Samsung was in a spot of worry a few months ago, as its high-bandwidth memory (HBM) chips hadn't received Nvidia's certification for months. A few weeks ago, Samsung's HBM3 chips reportedly received Nvidia's certification for the Chinese market. However, even before the certification, Chinese firms had been reportedly stockpiling Samsung's HBM chips for months.

Chinese firms Baidu and Huawei have been reportedly stockpiling Samsung HBM chips for AI accelerators

According to a report from Reuters, Chinese tech giants Baidu and Huawei have been buying HBM chips from Samsung since earlier this year. The companies ramped up their purchases in anticipation of possible US curbs on exporting critical semiconductor chips to Chinese firms. The report claims that Chinese firms account for nearly 30% of Samsung's HBM chip sales globally.

It is reported that US authorities are planning to impose additional restrictions on chip shipments to China. The US already has curbs that restrict semiconductor chip firms from exporting 5nm (or more advanced) chips to be sold to Chinese firms. Newer export rules from the US may have specific parameters to restrict the export of HBM chips, which are crucial in AI processing.

Almost all AI accelerators, including AMD and Nvidia ones, are paired with HBM memory chips for faster data transfer. The only firms in the world that make HBM chips are Micron, Samsung, and SK Hynix. While HBM3E is the most advanced HBM chip right now, Chinese firms have been primarily buying HBM2E chips, which are two generations older.

Since Micron's and SK Hynix's HBM manufacturing capacities have been fully booked by US-based tech firms, Chinese firms are dependent on Samsung's HBM chips. Haawking and Tencent are also said to be among those who bought Samsung's HBM chips. If the US brings additional restrictions on the supply of HBM chips to the Chinese market, Samsung might face business issues.

Apparently, Chinese firm CXMT has been developing HBM2-grade memory chips that are three generations behind. By the time they start using homemade HBM2 chips, Micron, Samsung, and SK Hynix would have released HBM4 chips.

Image Credits: Samsung

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Samsung has unveiled the world's thinnest LPDDR5X DRAM chip, which is just 0.65mm thin, or as thin as a fingernail. This chip is made for high-end smartphones, which typically have an onboard neural processing unit (NPU) for on-device AI processing.

Samsung's newest LPDDR5X DRAM is just 0.65mm thin, making it the world's thinnest in its segment

The newest LPDDR5X DRAM chip from Samsung is the world's thinnest 12nm-class chip. It is available in 12GB and 16GB capacities. This chip is made using four stacked layers, each containing two LPDDR DRAM chips. Due to its thin profile, it offers more space in mobile devices, allowing for a better thermal design. According to Samsung, its new memory chip improves heat resistance by up to 21.2% compared to the previous-generation LPDDR5X chip.

Samsung optimized the printed circuit board (PCB), epoxy molding compound (EMC), and the back-lapping process to minimize the chip's height. The company plans to start supplying its new chip to smartphone manufacturers soon. It also announced that it will soon start making 24GB (6-layer) and 32GB (8-layer) LPDDR DRAM chips for future mobile devices.

YongCheol Bae, the Executive VP of Samsung's Memory Product Planning team, said, “Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package. We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”

Image Credits: Samsung

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BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development.

Onsemi plans to build a $2 billion silicon carbide production plant in the Czech Republic. The site would produce smart power semiconductors for electric vehicles, renewable energy technology, and data centers.

The global chip manufacturing industry is projected to boost capacity by 6% in 2024 and 7% in 2025, reaching 33.7 million 8-inch (200mm) wafers per month, according to SEMI‘s latest World Fab Forecast report. Leading-edge capacity for 5nm nodes and below is expected to grow by 13% in 2024, driven by AI demand for data center applications. Additionally, Intel, Samsung, and TSMC will begin producing 2nm chips using gate-all-around (GAA) FETs next year, boosting leading-edge capacity by 17% in 2025.

At the IEEE Symposium on VLSI Technology & Circuits, imec introduced:

• Functional CMOS-based CFETs with stacked bottom and top source/drain contacts.
• CMOS-based 56Gb/s zero-IF D-band beamforming transmitters to support next-gen short-range, high-speed wireless services at frequencies above 100GHz.
• ADCs for base stations and handsets, a key step toward scalable, high-performance beyond-5G solutions, such as cloud-based AI and extended reality apps.

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Wolfspeed postponed plans to construct a $3 billion chip plant in Germany, underscoring the EU‘s challenges in boosting semiconductor production, reports Reuters. The North Carolina-based company cited reduced capital spending due to a weakened EV market, saying it now aims to start construction in mid-2025, two years later than 0riginally planned.

Micron is building a pilot production line for high-bandwidth memory (HBM) in the U.S., and considering HBM production in Malaysia to meet growing AI demand, according to a Nikkei report. The company is expanding HBM R&D facilities in Boise, Idaho, and eyeing production capacity in Malaysia, while also enhancing its largest HBM facility in Taichung, Taiwan.

Kioxia restored its Yokkaichi and Kitakami plants in Japan to full capacity, ending production cuts as the memory market recovers, according to Nikkei. The company, which is focusing on NAND flash production, has secured new bank credit support, including refinancing a ¥540 billion loan and establishing a ¥210 billion credit line. Kioxia had reduced output by more than 30% in October 2022 due to weak smartphone demand.

Europe’s NATO Innovation Fund announced its first direct investments, which includes semiconductor materials. Twenty-three NATO allies co-invested in this over $1B fund devoted to address critical defense and security challenges.

The second meeting of the U.S.–India Initiative on Critical and Emerging Technology (iCET) was held in New Delhi, with various funding and initiatives announced to support semiconductor technology, next-gen telecommunications, connected and autonomous vehicles, ML, and more.

Amazon announced investments of €10 billion in Germany to drive innovation and support the expansion of its logistics network and cloud infrastructure.

Quantum Machines opened the Israeli Quantum Computing Center (IQCC) research facility, backed by the Israel Innovation Authority and located at Tel Aviv University. Also, Israel-based Classiq is collaborating with NVIDIA and BMW, using quantum computing to find the optimal automotive architecture of electrical and mechanical systems.

Global data center vacancy rates are at historic lows, and power availability is becoming less available, according to a Siemens report featured on Broadband Breakfast. The company called for an influx of financing to find new ways to optimize data center technology and sustainability.

In-Depth

Semiconductor Engineering published its Manufacturing, Packaging & Materials newsletter this week, featuring these top stories:

• Single Vs. Multi-Patterning Advancements For EUV
• Precise Control Of Copper Plating And CMP
• Ruthenium Interconnects On Tap
• Opportunities Grow For GPU Acceleration

More reporting this week:

• IC Industry’s Growing Role In Sustainability
• What’s Missing In Test

Market Reports

Renesas completed its acquisition of Transphorm and will immediately start offering GaN-based power products and reference designs to meet the demand for wide-bandgap (WBG) chips.

Revenues for the top five wafer fab equipment (WFE) companies fell 9% YoY in Q1 2024, according to Counterpoint. This was offset partially by increased demand for NAND and DRAM, which increased 33% YoY, and strong growth in sales to China, which were up 116% YoY.

The SiC power devices industry saw robust growth in 2023, primarily driven by the BEV market, according to TrendForce. The top five suppliers, led by ST with a 32.6% market share and onsemi in second place, accounted for 91.9% of total revenue. However, the anticipated slowdown in BEV sales and weakening industrial demand are expected to significantly decelerate revenue growth in 2024. 

About 30% of vehicles produced globally will have E/E architectures with zonal controllers by 2032, according to McKinsey & Co. The market for automotive micro-components and logic semiconductors is predicted to reach $60 billion in 2032, and the overall automotive semiconductor market is expected to grow from $60 billion to $140 billion in the same period, at a 10% CAGR.

The automotive processor market generated US$20 billion in revenue in 2023, according to Yole. US$7.8 billion was from APUs and FPGAs and $12.2 billion was from MCUs. The ADAS and infotainment processors market was worth US$7.8 billion in 2023 and is predicted to grow to $16.4 billion by 2029 at a 13% CAGR. The market for ADAS sensing is expected to grow at a 7% CAGR.

Security

The CHERI Alliance was established to drive adoption of memory safety and scalable software compartmentalization via the security technology CHERI, or Capability Hardware Enhanced RISC Instructions. Founding members include Capabilities Limited, Codasip, the FreeBSD Foundation, lowRISC, SCI Semiconductor, and the University of Cambridge.

In security research:

• Japan and China researchers explored a NAND-XOR ring oscillator structure to design an entropy source architecture for a true random number generator (TRNG).
• University of Toronto and Carleton University researchers presented a survey examining how hardware is applied to achieve security and how reported attacks have exploited certain defects in hardware.
• University of North Texas and Texas Woman’s University researchers explored the potential of hardware security primitive Physical Unclonable Functions (PUF) for mitigation of visual deepfakes.
• Villanova University researchers proposed the Boolean DERIVativE attack, which generalizes Boolean domain leakage.

Post-quantum cryptography firm PQShield raised $37 million in Series B funding.

Former OpenAI executive, Ilya Sutskever, who quit over safety concerns, launched Safe Superintelligence Inc. (SSI).

EU industry groups warned the European Commission that its proposed cybersecurity certification scheme (EUCS) for cloud services should not discriminate against Amazon, Google, and Microsoft, reported Reuters.

Cyber Europe tested EU cyber preparedness in the energy sector by simulating a series of large-scale cyber incidents in an exercise organized by the European Union Agency for Cybersecurity (ENISA).

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Education and Training

New York non-profit NY CREATES and South Korea’s National Nano Fab Center partnered to develop a hub for joint research, aligned technology services, testbed support, and an engineer exchange program to bolster chips-centered R&D, workforce development, and each nation’s high-tech ecosystem.

New York and the Netherlands agreed on a partnership to promote sustainability within the semiconductor industry, enhance workforce development, and boost semiconductor R&D.

Rapidus is set to send 200 engineers to AI chip developer Tenstorrent in the U.S. for training over the next five years, reports Nikkei. This initiative, led by Japan’s Leading-edge Semiconductor Technology Center (LSTC), aims to bolster Japan’s AI chip industry.

Product News

UMC announced its 22nm embedded high voltage (eHV) technology platform for premium smartphone and mobile device displays. The 22eHV platform reduces core device power consumption by up to 30% compared to previous 28nm processes. Die area is reduced by 10% with the industry’s smallest SRAM bit cells.​

Alphawave Semi announced a new 9.2 Gbps HBM3E sub-system silicon platform capable of 1.2 terabytes per second. Based on the HBM3E IP, the sub-system is aimed at addressing the demand for ultra-high-speed connectivity in high-performance compute applications.

Movellus introduced the Aeonic Power product family for on-die voltage regulation, targeting the challenging area of power delivery.

Cadence partnered with Semiwise and sureCore to develop new cryogenic CMOS circuits with possible quantum computing applications. The circuits are based on modified transistors found in the Cadence Spectre Simulation Platform and are capable of processing analog, mixed-signal, and digital circuit simulation and verification at cryogenic temperatures.

Renesas launched R-Car Open Access (RoX), an integrated development platform for software-defined vehicles (SDVs), designed for Renesas R-Car SoCs and MCUs with tools for deployment of AI applications, reducing complexity and saving time and money for car OEMs and Tier 1s.

Infineon released industry-first radiation-hardened 1 and 2 Mb parallel interface ferroelectric-RAM (F-RAM) nonvolatile memory devices, with up to 120 years of data retention at 85-degree Celsius, along with random access and full memory write at bus speeds. Plus, a CoolGaN Transistor 700 V G4 product family for efficient power conversion up to 700 V, ideal for consumer chargers and notebook adapters, data center power supplies, renewable energy inverters, and more.

Ansys adopted NVIDIA’s Omniverse application programming interfaces for its multi-die chip designers. Those APIs will be used for 5G/6G, IoT, AI/ML, cloud computing, and autonomous vehicle applications. The company also announced ConceptEV, an SaaS solution for automotive concept design for EVs.

Fig. 1: Field visualization of 3D-IC with Omniverse. Source: Ansys

QP Technologies announced a new dicing saw for its manufacturing line that can process a full cassette of 300mm wafers 7% faster than existing tools, improving throughput and productivity.

NXP introduced its SAF9xxx of audio DSPs to support the demand for AI-based audio in software-defined vehicles (SDVs) by using Cadence’s Tensilica HiFi 5 DSPs combined with dedicated neural-network engines and hardware-based accelerators.

Avionyx, a provider of software lifecycle engineering in the aerospace and safety-critical systems sector, partnered with Siemens and will leverage its Polarion application lifecycle management (ALM) tool. Also, Dovetail Electric Aviation adopted Siemens Xcelerator to support sustainable aviation.

Research

Researchers from imec and KU Leuven released a +70 page paper “Selecting Alternative Metals for Advanced Interconnects,” addressing interconnect resistance and reliability.

A comprehensive review article — “Future of plasma etching for microelectronics: Challenges and opportunities” — was created by a team of experts from the University of Maryland, Lam Research, IBM, Intel, and many others.

Researchers from the Institut Polytechnique de Paris’s Laboratory of Condensed Matter for Physics developed an approach to investigate defects in semiconductors. The team “determined the spin-dependent electronic structure linked to defects in the arrangement of semiconductor atoms,” the first time this structure has been measured, according to a release.

Lawrence Berkeley National Laboratory-led researchers developed a small enclosed chamber that can hold all the components of an electrochemical reaction, which can be paired with transmission electron microscopy (TEM) to generate precise views of a reaction at atomic scale, and can be frozen to stop the reaction at specific time points. They used the technique to study a copper catalyst.

The Federal Drug Administration (FDA) approved a clinical trial to test a device with 1,024 nanoscale sensors that records brain activity during surgery, developed by engineers at the University of California San Diego (UC San Diego).

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Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology.

Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out of China, Out of Taiwan,” according to TrendForce.

Alphawave joined forces with Arm to develop an advanced chiplet based on Arm’s Neoverse Compute Subystems for AI/ML. The chiplet contains the Neoverse N3 CPU core cluster and Arm Coherent Mesh Network, and will be targeted at HPC in data centers, AI/ML applications, and 5G/6G infrastructure.

ElevATE Semiconductor and GlobalFoundries will partner for high-voltage chips to be produced at GF’s facility in Essex Junction, Vermont, which GF bought from IBM. The chips are essential for semiconductor testing equipment, aerospace, and defense systems.

NVIDIA, OpenAI, and Microsoft are under investigation by the U.S. Federal Trade Commission and Justice Department for violation of antitrust laws in the generative AI industry, according to the New York Times.

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Apollo Global Management will invest $11 billion in Intel’s Fab 34 in Ireland, thereby acquiring a 49% stake in Intel’s Irish manufacturing operations.

imec and ASML opened their jointly run High-NA EUV Lithography Lab in Veldhoven, the Netherlands. The lab will be used to prepare  the next-generation litho for high-volume manufacturing, expected to begin in 2025 or 2026.

Expedera opened a new semiconductor IP design center in India. The location, the sixth of its kind for the company, is aimed at helping to make up for a shortfall in trained technicians, researchers, and engineers in the semiconductor sector.

Foxconn will build an advanced computing center in Taiwan with NVIDIA’s Blackwell platform at its core. The site will feature GB200 servers, which consist of 64 racks and 4,608 GPUs, and will be completed by 2026.

Intel and its 14 partner companies in Japan will use Sharp‘s LCD plants to research semiconductor production technology, a cost reduction move that should also produce income for Sharp, according to Nikkei Asia.

Japan is considering legislation to support the commercial production of advanced semiconductors, per Reuters.

Saudi Arabia aims to establish at least 50 semiconductor design companies as part of a new National Semiconductor Hub, funded with over $266 million.

Air Liquide is opening a new industrial gas production facility in Idaho, which will produce ultra-pure nitrogen and other gases for Micron’s new fab.

Microsoft will invest 33.7 billion Swedish crowns ($3.2 billion) to expand its cloud and AI infrastructure in Sweden over a two-year period, reports Bloomberg. The company also will invest $1 billion to establish a new data center in northwest Indiana.

AI data centers could consume as much as 9.1% of the electricity generated in the U.S. by 2030, according to a white paper published by the Electric Power Research Institute. That would more than double the electricity currently consumed by data centers, though EPRI notes this is a worst case scenario and advances in efficiency could be a mitigating factor.

Markets and Money

The Semiconductor Industry Association (SIA) announced global semiconductor sales increased 15.8% year-over-year in April, and the group projected a market growth of 16% in 2024. Conversely, global semiconductor equipment billings contracted 2% year-over-year to US$26.4 billion in Q1 2024, while quarter-over-quarter billings dropped 6% during the same period, according to SEMI‘s Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

Cadence completed its acquisition of BETA CAE Systems International, a provider of multi-domain, engineering simulation solutions.

Cisco‘s investment arm launched a $1 billion fund to aid AI startups as part of its AI innovation strategy. Nearly $200 million has already been earmarked.

The power and RF GaN markets will grow beyond US$2.45 billion and US$1.9 billion in 2029, respectively, according to Yole, which is offering a webinar on the topic.

The micro LED chip market is predicted to reach $580 million by 2028, driven by head-mounted devices and automotive applications, according to TrendForce. The cost of Micro LED chips may eventually come down due to size miniaturization.

In-Depth

Semiconductor Engineering published its Automotive, Security, and Pervasive Computing newsletter this week, featuring these top stories:

• The Uncertainty Of Certifying AI For Automotive
• Why It’s So Hard To Secure AI Chips
• Toward A Software-Defined Hardware World

More reporting this week:

• Chip Design Digs Deeper Into AI
• Why IC Design Safety Nets Have Limits
• Opportunities Grow For GPU Acceleration

Security

Scott Best, Rambus senior director of Silicon Security Products, delivered a keynote at the Hardwear.io conference this week (below), detailing a $60 billion reverse engineering threat for hardware in just three markets — $30 billion for printer consumables, $20 billion for rechargeable batteries with some type of authentication, and $10 billion for medical devices such as sonogram probes.

Photo source: Ed Sperling/Semiconductor Engineering

wolfSSL debuted wolfHSM for automotive hardware security modules, with its cryptographic library ported to run in automotive HSMs like Infineon’s Aurix Tricore TC3XX.

Cisco integrated AMD Pensando data processing units (DPUs) with its Hypershield security architecture for defending AI-scale data centers.

OMNIVISION released an intelligent CMOS image sensor for human presence detection, infrared facial authentication, and always-on technology with a single sensing camera. And two new image sensors for industrial and consumer security surveillance cameras.

Digital Catapult announced a new cohort of companies will join Digital Security by Design’s Technology Access Program, gaining access to an Arm Morello prototype evaluation hardware kit based on Capability Hardware Enhanced RISC Instructions (CHERI), to find applications across critical UK sectors.

University of Southampton researchers used formal verification to evaluate the hardware reliability of a RISC-V ibex core in the presence of soft errors.

Several institutions published their students’ master’s and PhD work:

• Virginia Tech published a dissertation proposing sPACtre, a defense mechanism that aims to prevent Spectre control-flow attacks on existing hardware.
• Wright State University published a thesis proposing an approach that uses various machine learning models to bring an improvement in hardware Trojan identification with power signal side channel analysis
• Wright State University published a thesis examining the effect of aging on the reliability of SRAM PUFs used for secure and trusted microelectronics IC applications.
• Nanyang Technological University published a Final Year Project proposing a novel SAT-based circuit preprocessing attack based on the concept of logic cones to enhance the efficacy of SAT attacks on complex circuits like multipliers.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Education and Training

Renesas and the Indian Institute of Technology Hyderabad (IIT Hyderabad) signed a three-year MoU to collaborate on VLSI and embedded semiconductor systems, with a focus on R&D and academic interactions to advance the “Make in India” strategy.

Charlie Parker, senior machine learning engineer at Tignis, presented a talk on “Why Every Fab Should Be Using AI.”

Penn State and the National Sun Yat-Sen University (NSYSU) in Taiwan partnered to develop educational and research programs focused on semiconductors and photonics.

Rapidus and Hokkaido University partnered on education and research to enhance Japan’s scientific and technological capabilities and develop human resources for the semiconductor industry.

The University of Minnesota named Steve Koester its first “Chief Semiconductor Officer,” and launched a website devoted to semiconductor and microelectronics research and education.

The state of Michigan invested $10 million toward semiconductor workforce development.

Product News

Siemens reported breakthroughs in high-level C++ verification that will be used in conjunction with its Catapult software. Designers will be able to use formal property checking via the Catapult Formal Assert software and reachability coverage analysis through Catapult Formal CoverCheck.

Infineon released several products:

• 600 V CoolMOS 8 high voltage superjunction (SJ) MOSFET product family.
• CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense device.
• New CoolSiC MOSFET discretes 650 V, with two product families housed in the Thin-TOLL 8×8 and TOLT packages to increase system power density.

Augmental, an MIT Media Lab spinoff, released a tongue-based computer controller, dubbed the MouthPad.

NVIDIA revealed a new line of products that will form the basis of next-gen AI data centers. Along with partners ASRock Rack, ASUS, GIGABYTE, Ingrasys, and others, the NVIDIA GPUs and networking tech will offer cloud, on-premises, embedded, and edge AI systems. NVIDIA founder and CEO Jensen Huang showed off the company’s upcoming Rubin platform, which will succeed its current Blackwell platform. The new system will feature new GPUs, an Arm-based CPU and advanced networking with NVLink 6, CX9 SuperNIC and X1600 converged InfiniBand/Ethernet switch.

Intel showed off its Xeon 6 processors at Computex 2024. The company also unveiled architectural details for its Lunar Lake client computing processor, which will use 40% less SoC power, as well as a new NPU, and X2 graphic processing unit cores for gaming.

Research

imec released a roadmap for superconducting digital technology to revolutionize AI/ML.

CEA-Leti reported breakthroughs in three projects it considers key to the next generation of CMOS image sensors. The projects involved embedding AI in the CIS and stacking multiple dies to create 3D architectures.

Researchers from MIT’s Computer Science & Artificial Intelligence Laboratory (MIT-CSAIL) used a type of generative AI, known as diffusion models, to train multi-purpose robots, and designed the Grasping Neural Process for more intelligent robotic grasping.

IBM and Pasqal partnered to develop a common approach to quantum-centric supercomputing and to promote application research in chemistry and materials science.

Stanford University and Q-NEXT researchers investigated diamond to find the source of its temperamental nature when it comes to emitting quantum signals.

TU Wien researchers investigated how AI categorizes images.

In Canada:

• Simon Fraser University received funding of over $80 million from various sources to upgrade the supercomputing facility at the Cedar National Host Site.
• The Digital Research Alliance of Canada announced $10.28 million to renew the University of Victoria’s Arbutus cloud infrastructure.
• The Canadian government invested $18.4 million in quantum research at the University of Waterloo.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it’s not possible to choose the best chiplet for a particular application or workload. The guidelines are a prerequisite for a multi-vendor chiplet marketplace.

AMD, Broadcom, Cisco, Google, HPE, Intel, Meta, and Microsoft proposed a new high-speed, low-latency interconnect specification, Ultra Accelerator Link (UALink), between accelerators and switches in AI computing pods. The 1.0 specification will enable the connection of up to 1,024 accelerators within a pod and allow for direct loads and stores between the memory attached to accelerators.

Arm debuted a range of new CPUs, including the Cortex-X925 for on-device generative AI, and the Cortex-A725 with improved efficiency for AI and mobile gaming. It also announced the Immortalis-G925 GPU for flagship smartphones, and the Mali-G725/625 GPUs for consumer devices. Additionally, Arm announced Compute Subsystems (CSS) for Client to provide foundational computing elements for AI smartphone and PC SoCs, and it introduced KleidiAI, a set of compute kernels for developers of AI frameworks. The Armv9-A architecture also added support for the Scalable Matrix Extension to accelerate AI workloads.

TSMC said its 2nm process is on target to begin mass production in 2025. Meanwhile, Samsung is expected to release its 1nm plan next month, targeting mass production for 2026 — a year ahead of schedule, reports Business Korea.

CHIPs for America and NATCAST released a 2024 roadmap for the U.S. National Semiconductor Technology Center (NSTC), identifying priorities for facilities, research, workforce development, and membership.

China is investing CNY 344 billion (~$47.5 billion) into the third phase of its National Integrated Circuit Industry Investment Fund, also known as the Big Fund, to support its semiconductor sector and supply chain, according to numerous reports.

Malaysia plans to invest $5.3 billion in seed capital and support for semiconductor manufacturing in an effort to attract more than $100 billion in foreign investments, reports Reuters. Prime Minister Anwar Ibrahim announced the effort to create at least 10 companies focused on IC design, advanced packaging, and equipment manufacturing.

imec demonstrated a die-to-wafer hybrid bonding flow for Cu-Cu and SiCN-SiCN at pitches down to 2µm at the IEEE’s ECTC conference. This breakthrough could enable die and wafer-level optical interconnects.

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of challenges that will take years to fully resolve.

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In-Depth

Semiconductor Engineering published its Systems & Design newsletter featuring these top stories:

• RISC-V Heralds New Era Of Cooperation
• AI For Data Management
• Trouble Ahead For IC Verification

Global

STMicroelectronics is building a fully integrated SiC facility in Catania, Italy.  The high-volume 200mm facility is projected to cost over $5 billion.

Siliconware Precision Industries Co. Ltd.(SPIL) broke ground on an RM 6 billion (~$1.3 billion) advanced packaging and testing facility in Malaysia. Also, Google will invest $2 billion in Malaysia for its first data center, and a Google Cloud hub to meet growing demand for cloud services and AI literacy programs, reports AP.

In an SEC filing, Applied Materials received additional subpoenas from the U.S. Department of Commerce’s (DoC) Bureau of Industry and Security related to shipments of advanced semiconductor equipment to China. This comes on the heels of similar subpoenas issued last year.

A Chinese contractor working for SK hynix was arrested in South Korea and is being charged with funneling more than 3,000 copies of a paper on solving process failure issues to Huawei, reports South Korea’s Union News.

VSORA, CEA-Grenoble, and Valeo were awarded $7 million from the French government to build low-latency, low-power AI inference co-processors for autonomous driving and other applications.

In the U.S., the National Highway Traffic Safety Administration (NHTSA) is investigating unexpected driving behaviors of vehicles equipped with Waymo‘s 5th Generation automated driving system (ADS), with details of nine new incidents on top of the first 22.

Product News

ASE introduced powerSIP, a power delivery platform designed to reduce signal and transmission loss while addressing current density challenges.

Infineon announced a roadmap for energy-efficient power supply units based on Si, SiC, and GaN to address the energy needs of AI data centers, featuring new 8 kW and 12 kW PSUs, in addition to the 3 kW and 3.3 kW units available today. The company also released its CoolSiC MOSFET 400 V family, specially developed for use in the AC/DC stage of AI servers, complementing the PSU roadmap.

Fig. 1: Infineon’s 8kW PSU. Source: Infineon

Infineon also introduced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN TM devices, enabling customers to use GaN in voltage classes from 40 V to 700 V. The devices are built using Infineon’s 8-inch foundry processes.

Ansys launched Ansys Access on Microsoft Azure to provide pre-configured simulation products optimized for HPC on Azure infrastructure.

Foxconn Industrial Internet used Keysight Technology’s Open RAN Studio solution to certify an outdoor Open Radio Unit (O-RU).

Andes Technology announced an SoC and development board for the development and porting of large RISC-V applications.

MediaTek uncorked a pair of mobile chipsets built on a 4nm process that use an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores.

The NVIDIA H200 Blackwell platform is expected to begin shipping in Q3 of 2024 and will be available to data centers by Q4, according to TrendForce.

A room-temperature direct fusion hybrid bonding system from Be Semiconductor has shipped to the NHanced advanced packaging facility in North Carolina. The new system offers faster throughput for copper interconnects with submicron pad sizes, greater accuracy and reduced warpage.

Markets and Money

Frore Systems raised $80 million for its solid-state active cooling module, which removes heat from the top of a chip without fans. The device in systems ranging from notebooks and network edge gateways to data centers.

Axus Technology received $12.5 million in capital equity funding to make its chemical mechanical planarization (CMP) equipment for semiconductor wafer polishing, thinning, and cleaning, including of silicon carbide (SiC) wafers.

Elon Musk’s xAI announced a series B funding round of $6 billion.

Micron was ordered to pay $445 million in damages to Netlist for patent infringement of the company’s DDR4 memory module technology between 2021 and 2024.

Global revenue from AI semiconductors is predicted to total $71 billion in 2024, up 33% from 2023, according to Gartner. In 2025, it is expected to jump to $91.9 billion. The value of AI accelerators used in servers is expected to total $21 billion in 2024 and reach $33 billion by 2028.

NAND flash revenue was $14.71 billion in Q1 2024, an increase of 28.1%, according to TrendForce.

The optical transceiver market dipped from $11 billion in 2022 to $10.9 billion in 2023, but it is predicted to reach $22.4 billion by 2029, driven by AI, 800G applications, and the transition to 200G/lane ecosystem technologies, reports Yole.

Yole also found that ultra-wideband technical choices and packaging types used by NXP, Apple, and Qorvo vary considerably, ranging from 7nm to 90nm, with both CMOS and finFET transistors.

The global market share of GenAI-capable smartphones increased to 6% in Q1 2024 from 1.3% in the previous quarter, reports Counterpoint. The premium segment accounted for over 70% of sales with Samsung on top and contributing 58%. Meanwhile, global foldable smartphone shipments were up 49% YoY in Q1 2024, led by Huawei, HONOR, and Motorola.

Security

The National Science Foundation awarded Worcester Polytechnic Institute researcher Shahin Tajik almost $0.6 million to develop new technologies to address hardware security vulnerabilities.

The Hyperform consortium was formed to develop European sovereignty in post-quantum cryptography, funded by the French government and EU credits. Members include IDEMIA Secure Transactions, CEA Leti, and the French cybersecurity agency (ANSSI).

In security research:

• University of California Davis and University of Arizona researchers proposed a framework leveraging generative pre-trained transformer (GPT) models to automate the obfuscation process.
• Columbia University and Intel researchers presented a secure digital low dropout regulator that integrates an attack detector and a detection-driven protection scheme to mitigate correlation power analysis.
• Pohang University of Science and Technology (POSTECH) researchers analyzed threshold switch devices and their performance in hardware security.

The U.S. Defense Advanced Research Projects Agency (DARPA) seeks proposals for its AI Quantified program to develop technology to help deploy generative AI safely and effectively across the Department of Defense (DoD) and society.

Vanderbilt University and Oak Ridge National Laboratory (ORNL) partnered to develop dependable AI for national security applications.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Research and Training

New York continues to amp up their semiconductor offerings. NY CREATES and Raytheon unveiled a semiconductor workforce training program. And Syracuse  University is hosting a free virtual course focused on the semiconductor industry this summer.

In research news:

• A team of researchers at MIT and other universities found that extreme temperatures up to 500°C did not significantly degrade GaN materials or contacts.
• University of Cambridge researchers developed adaptive and eco-friendly sensors that can be directly and imperceptibly printed onto biological surfaces, such as a finger or flower petal.
• Researchers at Rice University and Hanyang University developed an elastic material that moves like skin and can adjust its dielectric frequency to stabilize RF communications and counter disruptive frequency shifts that interfere with electronics when a substrate is twisted or stretched, with potential for stretchable wearable electronic devices.

The National Science Foundation (NSF) awarded $36 million to three projects chosen for their potential to revolutionize computing. The University of Texas at Austin-led project aims to create a next-gen open-source intelligent and adaptive OS. The Harvard University-led project targets sustainable computing. The University of Massachusetts Amherst-led project will develop computational decarbonization.

Quantum

Singapore will invest close to S$300 million (~$222 million) into its National Quantum Strategy to support the development and deployment of quantum technologies, including an initiative to design and build a quantum processor within the country.

Several quantum partnerships were announced:

• Riverlane and Alice & Bob will integrate Riverlane’s quantum error correction stack within Alice & Bob’s larger quantum computing system based on cat qubit technology.
• New York University and the University of Copenhagen will collaborate to explore the viability of hybrid superconductor-semiconductor quantum materials for the production of quantum chips and integration with CMOS processes.
• NXP, eleQtron, and ParityQC showed off a full-stack, ion-trap based quantum computer demonstrator for Germany’s DLR Quantum Computing Initiative.
• Photonic says it demonstrated distributed entanglement between quantum modules using optically-linked silicon spin qubits with a native telecom networking interface as part of a quantum internet effort with Microsoft.
• Classiq and HPE say they developed a rapid method for solving large-scale combinatorial optimization problems by combining quantum and classical HPC approaches.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here, including integrated SLM analytics solution, prototyping and validation of perception sensor systems, and improving PCB designs for performance and reliability.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used.

Intel is in advanced talks with Apollo Global Management for the equity firm to provide more than $11 billion to build a fab in Ireland, reported the Wall Street Journal. Also, Intel’s Foundry Services appointed Kevin O’Buckley as the senior vice president and general manager.

Polar is slated to receive up to $120 million in CHIPS Act funding to establish an independent American foundry in Minnesota. The company expects to invest about $525 million in the expansion of the facility over the next two years, with a $75 million investment from the State of Minnesota.

Arm plans to develop AI chips for launch next year, reports Nikkei Asia.

South Korea is planning a support package worth more than 10 trillion won ($7.3 billion) aimed at chip materials, equipment makers, and fabless companies throughout the semiconductor supply chain, according to Reuters.

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Global

Edwards opened a new facility in Asan City, South Korea. The 15,000m² factory provides a key production site for abatement systems, and integrated vacuum and abatement systems for semiconductor manufacturing.

France’s courtship with mega-tech is paying off.  Microsoft is investing more than US $4 billion to expand its cloud computing and AI infrastructure, including bringing up to 25,000 advanced GPUs to the country by the end of 2025. The “Choose France” campaign also snagged US $1.3 billion from Amazon for cloud infrastructure expansion, genAI and more.

Toyota, Nissan, and Honda are teaming up on AI and chips for next-gen cars with support from Japan’s Ministry of Economy, Trade and Industry, (METI), reports Nikkei Asia.

Meanwhile, IBM and Honda are collaborating on long-term R&D of next-gen technologies for software-defined vehicles (SDV), including chiplets, brain-inspired computing, and hardware-software co-optimization.

Siemens and Foxconn plan to collaborate on global manufacturing processes in electronics, information and communications technology, and electric vehicles (EV).

TSMC confirmed a Q424 construction start date for its first European plant in Dresden, Germany.

Amazon Web Services (AWS) plans to invest €7.8 billion (~$8.4B) in the AWS European Sovereign Cloud in Germany through 2040. The system is designed to serve public sector organizations and customers in highly regulated industries.

In-Depth

Semiconductor Engineering published its Low Power-High Performance newsletter this week, featuring these stories:

• • Will Domain-Specific ICs Become Ubiquitous?
  • Running More Efficient AI/ML Code With Neuromorphic Engines
  • Power/Performance Costs In Chip Security

And this week’s Test, Measurement & Analytics newsletter featured these stories:

• Using Predictive Maintenance To Boost IC Manufacturing Efficiency
• The Future Of Fault Coverage In Chips
• Doing More At Functional Test

Markets and Money

The U.S. National Institute of Standards and Technology (NIST) awarded more than $1.2 million to 12 businesses in 8 states under the Small Business Innovation Research (SBIR) Program to fund R&D of products relating to cybersecurity, quantum computing, health care, semiconductor manufacturing, and other critical areas.

Engineering services and consulting company Infosys completed the acquisition of InSemi Technology, a provider of semiconductor design and embedded software development services.

The quantum market, which includes quantum networking and sensors alongside computing, is predicted to grow from $838 million in 2024 to $1.8 billion in 2029, reports Yole.

Shipments of OLED monitors reached about 200,000 units in Q1 2024, a year over year growth of 121%, reports TrendForce.

Global EV sales grew 18% in Q1 2024 with plug-in hybrid electric vehicles (PHEV) sales seeing 46% YoY growth and battery electric vehicle (BEV) sales growing just 7%, according to Counterpoint. China leads global EV sales with 28% YoY growth, while the US grew just 2%. Tesla saw a 9% YoY drop, but topped BEV sales with a 19% market share. BYD grew 13% YoY and exported about 100,000 EVs with 152% YoY growth, mainly in Southeast Asia.

DeepX raised $80.5 million in Series C funding for its on-device NPU IP and AI SoCs tailored for applications including physical security, robotics, and mobility.

MetisX raised $44 million in Series A funding for its memory solutions built on Compute Express Link (CXL) for accelerating large-scale data processing applications.

Security

While security experts have been warning of a growing threat in electronics for decades, there have been several recent fundamental changes that elevate the risk.

Synopsys and the Ponemon Institute released a report showing 54% of surveyed organizations suffered a software supply chain attack in the past year and 20% were not effective in their response. And 52% said their development teams use AI tools to generate code, but only 32% have processes to evaluate it for license, security, and quality risks.

Researchers at Ruhr University Bochum and TU Darmstadt presented a solution for the automated generation of fault-resistant circuits (AGEFA) and assessed the security of examples generated by AGEFA against side-channel analysis and fault injection.

TXOne reported on operational technology security and the most effective method for preventing production interruptions caused by cyber-attacks.

CrowdStrike and NVIDIA are collaborating to accelerate the use of analytics and AI in cybersecurity to help security teams combat modern cyberattacks, including AI-powered threats.

The National Institute of Standards and Technology (NIST) finalized its guidelines for protecting sensitive data, known as controlled unclassified information, aimed at organizations that do business with the federal government.

The Defense Advanced Research Projects Agency (DARPA) awarded BAE Systems a $12 million contract to solve thermal challenges limiting electronic warfare systems, particularly in GaN transistors.

Sigma Defense won a $4.7 million contract from the U.S. Army for an AI-powered virtual training environment, partnering with Brightline Interactive on a system that uses spatial computing and augmented intelligence workflows.

SkyWater’s advanced packaging operation in Florida has been accredited as a Category 1A Trusted Supplier by the Defense Microelectronics Activity (DMEA) of the U.S. Department of Defense (DoD).

Videos of two CWE-focused sessions from CVE/FIRST VulnCon 2024 were made available on the CWE YouTube Channel.

The Cybersecurity and Infrastructure Security Agency (CISA) issued a number of alerts/advisories.

Supercomputing

Supercomputers are battling for top dog.

The Frontier supercomputer at Oak Ridge National Laboratory (ORNL) retained the top spot on the Top500 list of the world’s fastest systems with an HPL score of 1.206 EFlop/s. The as-yet incomplete Aurora system at Argonne took second place, becoming the world’s second exascale system at 1.012 EFlop/s. The Green500 list, which tracks energy efficiency of compute, saw three new entrants take the top places.

Cerebras Systems, Sandia National Laboratory, Lawrence Livermore National Laboratory, and Los Alamos National Laboratory used Cerebras’ second generation Wafer Scale Engine to perform atomic scale molecular dynamics simulations at the millisecond scale, which they claim is 179X faster than the Frontier supercomputer.

UT Austin‘s Stampede3 Supercomputer is now in full production, serving the open science community through 2029.

Education and Training

SEMI announced the SEMI University Semiconductor Certification Programs to help alleviate the workforce skills gap. Its first two online courses are designed for new talent seeking careers in the industry, and experienced workers looking to keep their skills current.  Also, SEMI and other partners launched a European Chip Skills Academy Summer School in Italy.

Siemens created an industry credential program for engineering students that supplements a formal degree by validating industry knowledge and skills. Nonprofit agency ABET will provide accreditation. The first two courses are live at the University of Colorado Boulder (CU Boulder) and a series is planned with Pennsylvania State University (Penn State).

Syracuse University launched a $20 million Center for Advanced Semiconductor Manufacturing, with co-funding from Onondaga County.

Starting young is a good thing.  An Arizona school district, along with the University Of Arizona,  is creating a semiconductor program for high schoolers.

Product News

Siemens and Sony partnered to enable immersive engineering via a spatial content creation system, NX Immersive Designer, which includes Sony’s XR head-mounted display. The integration of hardware and software gives designers and engineers natural ways to interact with a digital twin. Siemens also extended its Xcelerator as a Service portfolio with solutions for product engineering and lifecycle management, cloud-based high-performance simulation, and manufacturing operations management. It will be available on Microsoft Azure, as well.

Advantest announced the newest addition to its portfolio of power supplies for the V93000 EXA Scale SoC test platform. The DC Scale XHC32 power supply offers 32 channels with single-instrument total current of up to 640A.

Fig. 1: Advantest’s DC Scale XHC32. Source: Advantest

Infineon released its XENSIV TLE49SR angle sensors, which can withstand stray magnetic fields of up to 8 mT, ideal for applications of safety-critical automotive chassis systems.

Google debuted its sixth generation Cloud TPU, 4.7X faster and 67% more energy-efficient than the previous generation, with double the high-bandwidth memory.

X-Silicon uncorked a RISC-V vector CPU, coupled with a Vulkan-enabled GPU ISA and AI/ML acceleration in a single processor core, aimed at embedded and IoT applications.

IBM expanded its Qiskit quantum software stack, including the stable release of its SDK for building, optimizing, and visualizing quantum circuits.

Northeastern University announced the general availability of testing and integration solutions for Open RAN through the Open6G Open Testing and Integration Center (Open 6G OTIC).

Research

The University of Glasgow received £3 million (~$3.8M) from the Engineering and Physical Sciences Research Council (EPSRC)’s Strategic Equipment Grant scheme to help establish “Analogue,” an Automated Nano Analysing, Characterisation and Additive Packaging Suite to research silicon chip integration and packaging.

EPFL researchers developed scalable photonic ICs, based on lithium tantalate.

DISCO developed a way to increase the diameter of diamond wafers that uses the KABRA process, a laser ingot slicing method.

CEA-Leti developed two complementary approaches for high performance photon detectors — a mercury cadmium telluride-based avalanche photodetector and a superconducting single photon detector.

Toshiba demonstrated storage capacities of over 30TB with two next-gen large capacity recording technologies for hard disk drives (HDDs): Heat Assisted Magnetic Recording (HAMR) and Microwave Assisted Magnetic Recording (MAMR).

Caltech neuroscientists reported that their brain-machine interface (BMI) worked successfully in a second human patient, following 2022’s first instance, proving the device is not dependent on one particular brain or one location in a brain.

Linköping University researchers developed a cheap, sustainable battery made from zinc and lignin, while ORNL researchers developed carbon-capture batteries.

Events and Further Reading

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Semiconductor Engineering’s latest newsletters:

Automotive, Security and Pervasive Computing
Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry’s gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea.

UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC process for chips used in smartphones and other 5G/6G mobile devices. The process uses wafer-to-wafer bonding technology to address radio frequency interference between stacked dies and reduces die size by 45%.

Fig. 1: UMC’s 3D IC solution for RFSOI technology. Source: UMC

The first programmable chip capable of shaping, splitting, and steering beams of light is now being produced by Skywater Technology and Lumotive. The technology is critical for advancing lidar-based systems used in robotics, automotive, and other 3D sensing applications.

Driven by demand for AI chips, SK hynix revealed it has already booked its entire production of high-bandwidth memory chips for 2024 and is nearly sold out of its production capacity for 2025, reported the Korea Times, while SEMI reported that silicon wafer shipments declined in Q1 2024, quarter over quarter, a 13% drop, attributed to continued weakness in IC fab utilization and inventory adjustments.

PCI-SIG published the CopprLink Internal and External Cable specifications to provide PCIe 5.0 and 6.0 signaling at 32 and 64 GT/s and leverage standard connector form factors for applications including storage, data centers, AI/ML, and disaggregated memory.

The U.S. Department of Commerce (DoC) launched the CHIPS Women in Construction Framework to boost the participation of women and economically disadvantaged people in the workforce, aiming to support on-time and successful completion of CHIPS Act-funded projects. Intel and Micron adopted the framework.

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Markets and Money

The SiC wafer processing equipment market is growing rapidly, reports Yole. SiC devices will exceed $10B by 2029 at a CAGR of 25%, and the SiC manufacturing tool market is projected to reach $5B by 2026.

imec.xpand launched a €300 million (~$321 million) fund that will invest in semiconductor and nanotechnology startups with the potential to push semiconductor innovation beyond traditional applications and drive next-gen technologies.

Blaize raised $106 million for its programmable graph streaming processor architecture suite and low-code/no-code software platform for edge AI.

Guerrilla RF completed the acquisition of Gallium Semiconductor‘s portfolio of GaN power amplifiers and front-end modules.

About 90% of connected cars sold in 2030 will have embedded 5G capability, reported Counterpoint. Also, about 75% of laptop PCs sold in 2027 will be AI laptop PCs with advanced generative AI, and the global high-level OS (HLOS) or advanced smartwatch market is predicted to grow 15% in 2024.

Global

Powerchip Semiconductor opened a new 300mm facility in northwestern Taiwan targeting the production of AI semiconductors. The facility is expected to produce 50,000 wafers per month at 55, 40, and 28nm nodes.

Taiwan-based KYEC Semiconductor will withdraw its China operations by the third quarter due to increasing geopolitical tensions, reports the South China Morning Post.

Japan will expand its semiconductor export restrictions to China related to four technologies: Scanning electron microscopes, CMOS, FD-SOI, and the outputs of quantum computers, according to TrendForce.

IBM will invest CAD$187 million (~US$137M in Canada’s semiconductor industry, with the bulk of the investment focused on advanced assembly, testing, and packaging operations.

Microsoft will invest US$2.2 billion over the next four years to build Malaysia’s digital infrastructure, create AI skilling opportunities, establish an AI Center of Excellence, and enhance cybersecurity.

In-Depth

New stories and tech talks published by Semiconductor Engineering this week:

• Multi-Die Design Pushes Complexity To The Max
• Design Considerations In Photonics
• Overlay Optimization In Advanced IC Substrates
• Fundamental Issues In Computer Vision Still Unresolved
• Sensor Fusion Challenges In Automotive

Security

Infineon collaborated with ETAS to integrate the ESCRYPT CycurHSM 3.x automotive security software stack into its next-gen AURIX MCUs to optimize security, performance, and functionality.

Synopsys released Polaris Assist, an AI-powered application security assistant on its Polaris Software Integrity Platform, combining LLM technology with application security knowledge and intelligence.

In security research:

• UT Dallas, Intel, NXP, and TI published a framework for early anomaly detection in AMS components of automotive SoCs.
• The University of Central Florida said that LLMs can be harnessed to automatically rectify security-relevant vulnerabilities inherent in hardware designs within the semiconductor context.
• Western University leveraged hardware security modules for enhanced intra-domain security.
• A team in India proposed a post-quantum secure PUF-based cross-domain authentication mechanism for Internet of Drones.

U.S. President Biden signed a National Security Memorandum to enhance the resilience of critical infrastructure, and the White House announced key actions taken since Biden’s AI Executive Order, including measures to mitigate risk.

CISA and partners published a fact sheet on pro-Russia hacktivists who seek to compromise industrial control systems and small-scale operational technology systems in North American and European critical infrastructure sectors. CISA issued other alerts including two Microsoft vulnerabilities.

Education and Training

The U.S. National Institute for Innovation and Technology (NIIT) and the Department of Labor (DoL) partnered to celebrate the inaugural Youth Apprenticeship Week on May 5 to 11, highlighting opportunities in critical industries such as semiconductors and advanced manufacturing.

SUNY Poly received an additional $4 million from New York State for its Semiconductor Processing to Packaging Research, Education, and Training Center.

The University of Pennsylvania launched an online Master of Science in Engineering in AI degree.

The American University of Armenia celebrated its 10-year collaboration with Siemens, which provides AUA’s Engineering Research Center with annual research grants.

Product News

Renesas and SEGGER Embedded Studio launched integrated code generator support for its 32-bit RISC-V MCU. 

Rambus introduced a family of DDR5 server Power Management ICs (PMICs), including an extreme current device for high-performance applications.

Fig. 2: Rambus’ server PMIC on DDR5 RDIMM. Source: Rambus

Keysight added capabilities to Inspector, part of the company’s recently acquired device security research and test lab Riscure, that are designed to test the robustness of post-quantum cryptography (PQC) and help device and chip vendors identify and fix hardware vulnerabilities. Keysight also validated new conformance test cases for narrowband IoT non-terrestrial networks standards.

Ansys’ RedHawk-SC and Totem power integrity platforms were certified for TSMC‘s N2 nanosheet-based process technology, while its RaptorX solution for on-chip electromagnetic modeling was certified for TSMC’s N5 process.

Netherlands-based athleisure brand PREMIUM INC selected CLEVR to implement Siemens’ Mendix Digital Lifecycle Management for Fashion & Retail solution.

Micron will begin shipping high-capacity DRAM for AI data centers.

Microchip uncorked radiation-tolerant SoC FPGAs for space applications that uses a real-time Linux-capable RISC-V-based microprocessor subsystem.

Quantum

University of Chicago researchers developed a system to boost the efficiency of quantum error correction using a framework based on quantum low-density party-check (qLDPC) codes and new hardware involving reconfigurable atom arrays.

PsiQuantum will receive AUD $940 million (~$620 million) in equity, grants, and loans from the Australian and Queensland governments to deploy a utility-scale quantum computer in the regime of 1 million physical qubits in Brisbane, Australia.

Japan-based RIKEN will co-locate IBM’s Quantum System Two with its Fugaku supercomputer for integrated quantum-classical workflows in a heterogeneous quantum-HPC hybrid computing environment. Fugaku is currently one of the world’s most powerful supercomputers.

QuEra Computing was awarded a ¥6.5 billion (~$41 million) contract by Japan’s National Institute of Advanced Industrial Science and Technology (AIST) to deliver a gate-based neutral-atom quantum computer alongside AIST’s ABCI-Q supercomputer as part of a quantum-classical computing platform.

Novo Holdings, the controlling stakeholder of pharmaceutical company Novo Nordisk, plans to boost the quantum technology startup ecosystem in Denmark with DKK 1.4 billion (~$201 million) in investments.

The University of Sydney received AUD $18.4 million (~$12 million) from the Australian government to help grow the quantum industry and ecosystem.

The European Commission plans to spend €112 million (~$120 million) to support AI and quantum research and innovation.

Research

Intel researchers developed a 300-millimeter cryogenic probing process to collect high-volume data on the performance of silicon spin qubit devices across whole wafers using CMOS manufacturing techniques.

EPFL researchers used a form of ML called deep reinforcement learning (DRL) to train a four-legged robot to avoid falls by switching between walking, trotting, and pronking.=

The University of Cambridge researchers developed tiny, flexible nerve cuff devices that can wrap around individual nerve fibers without damaging them, useful to treat a range of neurological disorders.

Argonne National Laboratory and Toyota are exploring a direct recycling approach that carefully extracts components from spent batteries. Argonne is also working with Talon Metals on a process that could increase the number of EV batteries produced from mined nickel ore.

Events

Find upcoming chip industry events here, including:

Upcoming webinars are here.

Further Reading

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Over the last couple of years, Samsung has lowered the usage of Exynos chipsets in its phones and tablets. Take the Galaxy S23 series for example. The company used only the Snapdragon 8 Gen 2 chipset for the lineup. The brand is also not using Exynos SoCs in mid-range and low-end devices as much as it used to a few years ago.

While it is clear that the usage of Exynos chipsets is going down, we didn’t have any figures on the trend. Fortunately, that’s changing today. Canalys has just posted a report analyzing the global smartphone market by processor vendor, and it reveals some disappointing news about Exynos chipsets and Samsung Semiconductor.

According to the report, the shipment of smartphones with chipsets from Samsung Semiconductors was 13 million in Q4 2023, which is 48% less compared to that in Q4 2022. As a result, the company’s revenue from smartphone chipsets stood at USD 5 billion in the last quarter, which is 44% lower than what it was in Q4 2022.

Unlike the Galaxy S23 series, Samsung has used Exynos chipset for the Galaxy S24 lineup. So, the shipment of smartphones with Exynos chipsets should go up in this and the upcoming quarters, and with that the revenue of Samsung Semiconductors should also see a steep increase. It would be interesting to see future figures.

The report from Canalys also reveals that MediaTek processors powered the highest number of smartphones (117 million) in Q4 2023. Apple was the second-largest chipset provider with its SoCs powering 78 million smartphones and Qualcomm was the third-largest chipset supplier with its processors powering 69 million smartphones.

The post Usage of Exynos processors has gone down drastically appeared first on SamMobile.

The government of India has approved a major investment in semiconductor and electronics production that will include the country’s first state-of-the-art semiconductor fab. It announced that three plants—one semiconductor fab and two packaging and test facilities—will break ground within 100 days. The government has approved 1.26 trillion Indian rupees (US $15.2 billion) for the projects.

India’s is the latest in a string of efforts to boost domestic chip manufacturing in the hope of making nations and regions more independent in what’s seen as a strategically critical industry. “On one end India has a large and growing domestic demand and on the other end global customers are looking at India for supply-chain resilience,” Frank Hong, chairman of Taiwan-based foundry Powerchip Semiconductor (PSMC), a partner in the new fab, said in a press release. “There could not have been a better time for India to make its entry into the semiconductor manufacturing industry.”

The country’s first fab will be an $11 billion joint venture between PSMC and Tata Electronics, a branch of the $370 billion Indian conglomerate. Through the partnership, it will be capable of 28-, 40-, 55-, and 110-nanometer chip production, with a capacity of 50,000 wafers per month. Far from the cutting edge, these technology nodes nevertheless are used in the bulk of chipmaking, with 28 nm being the most advanced node using planar CMOS transistors instead of the more advanced FinFET devices.

“The announcement is clear progress toward creating a semiconductor manufacturing presence in India,” says Rakesh Kumar, a professor of electrical and computer engineering at University of Illinois Urbana-Champaign and author of Reluctant Technophiles: India’s Complicated Relationship with Technology. “The choice of 28-nm, 40-nm, 55-nm, 90-nm, and 110-nm also seems sensible, since it limits the cost to the government and the players, who are taking a clear risk.”

According to Tata, the fab will make chips for applications such as power management, display drivers, microcontrollers, as well as and high-performance computing logic. Both the fab’s technological capability and target applications point toward products that were at the heart of the pandemic-era chip shortage.

The fab is in a new industrial zone in Dholera, in Gujarat, Prime Minister Narendra Modhi’s home state. Tata projects it will directly or indirectly lead to more than 20,000 skilled jobs in the region.

Chip Packaging Push

In addition to the chip fab, the government approved investments in two assembly, test, and packaging facilities, a sector of the semiconductor industry currently concentrated in Southeast Asia.

Tata Electronics will build a $3.25 billion plant at Jagiroad, in the eastern state of Assam. The company says it will offer a range of packaging technologies: wire bond and flip-chip, as well as system-in-package. It plans to expand into advanced packaging tech “in the future.” Advanced packaging, such as 3D integration, has emerged as a critical technology as the traditional transistor scaling of Moore’s Law has slowed and become increasingly expensive. Tata plans to start production at Jagiroad in 2025, and it predicts the plant will add 27,000 direct and indirect jobs to the local economy.

A joint venture between Japanese microcontroller giant Renesas, Thai chip packaging company Stars Microelectronics, and India’s CG Power and Industrial Solutions will build a $900 million packaging plant in Sanand, Gujarat. The plant will offer wire-bond and flip-chip technologies. CG, which will own 92 percent of the venture, is a Mumbai-based appliances and industrial motors and electronics firm.

There’s already a chip-packaging plant in the works in Sanand from a previous agreement. U.S.-based memory and storage maker Micron agreed last June to build a packaging and test facility there. Micron plans to spend $825 million in two phases on the plant. Gujarat and the Indian federal government is set to cover a further $1.925 billion. Micron expects the first phase to be operational by the end of 2024.

Generous Incentives

After an initial overture failed to attract chip companies, the government upped its ante. According to Stephen Ezzell at the Washington, D.C.–based policy-research organization the Information Technology and Innovation Foundation (IT&IF), India’s semiconductor incentives are now among the most attractive in the world.

In a report issued two weeks before the India fab announcement, Ezzell explained that for an approved silicon fab worth at least $2.5 billion and making 40,000 wafer starts per month the federal government will reimburse 50 percent of the fab cost with a state partner expected to add 20 percent. For a chip fab making smaller-volume products, such as sensors, silicon photonics, or compound semiconductors, the same formula holds, except that the minimum investment is $13 million. For a test and packaging facility, it’s just $6.5 million.

India is a rapidly growing consumer of semiconductors. Its market was worth $22 billion in 2019 and is expected to nearly triple to $64 billion by 2026, according to Counterpoint Technology Market Research. The country’s minister of state for IT and electronics, Rajeev Chandrasekhar projects further growth to $110 billion by 2030. At that point, it would account for 10 percent of global consumption, according to the IT&IF report.

About 20 percent of the world’s semiconductor design engineers are in India, according to the IT&IF report. And between March 2019 and 2023 semiconductor job openings in the country increased 7 percent. The hope is that the investment will be a draw for new engineering students.

By Adam Kovac, Karen Heyman, and Liz Allan.

India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan’s Powerchip. The second fab will be a joint investment between CG Power, Japan’s Renesas Electronics, and Thailand’s Stars Microelectronics. Tata will run the packaging facility, as well. India expects these efforts will add 20,000 advanced technology jobs and 60,000 indirect jobs, according to the Times of India. The country has been talking about building a fab for at least the past couple of decades, but funding never materialized.

The U.S. Department of Commerce (DoC) issued a CHIPS Act-based Notice of Funding Opportunity for R&D to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. The U.S. Secretary of Commerce said the government is prioritizing CHIPS Act funding for projects that will be operational by 2030 and anticipates America will produce 20% of the world’s leading-edge logic chips by the end of the decade.

The top three foundries plan to implement backside power delivery as soon as the 2nm node, setting the stage for faster and more efficient switching in chips, reduced routing congestion, and lower noise across multiple metal layers. But this novel approach to optimizing logic performance depends on advances in lithography, etching, polishing, and bonding processes.

Intel spun out Altera as a standalone FPGA company, the culmination of a rebranding and reorganization of its former Programmable Solutions Group. The move follows Intel’s decision to keep Intel Foundry at arm’s length, with a clean line between the foundry and the company’s processor business.

Multiple new hardware micro-architecture vulnerabilities were published in the latest Common Weakness Enumeration release this week, all related to transient execution (CWE 1420-1423).

The U.S. Office of the National Cyber Director (ONCD) published a technical report calling for the adoption of memory safe programming languages, aiming to reduce the attack surface in cyberspace and anticipate systemic security risk with better diagnostics. The DoC also is seeking information ahead of an inquiry into Chinese-made connected vehicles “to understand the extent of the technology in these cars that can capture wide swaths of data or remotely disable or manipulate connected vehicles.”

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Design and Power
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Design and Power

Micron began mass production of a new high-bandwidth chip for AI. The company said the HBM3E will be a key component in NVIDIA’s H2000 Tensor Core GPUs, set to begin shipping in the second quarter of 2024. HBM is a key component of 2.5D advanced packages.

Samsung developed a 36GB HBM3E 12H DRAM, saying it sets new records for bandwidth. The company achieved this by using advanced thermal compression non-conductive film, which allowed it to cram 12 layers into the area normally taken up by 8. This is a novel way of increasing DRAM density.

Keysight introduced QuantumPro, a design and simulation tool, plus workflow, for quantum computers. It combines five functionalities into the Advanced Design System (ADS) 2024 platform. Keysight also introduced its AI Data Center Test Platform, which includes pre-packaged benchmarking apps and dataset analysis tools.

Synopsys announced a 1.6T Ethernet IP solution, including 1.6T MAC and PCS Ethernet controllers, 224G Ethernet PHY IP, and verification IP.

Tenstorrent, Japan’s Leading-Edge Semiconductor Technology Center (LSTC) , and Rapidus are co-designing AI chips. LSTC will use Tenstorrent’s RISC-V and Chiplet IP for its forthcoming edge 2nm AI accelerator.

This week’s Systems and Design newsletter features these top stories:

• 2.5D Integration: Big Chip Or Small PCB: Defining whether a 5D device is a PCB shrunk to fit into a package or a chip that extends beyond the limits of a single die can have significant design consequences.
• Commercial Chiplets: Challenges of establishing a commercial chiplet.
• Accellera Preps New Standard For Clock-Domain Crossing: New standard aims to streamline the clock-domain crossing flow.
• Thinking Big: From Chips To Systems: Aart de Geus discusses the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices.
• Integration challenges for RISC-V: Modifying the source code allows for democratization of design, but it adds some hurdles for design teams (video).

Demand for high-end AI servers is driven by four American companies, which will account for 60% of global demand in 2024, according to Trendforce. NVIDIA is projected to continue leading the market, with AMD closing the gap due its lower cost model.

The EU consortium PREVAIL is accepting design proposals as it seeks to develop next-gen edge-AI technologies. Anchors include CEA-Leti, Fraunhofer-Gesellschaft, imec, and VTT, which will use their 300mm fabrication, design, and test facilities to validate prototypes.

Siemens joined an initiative to expand educational opportunities in the semiconductor space around the world. The Semiconductor Education Alliance was launched by Arm in 2023 and focuses on helping teach skills in IC design and EDA.

Q-CTRL announced partnerships with six firms that it says will expand access to its performance-management software and quantum technologies. Wolfram, Aqarios, and qBraid will integrate Q-CTRL’s Fire Opal technology into their products, while Qblox, Keysight, and Quantware will utilize Q-CTRL’s Boulder Opal hardware system.

NTT, Red Hat, NVIDIA, and Fujitsu teamed up to provide data pipeline acceleration and contain orchestration technologies targeted at real-time AI analysis of massive data sets at the edge.

Manufacturing and Test

The U.S. Department of Energy (DOE)’s Office of Electricity launched the American-Made Silicon Carbide (SiC)  Packaging Prize. This $2.25 million contest invites competitors to propose, design, build, and test state-of-the-art SiC semiconductor packaging prototypes.

Applied Materials introduced products and solutions for patterning issues in the “angstrom era,” including line edge roughness, tip-to-tip spacing limitations, bridge defects, and edge placement errors.

imec reported progress made in EUV processes, masks and metrology in preparation for high-NA EUV. It also identified advanced node lithography and etch related processes that contribute the most to direct emissions of CO2, along with proposed solutions.

proteanTecs will participate in the Arm Total Design ecosystem, which now includes more than 20 companies united around a charter to accelerate and simplify the development of custom SoCs based on Arm Neoverse compute subsystems.

NikkeiAsia took an in-depth look at Japan’s semiconductor ecosystem and concluded it is ripe for revival with investments from TSMC, Samsung, and Micron, among others. TrendForce came to a similar conclusion, pointing to the fast pace of Japan’s resurgence, including the opening of TSMC’s fab.

‍FormFactor closed its sale of its Suzhou and Shanghai companies to Grand Junction Semiconductor for $25M in cash.

The eBeam Initiative celebrated its 15th anniversary and welcomed a new member, FUJIFILM. The group also uncorked its fourth survey of its members technology using deep learning in the photomask-to-wafer manufacturing flow.

Automotive

Apple shuttered its electric car project after 10 years of development. The chaotic effort cost the company billions of dollars, according to The New York Times.

Infineon released new automotive programmable SoCs with fifth-gen human machine interface (HMI) technology, offering improved sensitivity in three packages. The MCU offers up to 84 GPIOs and 384 KB of flash memory. The company also released automotive and industrial-grade 750V G1 discrete SiC MOSFETs aimed at applications such as EV charging, onboard chargers, DC-DC converters, energy, solid state circuit breakers, and data centers.

Cadence expanded its Tensilica IP portfolio to boost computation for automotive sensor fusion applications. Vision, radar, lidar, and AI processing are combined in a single DSP for multi-modal, sensor-based system designs.

Ansys will continue translating fast computing into fast cars, as the company’s partnership with Oracle Red Bull Racing was renewed. The Formula 1 team uses Ansys technology to improve car aerodynamics and ensure the safety of its vehicles.

Lazer Sport adopted Siemens’ Xcelerator portfolio to connect 3D design with 3D printing for prototyping and digital simulation of its sustainable KinetiCore cycling helmet.

The chair of the U.S. Federal Communications Commission (FCC) suggested automakers that sell internet-connected cars should be subject to a telecommunications law aiming to protect domestic violence survivors, reports CNBC. This is due to emerging cases of stalking through vehicle location tracking technology and remote control of functions like locking doors or honking the horn.

BYD‘s CEO said the company does not plan to enter the U.S. market because it is complicated and electrification has slowed down, reports Yahoo Finance. Meanwhile, the first shipment of BYD vehicles arrived in Europe, according to DW News.

Ascent Solar Technologies’ solar module products will fly on NASA’s upcoming Lightweight Integrated Solar Array and AnTenna (LISA-T) mission.

Security

Researchers at Texas A&M University and the University of Delaware proposed the first red-team attack on graph neural network (GNN)-based techniques in hardware security.

A panel of four experts discuss mounting concerns over quantum security, auto architectures, and supply chain resiliency.

Synopsys released its ninth annual Open Source Security and Risk Analysis report, finding that 74% of code bases contained high-risk open-source vulnerabilities, up 54% since last year.

President Biden issued an executive order to prevent the large-scale transfer of Americans’ personal data to countries of concern. Types of data include genomic, biometric, personal health, geolocation, financial, and other personally identifiable information, which bad actors can use to track and scam Americans.

The National Institute of Standards and Technology (NIST) released Cybersecurity Framework (CSF) 2.0 to provide a comprehensive view for managing cybersecurity risk.

The EU Agency for Cybersecurity (ENISA) published a study on best practices for cyber crisis management, saying the geopolitical situation continues to impact the cyber threat landscape and planning for threats and incidents is vital for crisis management.

The U.S. Department of Energy (DOE) announced $45 million to protect the energy sector from cyberattacks.

The National Security Agency (NSA), the Federal Bureau of Investigation (FBI), and others published an advisory on Russian cyber actors using compromised routers.  Also the Cybersecurity and Infrastructure Security Agency (CISA), the UK National Cyber Security Centre (NCSC), and partners advised of tactics used by Russian Foreign Intelligence Service cyber actors to gain initial access into a cloud environment.

CISA, the FBI, and the Department of Health and Human Services (HHS) updated an advisory concerning the ALPHV Blackcat ransomware as a service (RaaS), which primarily targets the healthcare sector.

CISA also published a guide to support university cybersecurity clinics and issued other alerts.

Pervasive Computing and AI

Renesas expanded its RZ family of MPUs with a single-chip AI accelerator that offers 10 TOPS per watt power efficiency and delivers AI inference performance of up to 80 TOPS without a cooling fan. The chip is aimed at next-gen robotics with vision AI and real-time control.

Infineon launched dual-phase power modules to help data centers meet the power demands of AI GPU platforms. The company also released a family of solid-state isolators to deliver faster switching with up to 70% lower power dissipation.

Fig. 1: Infineon’s dual phase power modules: Source: Infineon

Amber Semiconductor announced a reference design for brushless motor applications using its AC to DC conversion semiconductor system to power ST‘s STM32 MCUs.

Micron released its universal flash storage (UFS) 4.0 package at just 9×13 mm, built on 232-layer 3D NAND and offering up to 1 terabyte capacity to enable next-gen phone designs and larger batteries.

LG and Meta teamed up to develop extended reality (XR) products, content, services, and platforms within the virtual space.

Microsoft and Mistral AI partnered to accelerate AI innovation and to develop and deploy Mistral’s next-gen large language models (LLMs).

Microsoft’s vice chair and president announced the company’s AI access principles, governing how it will operate AI datacenter infrastructure and other AI assets around the world.

Singtel and VMware partnered to enable enterprises to manage their connectivity and cloud infrastructure through the Singtel Paragon platform for 5G and edge cloud.

Keysight was selected as the Test Partner for the Deutsche Telekom Satellite NB-IoT Early Adopter Program, providing an end-to-end NB-IoT NTN testbed that allows designers and developers to validate reference designs for solutions using 3GPP Release 17 (Rel-17) NTN standards.

Global server shipments are predicted to increase by 2.05% in 2024, with AI servers accounting for about 12%, reports TrendForce. Also, the smartphone camera lens market is expected to rebound in 2024 with 3.8% growth driven by AI-smartphones, to reach about 4.22 billion units, reports TrendForce.

Yole released a smartphone camera comparison report with a focus on iPhone evolution and analysis of the structure, design, and teardown of each camera module, along with the CIS dimensions, technology node, and manufacturing processes.

Counterpoint released a number of 2023 reports on smartphone shipments by country and operator migrations to 5G.

Events

Find upcoming chip industry events here, including:

Upcoming webinars are here, including topics such as digital twins, power challenges in data centers, and designing for 112G interface compliance.

Further Reading and Newsletters

Read the latest special reports and top stories, or check out the latest newsletters:

Systems and Design
Low Power-High Performance
Test, Measurement and Analytics
Manufacturing, Packaging and Materials
Automotive, Security and Pervasive Computing

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