly good dude who does a lot of charity work. But recent controversies, including one over his use of slurs in the past, have put a dark cloud over the famous YouTuber’s massive empire.

Read more...

Thousands of video game actors went on strike on July 26 for the first time since 2017. The fight is over AI protections and other issues in contract negotiations with some of the biggest studios and publishers, and will halt work from SAG-AFTRA members on future projects, as well as possibly keep them from promotion…

Read more...

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used.

Intel is in advanced talks with Apollo Global Management for the equity firm to provide more than $11 billion to build a fab in Ireland, reported the Wall Street Journal. Also, Intel’s Foundry Services appointed Kevin O’Buckley as the senior vice president and general manager.

Polar is slated to receive up to $120 million in CHIPS Act funding to establish an independent American foundry in Minnesota. The company expects to invest about $525 million in the expansion of the facility over the next two years, with a $75 million investment from the State of Minnesota.

Arm plans to develop AI chips for launch next year, reports Nikkei Asia.

South Korea is planning a support package worth more than 10 trillion won ($7.3 billion) aimed at chip materials, equipment makers, and fabless companies throughout the semiconductor supply chain, according to Reuters.

Quick links to more news:

Global
In-Depth
Markets and Money
Security
Supercomputing
Education and Training
Product News
Research
Events and Further Reading

Global

Edwards opened a new facility in Asan City, South Korea. The 15,000m² factory provides a key production site for abatement systems, and integrated vacuum and abatement systems for semiconductor manufacturing.

France’s courtship with mega-tech is paying off.  Microsoft is investing more than US $4 billion to expand its cloud computing and AI infrastructure, including bringing up to 25,000 advanced GPUs to the country by the end of 2025. The “Choose France” campaign also snagged US $1.3 billion from Amazon for cloud infrastructure expansion, genAI and more.

Toyota, Nissan, and Honda are teaming up on AI and chips for next-gen cars with support from Japan’s Ministry of Economy, Trade and Industry, (METI), reports Nikkei Asia.

Meanwhile, IBM and Honda are collaborating on long-term R&D of next-gen technologies for software-defined vehicles (SDV), including chiplets, brain-inspired computing, and hardware-software co-optimization.

Siemens and Foxconn plan to collaborate on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV).

TSMC confirmed a Q424 construction start date for its first European plant in Dresden, Germany.

Amazon Web Services (AWS) plans to invest €7.8 billion (~$8.4B) in the AWS European Sovereign Cloud in Germany through 2040. The system is designed to serve public sector organizations and customers in highly regulated industries.

In-Depth

Semiconductor Engineering published its Low Power-High Performance newsletter this week, featuring these stories:

• • Will Domain-Specific ICs Become Ubiquitous?
  • Running More Efficient AI/ML Code With Neuromorphic Engines
  • Power/Performance Costs In Chip Security

And this week’s Test, Measurement & Analytics newsletter featured these stories:

• Using Predictive Maintenance To Boost IC Manufacturing Efficiency
• The Future Of Fault Coverage In Chips
• Doing More At Functional Test

Markets and Money

The U.S. National Institute of Standards and Technology (NIST) awarded more than $1.2 million to 12 businesses in 8 states under the Small Business Innovation Research (SBIR) Program to fund R&D of products relating to cybersecurity, quantum computing, health care, semiconductor manufacturing, and other critical areas.

Engineering services and consulting company Infosys completed the acquisition of InSemi Technology, a provider of semiconductor design and embedded software development services.

The quantum market, which includes quantum networking and sensors alongside computing, is predicted to grow from $838 million in 2024 to $1.8 billion in 2029, reports Yole.

Shipments of OLED monitors reached about 200,000 units in Q1 2024, a year over year growth of 121%, reports TrendForce.

Global EV sales grew 18% in Q1 2024 with plug-in hybrid electric vehicles (PHEV) sales seeing 46% YoY growth and battery electric vehicle (BEV) sales growing just 7%, according to Counterpoint. China leads global EV sales with 28% YoY growth, while the US grew just 2%. Tesla saw a 9% YoY drop, but topped BEV sales with a 19% market share. BYD grew 13% YoY and exported about 100,000 EVs with 152% YoY growth, mainly in Southeast Asia.

DeepX raised $80.5 million in Series C funding for its on-device NPU IP and AI SoCs tailored for applications including physical security, robotics, and mobility.

MetisX raised $44 million in Series A funding for its memory solutions built on Compute Express Link (CXL) for accelerating large-scale data processing applications.

Security

While security experts have been warning of a growing threat in electronics for decades, there have been several recent fundamental changes that elevate the risk.

Synopsys and the Ponemon Institute released a report showing 54% of surveyed organizations suffered a software supply chain attack in the past year and 20% were not effective in their response. And 52% said their development teams use AI tools to generate code, but only 32% have processes to evaluate it for license, security, and quality risks.

Researchers at Ruhr University Bochum and TU Darmstadt presented a solution for the automated generation of fault-resistant circuits (AGEFA) and assessed the security of examples generated by AGEFA against side-channel analysis and fault injection.

TXOne reported on operational technology security and the most effective method for preventing production interruptions caused by cyber-attacks.

CrowdStrike and NVIDIA are collaborating to accelerate the use of analytics and AI in cybersecurity to help security teams combat modern cyberattacks, including AI-powered threats.

The National Institute of Standards and Technology (NIST) finalized its guidelines for protecting sensitive data, known as controlled unclassified information, aimed at organizations that do business with the federal government.

The Defense Advanced Research Projects Agency (DARPA) awarded BAE Systems a $12 million contract to solve thermal challenges limiting electronic warfare systems, particularly in GaN transistors.

Sigma Defense won a $4.7 million contract from the U.S. Army for an AI-powered virtual training environment, partnering with Brightline Interactive on a system that uses spatial computing and augmented intelligence workflows.

SkyWater’s advanced packaging operation in Florida has been accredited as a Category 1A Trusted Supplier by the Defense Microelectronics Activity (DMEA) of the U.S. Department of Defense (DoD).

Videos of two CWE-focused sessions from CVE/FIRST VulnCon 2024 were made available on the CWE YouTube Channel.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Supercomputing

Supercomputers are battling for top dog.

The Frontier supercomputer at Oak Ridge National Laboratory (ORNL) retained the top spot on the Top500 list of the world’s fastest systems with an HPL score of 1.206 EFlop/s. The as-yet incomplete Aurora system at Argonne took second place, becoming the world’s second exascale system at 1.012 EFlop/s. The Green500 list, which tracks energy efficiency of compute, saw three new entrants take the top places.

Cerebras Systems, Sandia National Laboratory, Lawrence Livermore National Laboratory, and Los Alamos National Laboratory used Cerebras’ second generation Wafer Scale Engine to perform atomic scale molecular dynamics simulations at the millisecond scale, which they claim is 179X faster than the Frontier supercomputer.

UT Austin‘s Stampede3 Supercomputer is now in full production, serving the open science community through 2029.

Education and Training

SEMI announced the SEMI University Semiconductor Certification Programs to help alleviate the workforce skills gap. Its first two online courses are designed for new talent seeking careers in the industry, and experienced workers looking to keep their skills current.  Also, SEMI and other partners launched a European Chip Skills Academy Summer School in Italy.

Siemens created an industry credential program for engineering students that supplements a formal degree by validating industry knowledge and skills. Nonprofit agency ABET will provide accreditation. The first two courses are live at the University of Colorado Boulder (CU Boulder) and a series is planned with Pennsylvania State University (Penn State).

Syracuse University launched a $20 million Center for Advanced Semiconductor Manufacturing, with co-funding from Onondaga County.

Starting young is a good thing.  An Arizona school district, along with the University Of Arizona,  is creating a semiconductor program for high schoolers.

Product News

Siemens and Sony partnered to enable immersive engineering via a spatial content creation system, NX Immersive Designer, which includes Sony’s XR head-mounted display. The integration of hardware and software gives designers and engineers natural ways to interact with a digital twin. Siemens also extended its Xcelerator as a Service portfolio with solutions for product engineering and lifecycle management, cloud-based high-performance simulation, and manufacturing operations management. It will be available on Microsoft Azure, as well.

Advantest announced the newest addition to its portfolio of power supplies for the V93000 EXA Scale SoC test platform. The DC Scale XHC32 power supply offers 32 channels with single-instrument total current of up to 640A.

Fig. 1: Advantest’s DC Scale XHC32. Source: Advantest

Infineon released its XENSIV TLE49SR angle sensors, which can withstand stray magnetic fields of up to 8 mT, ideal for applications of safety-critical automotive chassis systems.

Google debuted its sixth generation Cloud TPU, 4.7X faster and 67% more energy-efficient than the previous generation, with double the high-bandwidth memory.

X-Silicon uncorked a RISC-V vector CPU, coupled with a Vulkan-enabled GPU ISA and AI/ML acceleration in a single processor core, aimed at embedded and IoT applications.

IBM expanded its Qiskit quantum software stack, including the stable release of its SDK for building, optimizing, and visualizing quantum circuits.

Northeastern University announced the general availability of testing and integration solutions for Open RAN through the Open6G Open Testing and Integration Center (Open 6G OTIC).

Research

The University of Glasgow received £3 million (~$3.8M) from the Engineering and Physical Sciences Research Council (EPSRC)’s Strategic Equipment Grant scheme to help establish “Analogue,” an Automated Nano Analysing, Characterisation and Additive Packaging Suite to research silicon chip integration and packaging.

EPFL researchers developed scalable photonic ICs, based on lithium tantalate.

DISCO developed a way to increase the diameter of diamond wafers that uses the KABRA process, a laser ingot slicing method.

CEA-Leti developed two complementary approaches for high performance photon detectors — a mercury cadmium telluride-based avalanche photodetector and a superconducting single photon detector.

Toshiba demonstrated storage capacities of over 30TB with two next-gen large capacity recording technologies for hard disk drives (HDDs): Heat Assisted Magnetic Recording (HAMR) and Microwave Assisted Magnetic Recording (MAMR).

Caltech neuroscientists reported that their brain-machine interface (BMI) worked successfully in a second human patient, following 2022’s first instance, proving the device is not dependent on one particular brain or one location in a brain.

Linköping University researchers developed a cheap, sustainable battery made from zinc and lignin, while ORNL researchers developed carbon-capture batteries.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Semiconductor Engineering’s latest newsletters:

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The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Source

Last time, you decided that gliding powers are better than Dragon's Dogma 2's Unmaking Arrow. Honestly I'm surprised it was that close (66% vs 33%—don't sweat the rounding), and I'm proud of your ability to weigh a whole concept against a single-game implementation. We are so good at this. Onwards! This week, I ask you to choose between placing things in two very different ways. What's better: a 'put back' action, or standing atop another player's head in an FPS?

Read more

(Information on Steam’s top games were gathered for this article from Steam Charts)

Back in January 2020, I crafted a neat little piece discussing the Logical Increments tier needed to enjoy each of the top games on Steam at the time. Fast forward to now, and oh, how the scene has shifted! Back around that period, we were seeing trade tariffs causing a good bump in prices for PC hardware​. As we ventured into late 2020, high demand meant the cost of PC parts kept climbing, and 2021 brought even higher prices—especially for graphics cards due to a cryptocurrency boom. Oh, and let’s not forget, the world was just getting acquainted with Covid-19, adding a whole new level of complexity to tech market dynamics through supply chain issues.

Now, at the tail end of 2023, with prices and availability having normalized in some (though not all) component categories, and just a week left until Black Friday and Cyber Monday, it’s about time we take a fresh look at what Logical Increments PC building tier you’d need to dive into the most popular Steam games today. Let’s see what changed in the last few years, and whether that ol’ system still has some life in it, or whether it might be worth a little upgrade. Stick around as we unpack the current gaming demands and discuss today’s tech landscape.
 

Criteria:

Logical Increments keeps its primary tier list consistently updated, showing you the cost of building systems geared towards particular performance milestones. From the humble ‘Destitute’ system to the jaw-dropping ‘Monstrous’ setup, it shows what is attainable at each price point, offers a roadmap for some upgrading, and generally makes it convenient to knit together a balanced system with top-notch parts.

With that list in hand, we can match each of the most popular games on Steam right now with a Logical Increments tier. In this piece, I cross-referenced the 8 most played Steam games with our tier list to see what is required to hit 60 frames per second at 1080p (referenced as 1080p60), 120 frames per second at 1440p (referenced as 1440p120), and 60 frames per second at 4K (referenced as 4k60).

Last time, I stuck to two non-negotiables for a system to land in a specific category. This time I made a few changes:

• The lion’s share of the time, we’re talking 99% or more, it had to cruise within 10% of the minimum frames per second or higher at the chosen resolution. So, I care more about the ‘minimum’ than the ‘average’ frames per second.
• It had to strut with at least very high graphical settings.

What should you do with this information? Find the games you play most often, or at least the games that interest you. Look at the resolution and frames per second you’re interested in, and (assuming you’re not bursting your budget), get the suggested tier for a satisfying, pleasant experience. You won’t have any regrets, as these systems have been vetted to ensure a proper balance of performance and price.

Now, let’s get on with what you came here for! On with the games!

Games:

Counter-Strike 2

Counter-Strike 2 is the freshest iteration in the cherished Counter-Strike series, known for its intense competitive gameplay that’s been honed by Valve (and then by millions of players worldwide over two decades). Built on the Source 2 engine, this game was released on September 27, 2023, 11 years after CS:GO. Interestingly, even though it had a massive graphical upgrade and several systems were overhauled (to the disappointment of some), the minimum specifications haven’t really changed that much. Really, any gaming computer built in the last 5 years would be able to run this at 1080p60 without any issues. But I digress. Here are my recommendations:

DotA 2

Another Source 2 engine game. Last time, I said that “the multiplayer online battle arena (MOBA) Dota 2 was officially released in 2013, and quickly rose in ranks to become one of the most popular games on Steam. Allowing for a range of different gameplay styles, such as strategical and tactical or more aggressive, you can play the game almost any way you want. It has a fairly steep learning curve, and can be an exercise in frustration for newcomers, but once you get the hang of the controls you’ll be greeted with fun, exciting gameplay.” Not much has changed on that front, so let’s see if the recommendations have changed:

PlayerUnknown’s Battlegrounds (PUBG)

Released in late 2017, this battle royale game catapulted to the top of Steam’s most popular games, and it hasn’t really dropped from the list. Thankfully, it’s a lot more stable to run these days; in the early years, there were stability and optimisation problems, but hey, that’s now mostly a worry of the past.

Baldur’s Gate 3

A role-playing game released in early August, 2023. Baldur’s Gate 3 received high praise for its narrative, gameplay, and player choice. It has a fantastic amount of flexibility and replayability. You really can play this game any way you want. Its popularity has surprised its creators though, with a peak of around 800,000 players on release, and a current count still above 100,000 months later. The suggestions below include using upscaling technology in the game’s settings; if you don’t want to use it, I suggest going up a tier or two.

Apex Legends

Apex Legends is a battle royale game released in February 2019. Though it’s another game built on the Source engine, it isn’t similar to Counter-Strike 2 and Dota 2 because the engine of Apex Legends is a fork of the original Source engine from around the time Portal 2 came out. I’d argue that Apex Legends is really pushing the original Source engine to its limits, so I’m interested to see how well it performs on lower-tier systems. Without further ado, let’s check out the recommendations:

Team Fortress 2

Last time, I said that it’s “nearly impossible to get good data on how well current GPUs run this game.” And you know what? That still holds true today, thanks to the age of the game. Team Fortress 2 has been running for around 15 years, and still has popularity and longevity. Which makes perfect sense to me; it’s a great game! My only question is about how well-supported current-generation graphics cards are, comparatively. So, with some interpolation of available data, here are the choices I’ve made:

Call of Duty

So, this part encompasses Call of Duty: Modern Warfare III, Modern Warfare II, and Warzone. Having both solid single-player campaigns and a “multiplayer combat arena with battle royales, resurgence and DMZ” this game, whose earliest member came out in 2022, does require a powerful system to get the most out of it. I definitely recommend using upscaling tech like DLSS or FSR if the visual artifacts don’t bother you.

The Finals

A really recent entry, The Finals is a new shooter game that’s just been released. As in, I was typing this section the day The Finals was released (in open beta) so there’s not a huge amount of information available yet. To further exacerbate this situation, the system requirements on Steam all say TBD. Lovely. But that doesn’t mean there’s zero info, and we can extrapolate data from similar games and similar engines as well. Anyway, this game is much more arcade-like, and has some really solid destruction physics. Keep in mind though that at present this is in beta, so stability and optimisation isn’t the best yet (and may not be the devs’ current priority).

Conclusion:

Something that surprised me was that for the most part, 4k60 required the same tier as 1440p120, or sometimes even the tier below. Personally, I prefer 1440p120 over 4k60—but for slower, single-player games it’s worth knowing. Nonetheless, whether you are chasing the thrill of multiplayer games like The Finals or Apex Legends, or getting immersed in the narrative of Baldur’s Gate 3, getting the right hardware is instrumental to a good experience.

It’s not just enough to look at the average frame rates, but the minimum you’ll get as well. You want to ensure the experience stays smooth, which is what my analysis has done here. It is fantastic that most of these games don’t require powerful hardware. You can get a fully enjoyable experience at 1080p60 with a fairly budget-oriented system. So, even though games continue to evolve and push new heights with new releases and updated versions, you can still be assured that your old favourites will be hanging around for years to come, and that you’ll have the system to run them.

Sources

• Gamers Nexus – Coronavirus Hits PC Hardware Manufacturing Hard: Z490, AM4, & Computex
• HowManyFPS – FPS Calculator for Hardware, PCs, and Laptops
• PC Gamer – Larian’s boss worried Baldur’s Gate 3 had peaked in early access, so its massive 800K concurrent player launch was ‘way, way beyond’ expectations
• PCGamesN – The Finals system requirements
• RockPaperShotgun – Baldur’s Gate 3 system requirements, PC performance, and best settings to use
• Steam – Call of Duty Store Page
• SteamCharts – Top Games List
• TechPowerUp – Counter-Strike 2 Performance Benchmark Review – 40 GPUs Tested